Patent Application
20210335582
Embodiments of the present principles generally relate to wafer level packaging of semiconductor structures.
Process chambers may be configured to perform a precleaning process. For example, such preclean chambers can remove native oxide on metal contact pads of a substrate prior to physical vapor deposition (PVD) for depositing one or more barrier layers, e.g., titanium (Ti), copper (Cu), etc., on the substrate and to remove other materials. Preclean chambers, typically, use ion bombardment (induced by RF plasma) to remove by etching the native oxide on the metal contact pads and other materials. The preclean process lowers contact resistance between the metal contacts on the substrate to enhance performance and power consumption of integrated circuits on the substrate and to promote adhesion. To perform a plasma cleaning process, an integrated circuit is placed in a plasma chamber and a pump removes most of the air from the chamber. Electromagnetic energy (e.g., radio frequency) is applied to an injected gas, such as argon, to excite the injected gas into a plasma state. The plasma releases ions that bombard the surface of the substrate to remove contaminants and/or material from the substrate. Atoms or molecules of the contaminants and/or substrate material are etched from the substrate and are, for the most part, pumped out of the chamber. However, some of the contaminant and/or etched material may be redeposited on surfaces of the chamber. Process kits are typically used to reduce or prevent deposition of contaminants and/or etched materials onto surfaces of the chamber. The resputtering of the deposition materials on the process kit is a key factor in deciding when periodic maintenance should be performed on the preclean chamber. The deposition buildup may limit the preclean chamber to 2,000 or less wafers before periodic maintenance is required.
Accordingly, the inventors have provided embodiments that increase the wafer numbers between required cleanings of the preclean chamber.
Methods and apparatus for improving wafer run numbers between cleaning intervals are provided herein.
In some embodiments, an apparatus for protecting a processing volume of a process chamber may comprise a frame configured to be insertable into a process kit shield and a foil liner composed of a metallic material that is attachable to the frame at specific points, wherein the specific points being spaced apart to produce an amount of flexibility based on a malleability of the metallic material, and wherein the amount of flexibility per GPa is approximately 2.5 to approximately 4.5.
The apparatus may further include wherein the amount of flexibility is further based on an internal stress of a material to be deposited onto the foil liner, the frame is formed from aluminum, copper, titanium, or stainless steel, the foil liner is made of aluminum, copper, titanium, nickel, or gold, the foil finer is aluminum and the specific points are spaced approximately 30 mm apart, the foil liner is rectangular or circular in shape, the frame is attachable to the process kit shield with a screw type fastener, a diffuser with the foil liner attached to a lowermost portion, the diffuser has a removable cap in the lowermost portion, the foil liner being attached to the removable cap, the frame is approximately 3 mm in thickness, and/or the foil liner is attachable to the frame using a fiber laser with pulsing capability.
In some embodiments, an apparatus for processing semiconductor structures may comprise a preclean chamber having a chamber body with a processing volume, a process kit that surrounds at least a portion of the processing volume, a frame inserted into the process kit, and a foil liner composed of a metallic material that is attached to the frame at specific points, wherein the specific points being spaced apart to produce an amount of flexibility based on a malleability of the metallic material, and wherein the amount of flexibility is approximately 2.5 to approximately 4.5.
The apparatus may further include the amount of flexibility is further based on an internal stress level of a material to be deposited onto the foil liner, the frame is formed from aluminum, copper, titanium, or stainless steel, the foil liner is made of aluminum, copper, titanium, nickel, or gold, the foil liner is aluminum and the specific points are spaced approximately 30 mm apart, and/or the frame is attachable to the process kit with a screw type fastener.
In some embodiments, a method of protecting a process kit may comprise forming a frame that is attachable to at least a portion of a process kit for a preclean, chamber, attaching the frame to an inner surface of the process kit, and attaching a foil liner to an inner surface of the frame at specific points that are spaced apart achieve an amount of flexibility based on a malleability of a material forming the foil liner, the amount of flexibility per GPa ranges from approximately 2.5 to approximately 4.5.
The method may further include the amount of flexibility is further based on an internal stress level of a material to be deposited on the foil liner and/or the material to be deposited on the foil liner is silicon nitride, silicon oxide, or polymer.
Other and further embodiments are disclosed below.
Embodiments of the present principles, briefly summarized above and discussed in greater detail below, can be understood by reference to the illustrative embodiments of the principles depicted in the appended drawings. However, the appended drawings illustrate only typical embodiments of the principles and are thus not to be considered limiting of scope, for the principles may admit to other equally effective embodiments.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Methods and apparatus utilize a recyclable process kit, that dramatically enhances the number of wafers that can be run before periodic maintenance or cleaning is necessary. The recyclable process kit may be used in preclean chambers, but the present principles may also be applied to other chambers. The recyclable process kit includes a recyclable frame that is used to support a metallic foil liner that is attached to the frame in a manner which allows the foil liner to maintain a specific flexibility that prevents deposition particle contamination, in the chamber. The flexibility of the foil liner allows the re-sputtered deposition that occurs during cleaning to attach to the foil liner and remain attached even with high stress depositions. The flexibility of the foil liner remediates the high stresses within the depositions, allowing the depositions to remain attached to the foil liner instead of flaking off and contaminating the chamber. The enhanced bond between the depositions and the foil liner permit the recyclable process kit to be employed for a much higher number of wafers before the recyclable process kit needs to be replaced, sometimes two to three times or more the number of wafers in chambers with conventional process kits. In addition, the nonuniformity percentage (NU %) for the chamber is maintained throughout the prolonged process kit life.
Preclean chambers that process materials such as silicon nitride, silicon oxide, polymers, and metals suffer from short process kit life. The recyclable process kit of the present principles increases the kit life by more than two times while providing a recycle turnaround time of less than three hours as opposed to conventional process kits taking approximately three days or more. The metal foil liner and frame design with varying pattern and pitch enables a fast change or refurbishment of the process kit rather than traditional arc spray processes or any other type of coating. Moreover, the recyclable process kit helps to increase the performance of the preclean chamber. The benefits of using the recyclable process kit include mean wafer before clean (MWBC) improvements of over two times, particle count reduction, and prolonged kit life with less than a 2% NU % drift. The recyclable process kit also provides a lower process kit recycle cost, faster process kit recycle turnaround time, and better throughput.
A substrate support 124 is disposed within the interior volume 120 to support and retain a substrate 122, such as a semiconductor wafer, for example, or other such substrate as may be electrostatically retained. The substrate support 124 may generally comprise a pedestal 136 and a hollow support shaft 112 for supporting the pedestal 136. The pedestal 136 includes an electrostatic chuck 150. In some embodiments, the electrostatic chuck 150 comprises a dielectric plate. The hollow support shaft 112 provides a conduit to provide, for example, backside gases, process gases, fluids, coolants, power, or the like, to the electrostatic chuck 150. In some embodiments, the substrate support 124 includes an edge ring 187 disposed about the electrostatic chuck 150. In some embodiments, the edge ring 187 is made of alumina (Al2O3). A slit valve 184 may be coupled to the chamber body 106 to facilitate transferring the substrate 122 into and out of the interior volume 120.
The process kit includes an upper shield 117 circumscribing the substrate support 124. The upper shield 117 rests on the adapter 180 and may be configured to define the processing volume 119. In some embodiments, the upper shield 117 is made of metal such as aluminum. The process kit may include a lower shield 105 circumscribing the substrate support 124 which may be coupled to the pedestal 136. In some embodiments, the lower shield 105 is made of metal such as aluminum. The hollow support shaft 112 is coupled to a lift mechanism 113, such as an actuator or motor, which provides vertical movement of the electrostatic chuck 150 between an upper, processing position, and a lower, transfer position. A bellows assembly 110 is disposed about the hollow support shaft 112 and is coupled between the electrostatic chuck 150 and a bottom surface 126 of chamber 100 to provide a flexible seal that allows vertical motion of the electrostatic chuck 150 while reducing or preventing loss of vacuum from within the chamber 100. The bellows assembly 110 also includes a lower bellows flange 164 in contact with an O-ring 165 or other suitable sealing element which contacts the bottom, surface 126 to help prevent loss of chamber vacuum.
A substrate lift 130 can include lift pins 109 mounted on a platform 108 connected to a shaft 111 which is coupled to a second lift mechanism 132 for raising and lowering the substrate lift 130 so that the substrate 122 may be placed on or removed from the electrostatic chuck 150. The electrostatic chuck 150 may include through-holes to receive the lift pins 109. A bellows assembly 131 is coupled between the substrate lift 130 and bottom surface 126 to provide a flexible seal which maintains the chamber vacuum during vertical motion of the substrate lift 130. The hollow support shaft 112 provides a conduit for coupling a backside gas supply 141, a chucking power supply 140, and a RE power supply 190 to the electrostatic chuck 150. In some embodiments, the chucking power supply 140 provides DC power to the electrostatic chuck 150 via conduit 154 to retain the substrate 122. In some embodiments, RF energy supplied by the RF power supply 190 may have a frequency of about 10 MHz or greater. In some embodiments, the RF power supply 190 may have a frequency of about 13.56 MHz.
The backside gas supply 141 is disposed outside of the chamber body 106 and supplies gas to the electrostatic chuck 150. The electrostatic chuck 150 may include a gas channel 138 extending from a lower surface of the electrostatic chuck 150 to an upper surface 152 of the electrostatic chuck 150. The gas channel 138 is configured to provide backside gas, such as nitrogen (N), argon (Ar), or helium (He), to the upper surface 152 of the electrostatic chuck 150 to act as a heat transfer medium. The gas channel 138 is in fluid communication with the backside gas supply 141 via gas conduit 142 to control the temperature and/or temperature profile of the substrate 122 during use. For example, the backside gas supply 141 can supply gas to cool the substrate 122 during use. The chamber 100 is coupled to and in fluid communication with a vacuum system 114 which includes a throttle valve (not shown) and pump (not shown) which are used to exhaust the chamber 100. In some embodiments, the vacuum system 114 is coupled to a pump port disposed on the bottom surface 126 of the chamber body 106. The pressure inside the chamber 180 may be regulated by adjusting the throttle valve and/or vacuum pump. In some embodiments, the pump has a flow rate of about 1900 liters per second to about 3000 liters per second.
The chamber 100 is also coupled to, and in fluid communication with a process gas supply 118 which may supply one or more process gases to the chamber 100 for processing a substrate disposed therein. In some embodiments, the lid 184 includes a port through which gas from the process gas supply 118 can be introduced into the interior volume 120. In some embodiments, the process gas supply 118 provides argon (Ar) gas. In some embodiments, a diffuser 182 is coupled to the upper shield 117 to inject gas from the process gas supply 118 into the processing volume 119 from a center of the upper shield 117. In operation, for example, a plasma 102 may be created in the interior volume 120 to perform one or more processes. The plasma 102 may be created by coupling power from a plasma power source (e.g., RF power supply 190) to a process gas via the electrostatic chuck 150 to ignite the process gas and create the plasma 102. The RF power supply 190 is also configured to attract ions from the plasma towards the substrate 122.
A controller 170 may be provided and coupled to various components of the chamber 100 to control the operation thereof. The controller 170 includes a central processing unit (CPU) 172, a memory 174, and support circuits 176. The controller 170 may control the chamber 100 directly, or via computers (or controllers) associated with a particular process chamber and/or support system components. The controller 170 may be one of any form of general-purpose computer processor that can be used in an industrial setting for controlling various chambers and sub-processors. The memory, or computer readable medium, 174 of the controller 170 may be one or more of readily available memory such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, optical storage media (e.g., compact disc or digital video disc), flash drive, or any other form of digital storage, local or remote. The support circuits 176 are coupled to the CPU 172 for supporting the processor in a conventional manner. The circuits include cache, power supplies, clock circuits, input/output circuitry and subsystems, and the like. Methods to control the chamber 100 and/or processes may be stored in the memory 174 as software routine that may be executed or invoked to control the operation of the chamber 100 in the manner described herein. The software routine may also be stored and/or executed by a second CPU (not shown) that is remotely located from the hardware being controlled by the CPU 172.
The inventors have found that attaching the foil liner to the frame 308 using a uniform adhesive that covers an entire surface of the foil liner prevented deformation of the foil liner (and stress relief) and did not lead to any improvement over a conventional process kit in regard to particle contamination and process kit life. The inventors discovered that if the foil liner was instead attached at specific points with a specific spacing, the foil liner would remain flexible and provide dramatically superior deposition adhesion and stress relief, substantially reducing particle contaminations. The stress buildup on the shield is relieved due to the flexibility of the foil liner and significantly extends the life of the process kit. The flexibility of the foil liner allows stress release by deforming and preventing the redeposition from cracking and flaking off. By attaching the foil liner at different attachment points with specific distances or pitch, the foil liner's flexibility can be adjusted to reduce particle formation. A very high-density pitch causes less flexibility of the foil liner and produces more dropped particles. With a less dense pitch, or in other words, less attachment points, less particles are formed because the foil liner can flex more.
In addition, the inventors found that using a short-pulsed laser provided a way to spot weld the foil liner to the frame without damaging the foil liner or the frame. The very short pulse period prevents the laser from burning through the materials and possibly damaging the underlying shield or process kit. The short-pulsed laser was then used to weld the foil liner to the frame at various points with various spacing. In some embodiments, a fiber laser is used to weld the foil liner to the frame. The inventors found that when using a very thin aluminum for the foil liner a spacing or pitch pattern of approximately 30 mm or greater yielded a significant reduction in particle contamination. If the pitch pattern was significantly less than 30 mm (e.g., approximately 15 mm) for the given thin aluminum foil liner, the reduction in particle contamination was negligible. The inventors discovered that the malleability of the material used for the foil liner also directly affected the pitch pattern. Materials with a higher malleability could be spaced less than 30 mm and still produce a substantial reduction in particle contamination. Likewise, materials with lower malleability could be spaced farther apart than 30 mm to produce a substantial reduction in particle contamination. In addition, NU % does not drive more than 2% throughout the kit life.
For the sake of brevity, the following examples will use a foil liner constructed from thin aluminum material. The rectangular foil liner 502 of
attachment point pitch (mm)∝film thickness (mm)×modulus of elasticity (GPa) (Eq. 1)
The attachment point pitch can be expressed as:
L=f·t·E (Eq. 2)
where L is a distance 706, 708 between attachment points 704, t is a foil liner thickness 710, E is the modulus of elasticity for the material of the foil liner, and f is the proportional constant. The proportional constant f, regarded as the amount of flexibility, varies depending on the stress of the re-sputtered materials that will be deposited onto the foil liner. The amount of flexibility can be expressed as:
f=L/(t·E) (Eq. 3)
For example, if a copper foil liner is used for silicon nitride etching, an attachment point pitch distance of 30 mm is used to achieve good particle performance (particle contamination is reduced). In the example, the attached copper foil liner thickness may be 70 μm and the modulus of elasticity of copper is 117 GPa. Therefore, the amount of flexibility, f, can be calculated per GPa as:
f=30 mm/(0.07 mm×117 GPa)=3.66/GPa (Eq. 4)
The amount of flexibility per GPa, f, can vary between approximately 2.5 and approximately 4.5 for different re-sputtered material stress to achieve substantial particle contamination reduction.
As a further example of attachment point pitch, if the foil liner is formed from aluminum with a 100 μm thickness and a modulus of elasticity of 67 Gpa and an amount of flexibility of f=3.66, the attach pitch can be defined as:
L(mm)=3.66×0.1×67=24.5 mm (Eq. 5)
In another example, if the foil liner is formed from pure nickel with a 50 μm thickness and a modulus of elasticity of 170 Gpa and an amount of flexibility=4.0, the attachment point pitch can be defined as:
L(mm)=4.0×0.05×170=34.0 mm (Eq. 6)
The range of attachment point pitch can be from approximately 10 mm to approximately 40 mm or greater depending on the properties of the material used for the foil liner and/or the desired amount of flexibility to relieve the internal stresses of a particular type of deposition material. The ability to account for multiple parameters allows for substantial flexibility in applying the apparatus and methods of the present principles to achieve superior particle control in process chambers.
In some embodiments, when maintenance is required, the process kit along with the frame and foil liner can be removed together. The foil liner is then detached from the frame and, in some circumstances, the frame can be detached from the process kit or shield. Because the process kit or shield is protected by the frame and foil liner, the process kit or shield would require little or no cleaning. In other instances, the frame may be left attached to the shield and a new foil liner attached to the frame in-situ in the shield. Because the frame can be reused or recycled and the deposition on the foil liner is removed along with the foil liner, the maintenance process can be performed in three hours or less compared to a conventional process requiring more than three days. In some embodiments, the frame and foil liner can be inserted into the shield together as a single unit. The attachment points of the frame would allow the foil liner to remain undisturbed during installation or removal from the shield. A spare frame and foil liner unit could then be kept as a complete spare for quick swapping at the time of maintenance.
Embodiments in accordance with the present principles may be implemented in hardware, firmware, software, or any combination thereof. Embodiments may also be implemented as instructions stored using one or more computer readable media, which may be read and executed by one or more processors. A computer readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing platform or a “virtual machine” running on one or more computing platforms). For example, a computer readable medium may include any suitable form of volatile or non-volatile memory. In some embodiments, the computer readable media may include a non-transitory computer readable medium.
While the foregoing is directed to embodiments of the present principles, other and further embodiments of the principles may be devised without departing from the basic scope thereof.
