Claims
- 1. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising:a polishing pad, the polishing pad being shaped like a belt and configured to have no seams; and a base belt, the base belt including a reinforcement layer and a cushioning layer; wherein the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.
- 2. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the polishing pad is a polymeric material.
- 3. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 2, wherein the polymeric material is polyurethane.
- 4. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the cushioning layer is a sponge like material.
- 5. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the cushioning layer is an open-celled polyurethane material.
- 6. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the reinforcement layer is a steel layer.
- 7. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the polishing pad is about 40 mils in thickness.
- 8. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the cushioning layer is about 20 mils in thickness.
- 9. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, further comprising:a cap covering an adhesive film between the base belt and the polishing pad.
- 10. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 9, wherein the cap is a polymeric material.
- 11. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, further comprising:a cover configured to seal off an adhesive film between the base belt and the polishing pad from moisture intrusion.
- 12. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 1, wherein the base belt and the polishing pad are attached by a first adhesive film, and the reinforcement layer and the cushioning layer are attached by a second adhesive film.
- 13. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising:a polishing pad, the polishing pad being shaped like a belt and configured to have no seams; and a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a steel layer; wherein the cushioning layer is an intermediary layer between the continuous pad and the reinforcement layer.
- 14. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 13, wherein the polishing pad is a polymeric material.
- 15. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 13, wherein the polishing pad is between about 30 mils and about 100 mils in thickness.
- 16. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 13, wherein the cushioning layer is between about 10 mils and about 100 mils in thickness.
- 17. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 13, wherein the reinforcement layer is between about 5 mils and about 50 mils in thickness.
- 18. A polishing structure for utilization in chemical mechanical polishing, comprising:a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit, the polishing pad being made of a polymeric material; and a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a steel layer; wherein the cushioning layer is an intermediary layer between the polishing pad and the reinforcement layer, the cushioning layer being a polymeric material.
- 19. A polishing structure for utilization in chemical mechanical polishing as recited in claim 18, wherein the steel layer and the cushioning layer are attached by a first adhesive film, and the cushioning layer and the polishing pad are attached by a second adhesive film.
- 20. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising:a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit and to have grooves on a pad surface, the polishing pad being made up of polyurethane; and a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a steel layer, the reinforcement layer and the cushioning layer being attached by way of a first adhesive film, the base belt and the polishing pad being attached by way of a second adhesive film; wherein the cushioning layer is an intermediary between the polishing pad and the reinforcement layer, the cushioning layer being a polyurethane material.
- 21. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 20, wherein the polishing pad is between about 40 mils in thickness.
- 22. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 20, wherein the cushioning layer is about 20 mils in thickness.
- 23. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 20, wherein the reinforcement layer is about 20 mils in thickness.
- 24. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising:a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit; a base belt, the base belt including a reinforcement layer and a cushioning layer; and a cap covering an adhesive film between the base belt and the polishing pad; wherein the cushioning layer is an intermediary between the continuous pad and the base belt.
- 25. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 24, wherein the polishing pad is polyurethane.
- 26. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in claim 24, wherein the reinforcement layer is a steel layer.
- 27. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising:a polishing pad, the polishing pad being shaped like a belt and configured to have no seams, and the polishing pad being made of a polymeric material, and the polishing pad being between about 30 mils and about 100 mils in thickness and configured to have a grooved top surface; and a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a stainless steel layer, and the cushioning layer being between about 10 mils and about 100 mils in thickness, and the reinforcement layer being between about 5 mils and 50 mils in thickness; wherein the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.
- 28. A method for generating a polishing pad structure for utilization in chemical mechanical polishing, comprising:providing a reinforcement layer; applying a first adhesive film over the reinforcement layer; attaching a cushioning layer on the first adhesive film; applying a second adhesive film over the cushioning layer; attaching a seamless polishing pad on the second adhesive film; and curing the polishing pad structure.
- 29. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 28 wherein the reinforcement layer is a steel layer.
- 30. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 28 wherein the first adhesive layer and the second adhesive layer is a rubber based adhesive.
- 31. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 28 wherein the seamless polishing pad is generated by pouring a polymeric gel into a mold.
- 32. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 28 wherein the seamless polishing pad is a polymeric material.
- 33. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in claim 28 wherein the curing includes heating the polishing pad structure.
- 34. A method for generating a polishing pad structure for utilization in chemical mechanical polishing, comprising:providing a reinforcement layer; applying a first adhesive film on the reinforcement layer; attaching a cushioning layer on the first adhesive film; applying a second adhesive film on the cushioning layer; attaching a seamless polymeric polishing pad on the second adhesive layer, the polymeric polishing pad having a grooved top surface; and curing the polishing pad structure between about 12 hours to about 48 hours at a temperature of between about 150 F to 300 F.
- 35. A method for generating a polishing pad structure for utilization in chemical mechanical polishing, comprising:providing a reinforcement layer; applying a first adhesive film on the reinforcement layer; attaching a cushioning layer on the first adhesive film; applying a second adhesive film on the cushioning layer; attaching a seamless polymeric polishing pad on the second adhesive layer, the polymeric polishing pad having a grooved top surface, the seamless polishing pad being generated by pouring a polymeric gel into a mold; and curing the polishing pad structure for about 20 hours in a temperature of about 200 F.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is related to U.S. patent application Ser. No. 09/752,703, filed on Dec. 27, 2000, entitled “METHODS FOR MAKING REINFORCED WAFER POLISHING PADS UTILIZING DIRECT CASTING AND APPARATUSES IMPLEMENTING THE SAME.”
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