Patent Application
20140234773
This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2013-028421, filed on Feb. 15, 2013, the entire contents of which are incorporated herein by reference.
Exemplary embodiments described herein generally relate to a method of costing resist and a resist coating apparatus.
Generally, patterning process to form a prescribed pattern is included in fabricating process of a semiconductor device. The patterning is performed after forming a film to be processed on a substrate to be processed. In the patterning process, resist solution is coated by spin-coating to form the resist as a photo sensitive material. Subsequently, the resist film is exposed with light and is developed with developer for processing the resist film to be patterned as a prescribed pattern. A large amount of the resist is used in the coating of the resist solution. Accordingly, an amount of the resist solution used in the processing steps is desired to be decreased.
It is necessary to be suppressed that a resist supply nozzle providing the resist is contacted to the substrate W to be processed when the resist solution is coated on the substrate to be processed. Therefore, the resist solution has been conventionally provided in a state that the resist supply nozzle is separated from the substrate to be processed in a prescribed distance. In such a case, when pressure applied to the resist solution in the resist supply nozzle, the resist solution is continuously supplied from a top edge of the resist supply nozzle to the substrate to be processed.
However, the pressure applied to the resist solution in the resist supply nozzle is decreased when a supply amount of the resist solution is decreased for effectively utilizing the resist solution. In such the situation, the resist solution cannot be continuously supplied and may be supplied on and off.
An aspect of the present embodiment, there is provided a method of coating resist, including providing solvent on a substrate to be processed being set to be nearly still, and rotating the substrate to be processed to provide resist solution on the substrate to be processed from a resist supply nozzle in a state that a top edge of the resist supply nozzle is inserted into the solvent.
Another aspect of one embodiment, there is provided a resist coating apparatus, including a substrate holding member configured to nearly horizontally retain the substrate to be processed, a rotation unit configured to rotate the substrate holding member, a solvent supply nozzle configured to provide solvent to the substrate to be processed, a resist solution supply nozzle to be configured to provide resist solution to the substrate W to be processed herein the resist solution is provided on the substrate to be processed from the resist supply nozzle in rotating the substrate to be processed by the rotation unit in a state that a top edge of the resist solution supply nozzle is inserted into the solvent on the substrate to be processed provided from the solvent supply nozzle.
Embodiments will be described below in detail with reference to the attached drawings mentioned above. Throughout the attached drawings, similar or same reference numerals show similar, equivalent or same components, and the description is not repeated.
First, a resist coating apparatus according to an embodiment is described below.
A substrate holding member 11 is placed in a resist coating apparatus 1. The substrate holding member 11 nearly horizontally retains the substrate W to be processed by vacuum absorption. The substrate holding member 11 is constituted with a spin chuck, for example. A rotational axis 11a is placed in the substrate holding member 11.
A substrate rotation unit 12 is placed at an under side of the substrate holding member 11 to connect to the rotational axis 11a. The substrate rotation unit 12 rotates the substrate holding member 11 to rotate the substrate W to be processed retained on the substrate holding member 11. The substrate rotation unit 12 is constituted with a driving motor, for example, a pulse motor or the like, and can arbitrarily control a rotational speed.
A solvent supply nozzle 21 is placed in the resist coating apparatus 1 and supplies solvent 4 at nearly the center of a surface of the substrate W to be processed. The solvent 4 is supplied so that the surface of the substrate W to be processed is easily wet with the resist solution before coating the resist on the substrate W to be processed. The solvent 4 is composed of solution, pre-wetted with thinner, including cyclohexane, for example. The solvent 4 is supplied from a solvent supply pipe 22 connected to the solvent supply nozzle 21. Supplying of the solvent 4 to the substrate W to be processed is described below.
A resist supply nozzle 23 is placed in the resist coating apparatus 1 and supplies resist solution at nearly the center of the surface of the substrate W to be processed. The resist solution is coated in a state that the substrate W to be processed is rotated after the solvent is coated on the substrate W to be processed. The resist solution is supplied from a resist supply pipe 24 connected to the resist supply nozzle 23.
A cup 25 is placed in the resist coating apparatus 1 to prevent scattering of the resist solution or the like. The cup 25 has an opening at the center of each of an upper portion and a bottom portion. Spaces at an upper portion, a lower portion and a surrounded portion of the substrate W to be processed are surrounding with the cup 25. The opening of the upper portion of the cup 25 is set as a space where the solvent supply nozzle 21 and the resist supply nozzle 23 are movable. In the opening of the bottom portion of the cup 25, the substrate holding member 11 and the substrate rotation unit 12 are placed.
A pump 27 connected to the bottles 28 pumps up each solution from the bottle corresponding to supplying of each solution. A filter 26 is provided at a down stream side of the pump to remove impurities or the like in each solution. Each of the solvent and the resist solution passed through the filter 26 is supplied to solvent supply nozzle 21 and the resist supply nozzle 23, respectively. The pump 27 and the filter 26 are controlled by a discharge control unit 29. Accordingly, a supply amount supplied of each solution to the substrate W to be processed can be suitably selected. Furthermore, the resist coating apparatus 1 can include a thickness measurement unit (not shown) to measure a thickness of the solvent.
A nozzle arm unit 2 includes the solvent supply nozzle 21, the resist supply nozzle 23 and a nozzle arm driving unit (not shown) to drive the solvent supply nozzle 21 and the resist supply nozzle 23. The nozzle arm driving unit transfers the solvent supply nozzle 21 and the resist supply nozzle 23 onto the substrate W to be processed.
The rotation control unit 13 is placed to contact to the substrate rotation unit 12 rotating the substrate W to be processed to control start and end of the rotation and rotation number or the like of the substrate W to be processed.
A controller 3 controls the discharge unit 29, the rotation control unit 13 and the nozzle arm driving unit in conjunction with each other. Next, a method of coating resist according to the embodiment is explained by using a cross-sectional view in
As shown in
As shown in
The resist solution is coated from the resist supply nozzle 23 on the substrate W to be processed. The substrate W to be processed is rotated at nearly the same as the coating of the resist solution by using the substrate rotation unit 12. A coating amount of the resist solution is set to be 0.70 cc, for example, and the rotation speed of the substrate W to be processed is set to be 2,500 rpm. In such a manner, the resist solution is supplied on the whole surface of the substrate W to be processed. The top edge of the resist supply nozzle 23 is desired to be inserted in the solvent 4 on the substrate W to be processed until finishing the coating of the resist solution. Accordingly, a thickness of a resist 5 in thinned by the rotation of the substrate W to be processed as the solvent 4 on the substrate W to be processed is thinned. Therefore, a distance between the top edge of the resist supply nozzle 23 and the surface of the substrate W to be processed is controlled corresponding to time from the start of the rotation. The distance is desired to be decreased, for example.
Next, after finishing the supply of the resist solution, the rotation of the substrate W to be processed is stopped. Further, the resist supply nozzle 23 is separated from the substrate W to be processed and the resist supply nozzle 23 is returned to a prescribed position. In processing steps described above, the coating of the resist 5 on the substrate W to be processed according to the embodiment is completed.
As mentioned above, the resist solution is provided from the resist supply nozzle according to the embodiment in a state that the resist supply nozzle is inserted into the solvent coated on the substrate to be processed. In such a manner, the resist solution can be continuously supplied on the substrate to be processed, even when a small amount of the resist solution is supplied.
Furthermore, the solvent is supplied onto the substrate to be processed in a state that substrate to be processed is set to be nearly still. In such a manner, thicker solvent can be coated. As a result, the resist supply nozzle is not approached to so near the substrate to be processed, the solvent can be inserted into the solvent.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013-028421 | Feb 2013 | JP | national |
