The present application claims benefit of priority under 35 U.S.C. ยงยง 120, 365 to the previously filed Japanese Patent Application No. JP2018-199761 with a priority date of Oct. 24, 2018, which is incorporated by reference herein.
The present invention relates to chassis members in general, and in particular to a chassis member used in a chassis of an electronic apparatus.
Chassis of various electronic apparatuses, such as laptop personal computers (PCs), tablet PCs, and smart phones, are required to be lightweight, thin, and high-strength. Typically, a plate-like fiber-reinforced resin member made of reinforced fiber such as carbon fiber impregnated with matrix resin are be used in the chassis of electronic apparatuses.
For conventional chassis members, thermosetting resin is used in the matrix resin of fiber-reinforced resin plates. Thus, after hardening, it is very difficult to squash the edge of the fiber-reinforced resin plates in order to provide the joint on the edge, which is necessary to form the joint at the same time as formation of the fiber-reinforced resin plates. Therefore, the configuration of a conventional chassis member is low in manufacturing efficiency and mass productivity because it is not possible to use a manufacturing procedure in which, for example, a large-sized laminate is formed, and a set of fiber-reinforced resin plates in the shape of products is cut out from this laminate, and a frame body is then joined to the cut laminate.
Consequently, it would be desirable to provide a chassis member capable of improving the manufacturing efficiency while ensuring the joining strength of a frame body and a laminate.
In accordance with an embodiment of the present disclosure, a chassis member includes a laminate in which an interlayer is provided between at least a pair of fiber-reinforced resin plates made of reinforced fiber impregnated with thermoplastic resin; and a frame body that is formed of thermoplastic resin, and is joined to an edge of the laminate. The edge of the laminate is provided with a thin plate portion thinner than the other portion, and the frame body is joined to the thin plate portion.
All features and advantages of the present disclosure will become apparent in the following detailed written description.
The invention itself, as well as a preferred mode of use, further objects, and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying drawings, wherein:
As shown in
The lid body 14 includes the chassis 12 having a back cover 12a and a front cover 12b. The back cover 12a is a cover member that covers the sides and back of the lid body 14, and is formed of the chassis member 10 according to the present embodiment. The front cover 12b is a plastic cover member that covers the front of the lid body 14 together with the display device 22. A pair of right and left antennas 26 and 26 is provided on near a top end of the inside of the chassis 12. Each antenna 26 is used to send and receive radio waves for wireless communication, etc., and is provided in a position that overlaps with a frame body 36 to be described later.
Subsequently, a configuration of the back cover 12a using the chassis member 10 is described specifically.
As shown in
Subsequently, a specific configuration of the chassis member 10 is described.
As shown in
The fiber-reinforced resin plates 30 and 31 are made of prepreg that contains reinforced fiber impregnated with matrix resin or a laminate of the prepreg. The fiber-reinforced resin plates 30 and 31 in the present embodiment use carbon fiber as the reinforced fiber and thermoplastic epoxy resin as the matrix resin. That is, the fiber-reinforced resin plates 30 and 31 in the present embodiment are so-called carbon fiber reinforced thermo plastics (CFRTP). As the reinforced fiber, various materials other than carbon fiber, for example, metallic fiber such as stainless fiber, inorganic fiber such as glass fiber, etc. may be used.
Thermoplastic resin forming the matrix resin includes, for example, polyolefin such as thermoplastic epoxy resin, polyethylene (PE), polypropylene (PP), and polybutylene, styrene-based resin such as polystyrene (PS), acrylonitrile-butadiene-styrene copolymer (ABS), and acrylonitrile-styrene copolymer (AS), polyester such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), and liquid crystalline polyester, fluorine-based resin such as polyoxymethylene (POM), polyamide (PA), polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), polyphenylene ether (PPE), modified PPE, thermoplastic polyimide (PI), polyamide-imide (PAI), polyetherimide (PEI), polysulfone (PSU), modified PSU, polyether sulfone (PES), polyketone (PK), polyether ketone (PEK), polyetheretherketone (PEEK), polyether ketone ketone (PEKK), polyarylate (PAR), polyether nitrile (PEN), thermoplastic phenolic-based resin, phenoxy resin, epoxy resin, and polytetrafluoroethylene (PTFE), thermoplastic elastomer such as polystyrene series, polyolefin series, polyurethane series, polyester series, polyamide series, polybutadiene series, polyisoprene series, and fluorine series, etc., and copolymers and modified forms of these, mixtures of two or more of these, and polymer alloy.
In general, epoxy resin is a typical material of thermosetting resin; however, there is thermoplastic epoxy resin that exhibits thermoplasticity idiosyncratically after hardened by a special catalyst and has high resistance to impact and high toughness. Therefore, the fiber-reinforced resin plates 30 and 31 in the present embodiment use carbon fiber impregnated with thermoplastic epoxy resin.
The interlayer 32 is a soft spacer that is provided between the fiber-reinforced resin plates 30 and 31 to leave a space between them. By providing the interlayer 32, the section modulus of the laminate 34 in a plate thickness direction is increased, and a lightweight and high-strength structure is obtained. As shown in
In the foam layer portion 32a, a bead-like foam material 32c is added to a resin material that is a base material. In a case of the present embodiment, the foam material 32c is foam glass beads that are thin glass beads with air filled in their internal space. The compressed layer portion 32b has a same structure as the foam layer portion 32a except that the glass beads are squashed, and is formed mostly of only the resin material that is a base material because the foam material 32c is squashed unlike the foam layer portion 32a. The resin material forming the foam layer portion 32a and the compressed layer portion 32b may be similar thermoplastic resin to the above-described matrix resin of the fiber-reinforced resin plates 30 and 31.
As shown in
As shown in
The frame body 36 is provided to be in contact with the inner surface 41 of the thin plate portion 34b recessed from the thick plate portion 34a of the laminate 34 to the side of the outer surface 40. A surface 36a of the frame body 36 is set to be on the same level as the inner surface 41 of the thick plate portion 34a. The surface 36a of the frame body 36 may be set in a position recessed lower to the side of the outer surface 40 than the inner surface 41 of the thick plate portion 34a. As a result, as indicated by an alternate long and two short dashes line in
The frame body 36 is provided to fill a space of the recess of the thin plate portion 34b from the thick plate portion 34a in this way, and is joined to the laminate 34 on a larger contact area (joining area). Thus, the laminate 34 and the frame body 36 are joined with high joining strength.
Subsequently, an example of a method for manufacturing the chassis member 10 is described.
As shown in
Subsequently, as shown in
Here, respective base materials of the fiber-reinforced resin plates 30 and 31 and the interlayer 32 of the laminate 34 are all formed of thermoplastic resin, and therefore are softened by the application of heat. Then, at the edge of the laminate 34, the interlayer 32 is squashed between the fiber-reinforced resin plates 30 and 31, and the fiber-reinforced resin plate 31 is deformed, thereby the thin plate portion 34b and the bent portion 34c are formed. At that time, in the interlayer 32 of the thin plate portion 34b, the foam material 32c is broken and squashed. At the same time, the resin base material of the interlayer 32 is compressed between the fiber-reinforced resin plates 30 and 31, and some of the resin material forms the compressed layer portion 32b, and the other is pushed out to the side of the foam layer portion 32a or the side of the cavity space 44a. As a result, the frame body 36 is joined to the laminate 34, and, at the same time, the thin plate portion 34b and the bent portion 34c are formed, thus the manufacture of the chassis member 10 is completed.
Subsequently, an example of another method for manufacturing the chassis member 10 is described.
Also in this manufacturing method, first, the laminate 34 shown in
Next, as shown in
It is to be noted that
As described above, in the chassis member 10 (10A) according to the present embodiment, the thin plate portion 34b thinner than the other portion is provided on the edge of the laminate 34, and the frame body 36 is joined to this thin plate portion 34b.
Therefore, in the chassis member 10 (10A), the contact area of the frame body 36 with the laminate 34 is large, and the joining strength of the two is high. Besides, in the chassis member 10 (10A), thermoplastic resin is used in the matrix resin of the fiber-reinforced resin plates 30 and 31 included in the laminate 34. Thus, as in the respective manufacturing methods described above, even if the laminate 34 not provided with the thin plate portion 34b shown in
In the chassis member 10 (10A), the interlayer 32 added with the bead-like foam material 32c is used in the resin material. Thus, when the interlayer 32 is heated at the time of formation of the thin plate portion 34b, the foam material 32c can be maintained in a stable state with little expansion, etc. due to the application of heat, and the foam layer portion 32a and the compressed layer portion 32b are each stable in a desired shape. In particular, in the present embodiment, foam glass beads are used as the foam material 32c; therefore, the stability of the foam material 32c when heated is even more high, and the foam material 32c is certainly squashed when compressed, and the thin plate portion 34b can be formed. Furthermore, if the foam material 32c of the compressed layer portion 32b is certainly squashed, the inside of the compressed layer portion 32b is only the resin base material, and thus is made hard. Then, the resin material forming the frame body 36 is prevented from entering from an end surface of the edge into the compressed layer portion 32b, and the shape of the interlayer 32 including the compressed layer portion 32b is further stabilized. It is to be noted that in a case where the foam material 32c is formed of not bead-like but porous resin material including a mere air layer, when the foam material 32c is heated to be squashed, the air layer is not stable, and is expanded and contracted, which may cause shape defects, etc. of the foam layer portion 32a and the compressed layer portion 32b after molding.
A resin material 34d indicated by an alternate long and two short dashes line in
It is to be noted that needless to say, the present invention is not limited to the above-described embodiment, and modifications can be freely made without departing from the scope of the present invention. For example, in the above-described embodiment, there is provided an example where the chassis member 10 (10A, 10B) is used as the chassis 12 of the lid body 14 included in the electronic apparatus 16; however, the chassis member 10 may be used in the apparatus body 20.
As has been described, the present invention provides a chassis member used in a chassis of an electronic apparatus.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Number | Date | Country | Kind |
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JP2018-199761 | Oct 2018 | JP | national |
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Number | Date | Country | |
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20200130336 A1 | Apr 2020 | US |