Claims
- 1. A method of manufacturing electrical circuit devices of the type including a substrate having at least two elements solder-bonded to a common surface thereof comprising the successive steps of:
- (a) screening a solder-flux mixture onto a first area of the substrate surface;
- (b) placing a first element on the screened-on solder-flux mixture;
- (c) fusing the solder-flux mixture to bond the first element to the substrate;
- (d) screening a solder-flux mixture onto a second area of the substrate surface by means of a screen having a covered aperture generally conforming with the first element;
- (e) placing a second element on the screened-on solder-flux mixture on the second area; and
- (f) heating the combination of substance, bonded first element, second element, and latter solder-flux mixture to fuse the latter solder-flux mixture and thereby bond the second element to the substrate.
- 2. A method as defined in claim 1 wherein the first element is a flip chip, the second element is a different element, and the solder-flux mixtures are of different compositions.
CROSS REFERENCE TO ANOTHER PATENT APPLICATION
This patent application is a divisional patent application filed on nonelected claims in United States patent application Ser. No. 843,030, entitled "Method and Apparatus for Screen Printing Solder Paste Onto a Substrate with Device Premounted Thereon," which was filed Mar. 24, 1986. now U.S. Pat. No. 4,678,531
US Referenced Citations (8)
Non-Patent Literature Citations (1)
Entry |
Balents, L. M., "A Metal Mask . . . Thereon," RCA TN No. 978, Sep. 1974, pp. 1-2, Classified in 427/96. |
Divisions (1)
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Number |
Date |
Country |
Parent |
843030 |
Mar 1986 |
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