Claims
- 1. A method for manufacturing a circuit print board comprising:a through hole making step for making a through hole penetrating a thermal diffusive sheet which is a carbon sheet bonded by substance supporting the carbon sheet; and an insulator bonding step for forming a core by bonding insulator to a side surface of the through hole made at the through hole making step.
- 2. The method for manufacturing the circuit print board according to claim 1, wherein the carbon sheet is a graphite sheet.
- 3. The method for manufacturing the circuit print board according to claim 1 further comprising:a circuit patterning step for forming circuits on both sides of the core formed at the insulator bonding step; a conductive hole making step for making a conductive hole penetrating the core with the circuits formed at the circuit patterning step; and a connection step for placing conductive material to a side surface of the conductive hole formed at the conductive hole making step.
- 4. The method for manufacturing the circuit print board according to claim 1 further comprising:a conductive hole making step for making a conductive hole penetrating the core formed at the insulator bonding step; a circuit patterning step for forming circuits on both sides of the core having the conductive hole made at the conductive hole making step; and a connection step for placing conductive material to a side surface of the conductive hole formed at the conductive hole making step.
- 5. The method for manufacturing the circuit print board according to claim 1 further comprising, before the through hole making step, a thermal diffusive sheet forming step for forming a thermal diffusive sheet by bonding substance supporting the carbon sheet to the carbon sheet.
- 6. The method for manufacturing the circuit print board according to claim 1, wherein the insulator bonding step bonds the insulator to the side surface of the through hole by compressing the insulator to the thermal diffusive sheet having the through hole made at the through hole making step.
- 7. The method for manufacturing the circuit print board according to claim 1, wherein the insulator bonding step bonds by plugging the insulator in the through hole made at the through hole making step.
- 8. The method for manufacturing the circuit print board according to claim 1, wherein the through hole making steps makes the through hole having a greater diameter than the conductive hole made at the conductive hole making step.
Parent Case Info
This is a continuation of international application No. PCT/JP99/03291 filed on Jun. 21, 1999, which International Application was published by the International Bureau in Japanese on Dec. 28, 2000.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4591659 |
Leibowitz |
May 1986 |
A |
Foreign Referenced Citations (8)
Number |
Date |
Country |
0147014 |
Mar 1985 |
EP |
60-140898 |
Jul 1985 |
JP |
4-299892 |
Oct 1992 |
JP |
HEI 4-359496 |
Dec 1992 |
JP |
HEI 5-11475 |
Feb 1993 |
JP |
HEI 5-291715 |
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JP |
HEI-8-23183 |
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WO0079848 |
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WO |
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP99/03291 |
Jun 1999 |
US |
Child |
09/777940 |
|
US |