Claims
- 1. A method of making a thick film inductor with a high frequency response, having a quality comprising the steps of, providing a conductor layer of a thick film material in the form of a flat layer on a substrate, subjecting said conductor layer to a plurality of linear cuts by a pulsing laser cutter imposed simultaneously on the entire length of the linear cut being made to create substantially vertical cuts that minimize undesirable AC effects.
- 2. The method of claim 1 wherein the conductor layer is a dried silver ladened thick film ink which is photo imagable.
- 3. The method of claim 1 wherein said conductor layer is formed to create a substantially vertical cross section to reduce the skin effect in the conductor layer thus reducing resistance and raising the quality of the inductor in comparison to the same inductor wherein the conductor layer is formed with a less vertical cross section.
- 4. The method of claim 2 wherein said conductor layer is formed to create a substantially vertical cross section to reduce the skin effect in the conductor layer thus reducing resistance and raising the quality of the inductor in comparison to the same inductor wherein the conductor layer is formed with a less vertical cross section.
- 5. The method of claim 1, wherein the step of providing a conductor layer further comprises screen printing a conductor layer onto a ceramic substrate which provides for greater inductance values than a photoimagable process.
- 6. The method of claim 5, further comprising the step of: firing the conductor material first before subjecting the conductor layer to the laser cutter.
- 7. The method of claim 5 wherein the conductor layer is a dried silver ladened thick film ink which is photo imagable.
- 8. The method of claim 5, further comprising the step of: subjecting the conductor layer to the laser cutter first in its green or unfired state.
- 9. The method of claim 1 wherein the substrate has a dielectric constant of around 4.
- 10. The method of claim 1 wherein the substrate is alumina.
- 11. The method of claim 1 wherein the substrate has a dielectric overcoat.
- 12. The method of claim 1 wherein the linear cuts have a width of approximately 1 mil to provide for high inductance.
Parent Case Info
This application is a continuation of application Ser. No. 09/080,494 filed May 18, 1998 which is a division of Ser. No. 08/936,193 filed Sep. 17, 1997, now U.S. Pat. No. 5,922,914.
US Referenced Citations (11)
Foreign Referenced Citations (6)
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2446045 |
Apr 1976 |
DE |
2263582 |
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GB |
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Continuations (1)
|
Number |
Date |
Country |
Parent |
09/080494 |
May 1998 |
US |
Child |
09/448676 |
|
US |