This application is based upon and claims the benefit of priority from Japanese Patent Applications No. 2015-027431, filed on Feb. 16, 2015, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a method for estimating a lifetime of a cathode in an electron beam lithography apparatus. The embodiment relates to a method for estimating a lifetime of a cathode, for example, used for an electron beam lithography apparatus that irradiates a target object with a predetermined dose of an electron beam so as to write a pattern.
A lithography technique leads development of miniaturization of semiconductor devices. The lithography technique is an important process that generates a pattern, such as a circuit pattern. Recently, as LSIs have been highly integrated, a circuit pattern linewidth required for the semiconductor devices has been miniaturized year by year. A high-precision original pattern (also referred to as a “reticle” or a “mask”) is required in order to form a desired circuit pattern to the semiconductor devices. A lithography technique with a charged particle beam (charged particle ray) using charged particles, such as electrons, has essentially excellent resolution. The lithography technique is used so as to manufacture high-precision original patterns.
It is necessary to increase current density of the beam in order to improve throughput of the electron beam lithography apparatus. It is necessary to set a cathode temperature of an electron gun assembly to a high temperature in order to achieve the large current density. However, if the cathode is set to the high temperature, since an evaporation speed of a cathode material increases, a top end shape of the cathode varies while writing. Therefore, a lifetime of the cathode can be preferably estimated in order to perform writing with high-precision.
A method for estimating a lifetime of a cathode in an electron beam lithography apparatus according to an embodiment, includes: calculating emittance of the cathode by using a lifetime reference value of the cathode; calculating an emitter lifetime diameter of the cathode by using the emittance; writing a pattern on a target object by using an electron beam emitted from the cathode; measuring emission current of the electron beam; calculating an emitter diameter by using the emission current; determining a regression formula of a change with time of the emitter diameter; and estimating the lifetime of the cathode by using the regression formula and the emitter lifetime diameter.
An embodiment of the present disclosure will be described with reference to the drawings.
Note that, in the following descriptions, “on a target object” represents on-a-surface of the target object, the surface being irradiated with an electron beam.
A method for estimating a lifetime of a cathode in an electron beam lithography apparatus according to the present embodiment, includes: calculating emittance of the cathode by using a lifetime reference value of the cathode; calculating an emitter lifetime diameter of the cathode by using the emittance; writing a pattern on a target object by using an electron beam emitted from the cathode; measuring emission current of the electron beam; calculating an emitter diameter by using the emission current; determining a regression formula of a change with time of the emitter diameter; and estimating the lifetime of the cathode by using the regression formula and the emitter lifetime diameter.
According to the following embodiment, a variable-shaped electron beam lithography apparatus will be described as an exemplary electron beam lithography apparatus.
The first controller 160 has an electron gun assembly power source 230 and a pattern writing control circuit 240. A constant current source 231 supplies a predetermined heating current to both poles of the emitter 222 inside the electron gun assembly power source 230. A variable voltage source 234 applies a predetermined bias voltage (Wehnelt voltage) between the Wehnelt electrode 224 and an intermediate voltage between the poles of the emitter 222. One end of a predetermined direct current power source is disposed at the intermediate voltage between the poles of the emitter 222, in parallel with the variable voltage source 234. The other end of the direct current power source is grounded through an ammeter 238. A voltmeter 236 is disposed in parallel with the variable voltage source 234. A current density measuring unit 242 and a proportional-integral-derivative (PID) controller 244 are disposed in the pattern writing control circuit 240. The PID control is control based on the amount of correction proportional to deviation from a target value, the amount of correction acquired by integrating deviation from a previous target value, and the amount of correction acquired by differentiating time variation of the deviation from the target value. In
Inside the electron gun assembly power source 230, a second controller 232 detects, by the voltmeter 236, and performs variable control to the bias voltage (Wehnelt voltage) applied from the variable voltage source 234 so as to control to acquire emission current to be targeted. The ammeter 238 can detect a value of the emission current.
The electron gun assembly 201 emits the electron beam 200. The entire first forming aperture plate 203 having a quadrilateral, for example, a rectangular hole, is illuminated, through the illumination lens 202, by the electron beam 200 emitted from the electron gun assembly 201. The electron beam 200 is formed so as to be quadrilateral, for example, rectangular. The forming lens 204 projects the electron beam 200 of a first aperture plate image that has passed through the first forming aperture plate 203, on the second forming aperture plate 206. The forming deflector 205 performs deflection control to a position of the first aperture plate image on the second forming aperture plate 206. Therefore, a shape and dimensions of the beam can be varied. As a result, the electron beam 200 is formed. The electron beam 200 of a second aperture plate image that has passed through the second forming aperture plate 206, is reduced through the reducing lens 216. Then, the electron beam 200 is focused through the objective lens 207 so as to be deflected by the main deflector 214 and the sub-deflector 212. As a result, a desired position on the target object 340 on the XY stage 105 that continuously moves is irradiated with the electron beam 200.
In a case where the electron beam 200 on the target object 340 satisfies beam irradiation time Δt during which a desired dose is incident on the target object 340, blanking is performed as follows: In order to prevent the target object 340 from being irradiated with the electron beam 200 more than necessary, for example, the electrostatic BLK deflector 218 deflects the electron beam 200 and also the BLK aperture plate 219 cuts off the electron beam 200. Accordingly, the electron beam 200 is prevented from reaching the surface of the target object 340. The pattern writing control circuit 240 controls a deflecting voltage of the BLK deflector 218. A vacuum pump (not illustrated) forms vacuums inside the electron optical column 102 and inside the pattern writing chamber 103. Thus, vacuum atmosphere in which pressure is lower than the atmospheric pressure, is provided.
Next, a mechanism for controlling current density J of the electron beam so as to be substantially constant during writing, and a method for controlling the current density J of the electron beam so as to be substantially constant during the writing, included in the electron beam lithography apparatus according to the present embodiment, will be described. First, while a desired pattern is written on the target object 340, the current density J is measured a plurality of times. A target value of the emission current Ie for correcting and converging a variation of the current density J into a desired constant value, is calculated each of the plurality of times. The target value is output to the electron gun assembly power source 230. The variable control is performed to the bias voltage in the electron gun assembly power source 230 during the writing so that the emission current Ie comes close to the target value. With this configuration, during the writing, the current density J can be maintained so as to be substantially constant.
At S (step) 102, as a beam irradiating process, the electron gun assembly 201 emits the electron beam 200 in which the emission current Ie is set to the target value. The electron gun assembly 201 is an example of irradiation sources.
At S104, as a current density measuring process, the current density measuring unit 242 measures the current density J of the electron beam 200 every time steps illustrated in
In the above example, the current density J is calculated from the entire beam that has been passed through the first forming aperture plate 203. The present disclosure is not limited to this. For example, the first forming aperture plate 203 and the second forming aperture plate 206 form a beam, for example, having an area of 1 square μm. Then, the Faraday cup 209 may measure the beam that has been formed. The current density J can be acquired by dividing a beam current value by the area that has been formed. As described above, determining the area to be formed in advance can measure the current density J.
At S106, as a target emission current calculating process, every time the current density J of the electron beam 200 is measured, the PID controller 244 calculates the target value of the emission current Ie that varies depending on the current density J of the electron beam 200 that has been measured, so that the current density J of the electron beam 200 becomes substantially constant. Every time the calculation is performed, the target value of the emission current Ie is output to the second controller 232. The PID controller 244 uses a PID method and calculates the target value of the emission current Ie so that the current density J converges in a constant value.
At S108, as a target emission current setting process, the second controller 232 inputs the target value of the emission current Ie so as to reset instead of a value that has been set.
At S110, as a bias voltage variable control process, the second controller 232 controls the electron gun assembly 201 based on the new target value of the emission current Ie.
At S112, as a determining process, it is determined whether the writing has been completed. In a case where the writing is still performed, the processing goes back to S102. As described above, for example, every 10 to 30 minutes, the series of processes from S102 to S112 is repeated. Accordingly, while the writing is performed on the target object 340 by using the electron beam 200, the current density J of the electron beam 200 is measured a plurality of times. Every time the measurement is performed, the target value of the emission current Ie is varied. When the writing is completed, the processing is completed. Otherwise, the above current density adjustment is preferably periodically performed for writing on a next target object 340 even when the writing is not performed. Accordingly, the current density J can be continuously kept substantially constant.
In the above example, a configuration in which the PID controller 244 calculates the target value of the emission current Ie so that the current density J of the electron beam 200 becomes substantially constant, has been given. The present disclosure is not limited to this. For example, a target value of the bias voltage VB is preferably calculated so as to be output. In this case, there may be provided a configuration in which output of the variable voltage source 234 is varied so as to be equal to the target value of the bias voltage VB input by the second controller 232.
Next, a method for estimating a lifetime of the cathode in the electron beam lithography apparatus according to the present embodiment, will be described.
Note that, according to the embodiment of the present disclosure, materials can be used other than lanthanum hexaboride (LaB6) as a material included in the emitter 222. The material included in the emitter 222 is required to have high electric conduction, mechanical strength and chemical stability at a high temperature. A material having a high melting point can achieve the mechanical strength and the chemical stability at the high temperature. Note that, more specifically, the high melting point is defined as a high melting point higher than an operating temperature of the electron beam lithography apparatus. Materials that satisfy the above properties and that have a low work function similar to that of lanthanum hexaboride (LaB6), include metal hexaboride, such as cerium hexaboride (CeB6), gadolinium hexaboride (GdB6), and yttrium hexaboride (YB6). For example, tungsten (W) can be also used as a material included in the emitter 222. Since tungsten (W) has a melting point higher than those of lanthanum hexaboride (LaB6) and cerium hexaboride (CeB6), for example, tungsten (W) can be used at, for example, a temperature of 2000 K.
As the cathode 220 is used, since a part of the material included in the cathode 220 evaporates, the diameter of the emitter surface 6 (refer to
n=J(Rn)/J(0) (1)
The uniformity n of the beam is an example of a lifetime reference value of the cathode 220. If the uniformity n of the beam falls below a certain reference value, the cathode 220 is defined so as to be the end of lifetime thereof. For example, n is preferably in a range between 0.95 and 0.99. In the following descriptions, n is defined as 0.98.
In a case where the distribution of the electron beam 200 is a Gaussian distribution, and in a case where R is defined as a distance from the electron beam center 262 on the target object 340 and J0 is defined as a constant, current density J(R) of the electron beam 200 can be expressed by the following expression.
J(R)=J0exp(−R2/Re2) (2)
Here, Re is defined as a radius of the electron beam 200 with which the number of electrons per unit time becomes the number of electrons per unit time at the electron beam center 262 in the electron beam 200, multiplied by 1/e (e is defined as the base of a natural logarithm) on the target object 340 as illustrated in
n=exp(−Rn2/Re2) (3)
In a case where the shape of the shot 264 is rectangular illustrated in
R
n=1/2(Wn2+Hn2)0.5 (4)
Thus, Re is expressed by the following expression (5) with expression (3) and expression (4).
Next, emittance of the cathode 220 will be described. The emittance of the cathode 220 is defined as an amount of a spread of the electron beam 200 emitted from the cathode 220. Here, a diameter of a guide of the spread of the electron beam 200 is expressed as 2Re using the above Re. Here, Ae is defined as an angle at which the number of electrons per unit time becomes the number of electrons per unit time at the electron beam center in the electron beam 200 (A=0)262 multiplied by 1/e (e is defined as the base of a natural logarithm) on the target object 340 as illustrated in
Emittance=4ReAe (6)
The emittance is expressed by the following expression (7) with expression (5) and expression (6).
In a case where the shape of the shot 264 is square, namely, Wn=Hn is satisfied, the emittance is expressed by the following expression (8).
First, the first controller 160 or an operator determines the uniformity n of the electron beam 200 at the beam uniformity determining process (S202). For example, a data storage unit 254 stores the uniformity n of the beam, the uniformity n having been determined.
Next, at the emittance calculating process (S204), the operator or the first controller 160 uses a first calculator 246 so as to calculate the emittance of the cathode by, for example, expression (6), expression (7), or expression (8), using n that has been determined at the beam uniformity determining process (S202). Here, for example, then that has been stored in the data storage unit 254, can be used as the uniformity n of the beam.
Next, at the emitter lifetime diameter calculating process (S206), the operator or the first controller 160 uses a second calculator 248 so as to calculate an emitter lifetime diameter of the cathode 220 by, for example, using the relationship illustrated in
Next, at the writing process (S208), the first controller 160 writes a pattern on the target object 340 using the electron beam 200 emitted from the cathode 220.
Next, at the emission current measuring process (S210), the operator or the first controller 160 uses the ammeter 238 so as to measure emission current Ie of the electron beam 200.
Next, at the emitter diameter calculating process (S212), the operator or the first controller 160 uses a third calculator 250 so as to calculate an emitter diameter d with the emission current Ie measured at the emission current measuring process (S210). In the electron beam lithography apparatus according to the present embodiment, current density J can be controlled to be constant. In this case, a relationship between the emission current Ie, the current density J, and the emitter diameter d, can be expressed by the following expression (9). Therefore, the emitter diameter d can be calculated.
Next, at the change-with-time regression formula determining process (S214), the operator or the first controller 160 uses a processing unit 256 and, for example, plots a change with time of the emitter diameter d calculated at the emitter diameter calculating process (S212). Then, a regression formula of the change with time is determined.
Next, at the lifetime estimating process (S216), the operator or the first controller 160 uses a fourth calculator 252 so as to estimate the lifetime of the cathode 220 using the regression formula acquired at the change-with-time regression formula determining process (S214) and the emitter lifetime diameter calculated at the emitter lifetime diameter calculating process (S206).
Upon operation of the electron beam lithography apparatus, estimating the lifetime of the cathode is preferable for maintenance of the electron beam lithography apparatus, including replacement of the cathode. The method for estimating the lifetime of the cathode in the electron beam lithography apparatus according to the present embodiment, can quantitatively estimate the lifetime of the cathode. In particular, as illustrated in
The method for estimating the lifetime of the cathode in the electron beam lithography apparatus according to the present embodiment, can provides a method for estimating a lifetime of a cathode of an electron beam lithography apparatus, capable of performing quantitative estimation.
In the above descriptions, pieces of processing of functions of the first controller 160, the second controller 232, the current density measuring unit 242, the PID controller 244, the first calculator 246, the second calculator 248, the third calculator 250, the fourth calculator 252, and the processing unit 256, may be performed by software in a control calculator including a computer. Hardware of an electrical circuit may perform the pieces of processing of functions. A combination of the hardware of an electrical circuit and the software may perform the pieces of processing of functions. A combination of the hardware and firmware may be used. With a configuration of the software, a program is stored in a recording medium (not illustrated), such as a magnetic disk drive, a magnetic tape drive, a FD, or a read only memory (ROM). In that case, the control calculator may be coupled, via a bus, to a random access memory (RAM), the ROM, the magnetic disk (HD) drive, as an example of a data storage device (data storage unit), a keyboard (K/B), a mouse, as an example of an input unit, a monitor, a printer, as an example of an output unit, an external interface (I/F), a FD, a DVD, or a CD, as an example of an input-and-output unit.
According to the embodiment, parts, such as configurations, that are not directly necessary for describing the present disclosure, have been omitted. For example, a necessary configuration can be appropriately selected and used. With an element according to the present disclosure, a method for estimating a lifetime of a cathode in an electron beam lithography apparatus, appropriately changed and designed by a person skilled in the art, is included in the scope of the present disclosure. The scope of the present disclosure is defined by the scope of the claims and the scope of equivalents of the claims.
Number | Date | Country | Kind |
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2015-027431 | Feb 2015 | JP | national |