Claims
- 1. A method for connecting a metal pin and a ceramic substrate comprising:
- forming a hole in a ceramic substrate large enough to receive the pin therein;
- inserting a pin in the hole so that a first portion of the pin extends outwrad from one side of the substrate and a second portion of the pin extends outward from another side of the substrate;
- restricting the axial movement of the pin by applying to the first portion of the pin restricting means for impeding the movement;
- resiliently supporting an anvil member in contact with the end of the first portion of the pin;
- adapting the resilient support to resist axial movement of the anvil member and pin due to the effect of a striking force;
- locating a hammer adjacent the end of the second portion of the pin;
- providing a fixed amount of energy to the hammer to be applied to the end of the second portion of the pin; and
- striking the end of the second portion of the pin with the hammer to produce a compressive stress in the pin exceeding the compression elastic limit of the pin and a tensile stress in the substrate less than the tensile stength of the sustrate, thereby causing permanent radial expansion of the pin against the surface of the hole in the substrate.
- 2. A method for connecting a metal pin and a ceramic substrate comprising:
- forming a hole in a ceramic substrate large enough to receive the pin therein;
- inserting a pin in the hole so that only a first portion of the pin extends outward from one side of the substrate and a second portion of the pin extends outwrd from another sie of the substrate;
- restricting axial movement of the pin by applying to the first portion of the pin restricting means for impeding the movement;
- locating a hammer adjacent the end of the second portion of the pin;
- aligning the hammer for movement toward the end of the second portion of the pin;
- connecting a stretched elastic band to the hammer, thereby resiliently biasing the hammer toward the end of the second portion of the pin; and
- allowing the hammer to strike the second portion of the pin to produce a compressive stress in the pin exceeding the compression elastic limit of the pin and a tensile stress in the substrate less than the tensile strength of the substrate, thereby causing permanent radial expansion of the pin against the surface of the hole in the substrate.
- 3. The method of claim 2 wherein the first portion of the pin is unflanged.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 458,375, filed 1/17/83 which is a continuation of application Ser. No. 223,190, filed 1/7/81, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
891180 |
Jan 1972 |
CAX |
Non-Patent Literature Citations (1)
Entry |
IBM Tech. Discl. Bull., vol. 9, No. 4, Sep. 1966, p. 365, by Byrnes. |
Continuations (1)
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Number |
Date |
Country |
Parent |
223190 |
Jan 1981 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
458375 |
Jan 1983 |
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