Claims
- 1. A method of forming an ohmic electrode comprising coating an n-type cubic boron nitride with at least one layer of a material selected from the group consisting of: a Group IVB metal; an alloy with a Group IVB metal; a metal with Si or S; an alloy with Si or S; a metal with B, Al, Ga, or In; an alloy with B, Al, Ga or In; a Group VB metal; and an alloy with a Group VB metal at a substrate temperature from 300.degree. C. to 1800.degree. C. by vacuum evaporation, sputtering or alloying.
- 2. A method of forming an ohmic contact electrode according to claim 1 wherein the coating step is at a substrate temperature of substantially 400.degree. C. and the coating step is followed by an annealing step wherein the electrode is heated from 300.degree. C. to 1800.degree. C. in an atmosphere comprising an inert gas, N.sub.2, H.sub.2, or a vacuum.
- 3. A method of forming an ohmic contact electrode according to claim 1, wherein, after the coating step the n-type cubic boron nitride is coated with at least one layer of a metal selected from the group consisting of Au and Ag.
- 4. A method of forming an ohmic electrode comprising coating an Si-doped n-type cubic boron nitride with at least one layer of a material selected from the group consisting of: a Group IVB metal; and alloy with a Group IVB metal; a metal with Si or S; an alloy with Si or S; a metal with B, Al, Ga, or In; an alloy within, Al, Ga or In; a Group VB metal; and an alloy with a Group VB metal at a substrate temperature from 100.degree. C. to 1800.degree. C. by vacuum evaporation, sputtering or alloying.
Priority Claims (4)
Number |
Date |
Country |
Kind |
2-134720 |
May 1990 |
JPX |
|
2-134721 |
May 1990 |
JPX |
|
2-134722 |
May 1990 |
JPX |
|
2-134723 |
May 1990 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 07/705,594, filed May 24, 1991 pending.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5057454 |
Yoshida et al. |
Oct 1991 |
|
5187560 |
Yoshida et al. |
Feb 1993 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
705594 |
May 1991 |
|