Leaded surface mounted device

Industry

CPC
H05K2201/10628

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10628Leaded surface mounted device

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chip packaged battery
- Patent number 12,156,338
- Issue date Nov 26, 2024
- The Johns Hopkins University
- Konstantinos Gerasopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Firing switch for compact capacitive discharge unit
- Patent number 11,927,431
- Issue date Mar 12, 2024
- Northrop Grumman Systems Corporation
- James D. Lucas
- F42 - AMMUNITION BLASTING
Information Patent Grant
Fusing electronic components into three-dimensional objects via add...
- Patent number 11,911,825
- Issue date Feb 27, 2024
- Hewlett-Packard Development Company, L.P.
- Kristopher J. Erickson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of attaching a contact element to a conductive path a conduc...
- Patent number 11,888,279
- Issue date Jan 30, 2024
- TE Connectivity Germany GmbH
- Andre Martin Dressel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and heat dissipator
- Patent number 11,785,703
- Issue date Oct 10, 2023
- Kioxia Corporation
- Kazuya Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanically bridged SMD interconnects for electronic devices
- Patent number 11,744,020
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Kyle Brent Norell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 11,659,664
- Issue date May 23, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting aid and method for mounting electrical components on a pri...
- Patent number 11,357,114
- Issue date Jun 7, 2022
- BorgWarner Ludwigsburg GmbH
- Sisay Tadele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and substrate having the same mounted thereon
- Patent number 11,302,481
- Issue date Apr 12, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Beom Joon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 11,227,776
- Issue date Jan 18, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting system for mechanical-shock resistant printed circuit boar...
- Patent number 11,147,179
- Issue date Oct 12, 2021
- AEROVIRONMENT, INC.
- William John Nicoloff
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Electronic circuit substrate
- Patent number 11,096,285
- Issue date Aug 17, 2021
- HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Kousuke Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for producing an electronic component
- Patent number 11,058,005
- Issue date Jul 6, 2021
- VITESCO TECHNOLOGIES GERMANY GMBH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMD diode taking a runner as body and manufacturing method thereof
- Patent number 11,024,567
- Issue date Jun 1, 2021
- SIYANG GRANDE ELECTRONICS CO., LTD.
- Yunhui Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure for module in electronic device
- Patent number 11,019,733
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Hyung Dal Kim
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,980,124
- Issue date Apr 13, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,912,186
- Issue date Feb 2, 2021
- Mitsubishi Electric Corporation
- Shota Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost superior performance coinless RF power amplifier
- Patent number 10,912,185
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Reginald Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting arrangement and corresponding method for mounting an ele...
- Patent number 10,905,010
- Issue date Jan 26, 2021
- Robert Bosch GmbH
- Helmut Seiband
- G01 - MEASURING TESTING
Information Patent Grant
System and method for minimizing connector pad open-circuit stubs
- Patent number 10,856,414
- Issue date Dec 1, 2020
- Dell Products, L.P.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting a power amplifier (AP) assembly
- Patent number 10,842,028
- Issue date Nov 17, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald Nehring
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards and circuit board assemblies
- Patent number 10,764,994
- Issue date Sep 1, 2020
- Hamilton Sundstrand Corporation
- Tran Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for module in electronic device
- Patent number 10,681,823
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Hyung Dal Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical assemblies for downhole use
- Patent number 10,631,409
- Issue date Apr 21, 2020
- Baker Hughes, a GE company, LLC
- Rocco Difoggio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting system for mechanical-shock resistant printed circuit boar...
- Patent number 10,617,028
- Issue date Apr 7, 2020
- AEROVIRONMENT, INC.
- William John Nicoloff
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Solder component
- Patent number 10,594,061
- Issue date Mar 17, 2020
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with metal terminals and electronic component...
- Patent number 10,395,831
- Issue date Aug 27, 2019
- Taiyo Yuden Co., Ltd.
- Naoki Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,398,030
- Issue date Aug 27, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240412922
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MODULE
- Publication number 20240357746
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE FOR MEDICAL DEVICE
- Publication number 20240277948
- Publication date Aug 22, 2024
- Norton (Waterford) Limited
- James Roche
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20240006403
- Publication date Jan 4, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGED BATTERY
- Publication number 20230262899
- Publication date Aug 17, 2023
- The Johns Hopkins University
- Konstantinos Gerasopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS
- Publication number 20230254975
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICALLY BRIDGED SMD INTERCONNECTS FOR ELECTRONIC DEVICES
- Publication number 20230171894
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Kyle Brent Norell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET
- Publication number 20230156917
- Publication date May 18, 2023
- Amphenol Corporation
- Paul R. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL COMPONENT AND CERAMIC SUBSTRATE
- Publication number 20230134940
- Publication date May 4, 2023
- Shinko Electric Industries Co., Ltd.
- Ayako Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT SUB-MOUNT AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20230128068
- Publication date Apr 27, 2023
- Lextar Electronics Corporation
- Ming-Jing LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND HEAT DISSIPATOR
- Publication number 20220304137
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Kazuya NAGASAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE FOR MEDICAL DEVICE
- Publication number 20220218920
- Publication date Jul 14, 2022
- Norton (Waterford) Limited
- James Roche
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
STEPPED PACKAGE AND RECESSED CIRCUIT BOARD
- Publication number 20220110214
- Publication date Apr 7, 2022
- Intel Corporation
- Martin M. Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220087023
- Publication date Mar 17, 2022
- SEIKO EPSON CORPORATION
- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD ARRANGEMENT, AND CIRCUIT BOARD...
- Publication number 20210329793
- Publication date Oct 21, 2021
- CONTINENTAL AUTOMOTIVE GMBH
- Rafael Del Rey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR CAPACITOR SUBASSEMBLY FOR BACKUP POWER
- Publication number 20210045247
- Publication date Feb 11, 2021
- Intel Corporation
- John Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SUBSTRATE HAVING THE SAME MOUNTED THEREON
- Publication number 20210027946
- Publication date Jan 28, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Beom Joon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Circuit Substrate
- Publication number 20200205290
- Publication date Jun 25, 2020
- Hitachi Automotive Systems, Ltd.
- Kousuke TAKASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
- Publication number 20200100364
- Publication date Mar 26, 2020
- Vitesco Technologies Germany GmbH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method Of Attaching A Contact Element To A Conductive Path A Condu...
- Publication number 20200059056
- Publication date Feb 20, 2020
- TE Connectivity Germany GmbH
- Andre Martin Dressel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190335588
- Publication date Oct 31, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Minimizing Connector Pad Open-Circuit Stubs
- Publication number 20190281698
- Publication date Sep 12, 2019
- DELL PRODUCTS, L.P.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting System for Mechanical-Shock Resistant Printed Circuit Boar...
- Publication number 20190132981
- Publication date May 2, 2019
- AEROVIRONMENT, INC.
- William John Nicoloff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE ASSEMBLY AND ASSEMBLING METHOD THEREOF
- Publication number 20190069438
- Publication date Feb 28, 2019
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Wei Guo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Connecting Arrangement and Corresponding Method for Mounting an Ele...
- Publication number 20180352657
- Publication date Dec 6, 2018
- ROBERT BOSCH GmbH
- Helmut Seiband
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180343736
- Publication date Nov 29, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Shota SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
- Publication number 20180310396
- Publication date Oct 25, 2018
- OMRON AUTOMOTIVE ELECTRONICS CO., LTD.
- Ryo Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER
- Publication number 20180310416
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald NEHRING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Leaded surface mounted device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaged battery

Leadframe package with pre-applied filler material

Semiconductor device, printed circuit board (PCB), and method of in...

Firing switch for compact capacitive discharge unit

Fusing electronic components into three-dimensional objects via add...

Method of attaching a contact element to a conductive path a conduc...

Semiconductor storage device and heat dissipator

Mechanically bridged SMD interconnects for electronic devices

Electronic device

Mounting aid and method for mounting electrical components on a pri...

Electronic component and substrate having the same mounted thereon

Leadframe package with pre-applied filler material

Mounting system for mechanical-shock resistant printed circuit boar...

Electronic circuit substrate

Electronic component and method for producing an electronic component

SMD diode taking a runner as body and manufacturing method thereof

Mounting structure for module in electronic device

Multilayer electronic component and board having the same

Semiconductor device

Low-cost superior performance coinless RF power amplifier

Connecting arrangement and corresponding method for mounting an ele...

System and method for minimizing connector pad open-circuit stubs

Method for mounting a power amplifier (AP) assembly

Circuit boards and circuit board assemblies

Mounting structure for module in electronic device

Electrical assemblies for downhole use

Mounting system for mechanical-shock resistant printed circuit boar...

Solder component

Electronic component with metal terminals and electronic component...

Multilayer electronic component and board having the same

Patents Applicationslast 30 patents

SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

HIGH CAPACITANCE MODULE

ELECTRONIC MODULE FOR MEDICAL DEVICE

HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

CHIP PACKAGED BATTERY

SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS

MECHANICALLY BRIDGED SMD INTERCONNECTS FOR ELECTRONIC DEVICES

HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET

METAL COMPONENT AND CERAMIC SUBSTRATE

ELECTRONIC COMPONENT SUB-MOUNT AND ELECTRONIC DEVICE USING THE SAME

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...

SEMICONDUCTOR STORAGE DEVICE AND HEAT DISSIPATOR

ELECTRONIC MODULE FOR MEDICAL DEVICE

STEPPED PACKAGE AND RECESSED CIRCUIT BOARD

ELECTRONIC DEVICE

METHOD FOR PRODUCING A CIRCUIT BOARD ARRANGEMENT, AND CIRCUIT BOARD...

MODULAR CAPACITOR SUBASSEMBLY FOR BACKUP POWER

ELECTRONIC COMPONENT AND SUBSTRATE HAVING THE SAME MOUNTED THEREON

Electronic Circuit Substrate

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT

Method Of Attaching A Contact Element To A Conductive Path A Condu...

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

System and Method for Minimizing Connector Pad Open-Circuit Stubs

Mounting System for Mechanical-Shock Resistant Printed Circuit Boar...

POWER MODULE ASSEMBLY AND ASSEMBLING METHOD THEREOF

Connecting Arrangement and Corresponding Method for Mounting an Ele...

SEMICONDUCTOR DEVICE

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE

SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER