Claims
- 1. A method of manufacturing a heat pipe construction with integral shielding against electromagnetic interference, comprising the steps of:providing a tubular pipe containing heat pipe media; said tubular pipe having an outer surface, a first end and a second end; and overmolding a thermally conductive, electromagnetic interference absorbtive polymer composition around said outer surface of said tubular pipe; said polymer composition being a polymer composite material loaded with a first thermally conductive filler having a high aspect ratio and a second thermally conductive filler having a low aspect ratio.
- 2. The method of claim 1, wherein said step of providing a tubular pipe comprises providing a tubular pipe manufactured of metal.
- 3. The method of claim 1, wherein said polymer composite material is a liquid crystal polymer.
- 4. The method of claim 1, wherein said first thermally conductive filler is carbon fiber.
- 5. The method of claim 1, wherein said second thermally conductive filler is boron nitride grains.
- 6. The method of claim 1, wherein said step of forming said material around said heat pipe further includes forming integral thermal interface pads around said first and second ends of said tubular pipe.
- 7. The method of claim 1, wherein said heat pipe media is water.
- 8. The method of claim 1, wherein said heat pipe media is ammonia.
- 9. A method of manufacturing a heat pipe construction with integral shielding against electromagnetic interference, comprising the steps of:providing a metallic tubular pipe containing heat pipe media said tubular pipe having an outer surface, a first end and a second end; providing a polymer base matrix; mixing said polymer base matrix with thermally conductive, electromagnetic interference absorbtive filler material to form a thermally conductive, electromagnetic interference absorbtive polymer composition; said filler material includes a first thermally conductive filler having a high aspect ratio and a second thermally conductive filler having a low aspect ratio; and molding said thermally conductive, electromagnetic interference absorbtive polymer around said outer surface of said tubular pipe.
- 10. The method of claim 9, wherein said base polymer matrix material is a liquid crystal polymer.
- 11. The method of claim 9, wherein said first thermally conductive filler is carbon fiber.
- 12. The method of claim 9, wherein said second thermally conductive filler is boron nitride grains.
- 13. The method of claim 9, wherein said step of molding said material around said heat pipe further includes forming integral thermal interface pads around said first and second ends of said tubular pipe.
- 14. A method of manufacturing a heat pipe construction, comprising the steps of:providing a tubular pipe containing heat pipe media; said tubular pipe having an outer surface, a first end and a second end; overmolding a thermally conductive polymer composition around said outer surface of said tubular pipe to form an outer covering around said pipe; overmolding a first thermal interface pad, integrally formed from said polymer composition, adjacent to said first end of said pipe; and overmolding a second thermal interface pad, integrally formed from said polymer composition, adjacent to said second end of said heat pipe.
- 15. The method of claim 14, wherein said step of providing a tubular pipe comprises providing a tubular pipe manufactured of metal.
- 16. The method of claim 14, wherein said thermally conductive polymer composition is a polymer composite material loaded with a first thermally conductive filler having a high aspect ratio and a second thermally conductive filler having a low aspect ratio.
- 17. The method of claim 16, wherein said polymer composite material is a liquid crystal polymer.
- 18. The method of claim 16, wherein said first thermally conductive filler is carbon fiber.
- 19. The method of claim 16, wherein said second thermally conductive filler is boron nitride grains.
PRIORITY CLAIM TO PREVIOUSLY FILED APPLICATION
This application claims benefit of Provisional appl. 60/179,500 filed Feb. 1, 2000 which is a continuation of and claims priority to application Ser. No. 09/774,519, filed Jan. 31, 2001 U.S. Pat. No. 6,585,039.
US Referenced Citations (35)
Foreign Referenced Citations (2)
Number |
Date |
Country |
404-225791 |
Aug 1992 |
JP |
1326-867 |
Oct 1985 |
SU |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/179500 |
Feb 2000 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09/774519 |
Jan 2001 |
US |
Child |
10/123363 |
|
US |