Number | Name | Date | Kind |
---|---|---|---|
3806365 | Jacob | Apr 1974 | |
4062720 | Alcorn et al. | Dec 1977 | |
4180432 | Clark | Dec 1979 |
Entry |
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IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, Plasma Removal of Residue Following Reactive Ion Etching of Aluminum and Aluminum Alloys by G. T. Chiu et al., p. 2315. |
A. T. Bell, "An Introduction to Plasma Processing", Solid State Technology, Apr., 1978, pp. 89-94. |