Claims
- 1. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising:
a polishing pad, the polishing pad being shaped like a belt and configured to have no seams; and a base belt, the base belt including a reinforcement layer, the reinforcement layer being a fibrous-type material; wherein the polishing pad is provided over the base belt.
- 2. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the polishing pad is a polymeric material.
- 3. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 2, wherein the polymeric material is polyurethane.
- 4. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the base belt further includes a cushioning layer which is an intermediary layer between the polishing pad and the base belt.
- 5. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 4, wherein the cushioning layer is an open-celled polyurethane material.
- 6. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the polishing pad is about 40 mils in thickness.
- 7. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 4, wherein the cushioning layer is about 20 mils in thickness.
- 8. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, further comprising:
a cap covering an adhesive film between the base belt and the polishing pad.
- 9. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 8, wherein the cap is a polymeric material.
- 10. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, further comprising:
a cover configured to seal off an adhesive film between the base belt and the polishing pad from moisture intrusion.
- 11. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the base belt further includes a cushioning layer, the base belt and the polishing pad being attached by a first adhesive film, and the reinforcement layer and the cushioning layer are attached by a second adhesive film.
- 12. A polishing structure for utilization in chemical mechanical polishing, comprising:
a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit, the polishing pad being made of a polymeric material; and a base belt, the base belt including a reinforcement layer, the reinforcement layer being a fibrous-type material; wherein the polishing pad is provided over the base belt.
- 13. A polishing structure for utilization in chemical mechanical polishing as recited in claim 12, wherein the base belt includes a cushioning layer which is an intermediary layer between the polishing pad and the reinforcement layer, the cushioning layer being a polymeric material, the reinforcement layer and the cushioning layer being attached by a first adhesive film, and the cushioning layer and the polishing pad being attached by a second adhesive film.
- 14. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising:
a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit and to have grooves on a pad surface, the polishing pad being made up of polyurethane; and a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a fibrous-type material, the reinforcement layer and the cushioning layer being attached by way of a first adhesive film, the base belt and the polishing pad being attached by way of a second adhesive film; wherein the cushioning layer is an intermediary between the polishing pad and the reinforcement layer, the cushioning layer being a polyurethane material.
- 15. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 14, wherein the polishing pad is between about 40 mils in thickness.
- 16. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 14, wherein the cushioning layer is about 20 mils in thickness.
- 17. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 14, wherein the reinforcement layer is about 20 mils in thickness.
- 18. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising:
a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit; a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a fibrous-type material; and a cap covering an adhesive film between the base belt and the polishing pad; wherein the cushioning layer is an intermediary between the continuous pad and the base belt.
- 19. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 18, wherein the polishing pad is polyurethane.
- 20. A method for generating a polishing pad structure for utilization in chemical mechanical polishing, comprising:
providing a reinforcement layer, the reinforcement layer being a fibrous-type material; applying a first adhesive film over the reinforcement layer; attaching a cushioning layer on the first adhesive film; applying a second adhesive film over the cushioning layer; attaching a seamless polishing pad on the second adhesive film; and curing the polishing pad structure.
- 21. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 20 wherein the first adhesive layer and the second adhesive layer is a rubber based adhesive.
- 22. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 20 wherein the seamless polishing pad is generated by pouring a polymeric gel into a mold.
- 23. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 20 wherein the seamless polishing pad is a polymeric material.
- 24. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 20 wherein the curing includes heating the polishing pad structure.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This is a continuation application of copending U.S. patent application Ser. No. 09/752,509, filed on Dec. 27, 2000, entitled “METHODS FOR MAKING REINFORCED WAFER POLISHING PADS AND APPARATUSES IMPLEMENTING THE SAME” from which priority under 35 U.S.C. §120 is claimed. The aforementioned patent application is hereby incorporated by reference in its entirety. This application is a also related to U.S. patent application Ser. No. 09/752,703, filed on Dec. 27, 2000, entitled “METHODS FOR MAKING REINFORCED WAFER POLISHING PADS UTILIZING DIRECT CASTING AND APPARATUSES IMPLEMENTING THE SAME.”
Continuations (1)
|
Number |
Date |
Country |
Parent |
09752509 |
Dec 2000 |
US |
Child |
10437578 |
May 2003 |
US |