Number | Date | Country | Kind |
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9700307 | Jan 1997 | SE |
This application claims priority on provision application Ser. No. 60/041,582 filed on Mar. 24, 1997, the entire contents of which are hereby incorporated by reference.
Number | Name | Date | Kind |
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5225495 | Han et al. | Jul 1993 | |
5919402 | Murhphy et al. | Jul 1999 |
Number | Date | Country |
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0187706A2 | Jul 1986 | EP |
0309684A1 | Apr 1989 | EP |
0487857A2 | Jun 1992 | EP |
2346743 | Oct 1977 | FR |
Entry |
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IBM Technical Disclosure Bulletin, vol. 30, No. 6, Anonym, “Method of improving metal adhesion to polymide”, p. 414, Nov. 1987. |
WPI/Derwent's abstract, No. 85-253684, week 8522, Abstract of JP, 60169186, Sep. 2, 1985. |
WPI/Derwent's abstract, No. 80-57740C, week 8025, Abstract of JP, 55086744, Jun. 30, 1980. |
Number | Date | Country | |
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60/041582 | Mar 1997 | US |