Claims
- 1. A method of constructing a multilayer electric apparatus, comprising the steps of:(a) providing a first dielectric layer; (b) forming a set of conductive features and a plurality of fiducial markings, each having a location, on said first dielectric layer, said conductive features and said plurality of fiducial markings formed in mutual reference to each other so that their relative locations are known to a first tolerance; (c) storing a pattern of information in a computer readable format, said pattern corresponding to a desired photoresist exposure pattern for a second layer of said multilayer electric apparatus; (d) measuring said locations of each said fiducial markings on said first layer to form a set of measured locations; (e) altering said pattern of information in correspondence to said set of measured locations; (f) providing a second dielectric layer bonded to a conductive layer that is covered by a photoresist layer; (g) using said pattern of information to control a laser to selectively expose said photoresist layer; and (h) joining said first and second layers to each other.
- 2. The method of claim 1 wherein said laser is a frequency tripled ND:YAG laser.
- 3. The method of claim 1 wherein said step of joining said first and second layers to each other is performed prior to the step of using said pattern of information to control said laser to selectively expose said photoresist layer.
- 4. The method of claim 1 wherein said second dielectric layer bonded to said conductive layer is a resin coated copper foil.
- 5. The method of claim 1 wherein said step of joining said first and second layers to each other is performed prior to the step of measuring said locations of said fiducial markings on said first layer to form measured locations.
- 6. The method of claim 1 wherein said laser is an ND:YAG laser.
- 7. The method of claim 1 wherein said photoresist is patterned by exposing it to a selectively masked light source prior to exposing it to said laser beam.
RELATED APPLICATIONS
This application is a national phase application of international application PCT/US00/13140, filed May 12, 2000, which claims priority from U.S. application Ser. No. 09/310,873, filed May 12, 1999, now U.S. Pat. No. 6,354,000, issued Mar. 12, 2002.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/US00/13140 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO00/68972 |
11/16/2000 |
WO |
A |
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