The present invention relates to a micromechanical component. In addition, the present invention relates to a method for producing a micromechanical component.
In German Published Patent Application No. 10 2011 006 598, components are described having a movable part, and methods for operating a component having a movable part are described. In order to move the movable part, in each case at least one subunit of at least one flexible connecting component via which the movable part is connected to a holder is set into a first oscillatory movement along a first axis and into a second oscillatory movement along a second axis oriented so as to be inclined relative to the first axis. This brings it about that the movable part, relative to the holder, is capable of being set into a rotary oscillatory movement about a first axis of rotation and in addition to the rotary oscillatory movement can also be deflected about a second axis of rotation.
The present invention creates a micromechanical component and a method for producing a micromechanical component.
The present invention creates micromechanical components having a movable part that, relative to a holder of the micromechanical component, can be moved by a resonant oscillatory movement about a comparatively large “resonant” angle of rotation and at the same time by a quasi-static oscillatory movement about a large “static” angle of rotation. Moreover, through the present invention micromechanical components can also be realized in which the movable part can be moved by two resonant oscillatory movements. Through the present invention, micromechanical components can in particular be designed such that large amplitudes for the resonant oscillatory movement of the movable part can be achieved, and at the same time also a resetting force/spring resetting force that is as small as possible counteracts a constant deflection of the movable part by the quasi-static oscillatory movement. As is stated more precisely below, above all through an advantageous coupling/connection of the movable part to the respective suspension structure of the micromechanical component, a resonance increase can be produced during the resonant oscillatory movement of the movable part relative to the holder. The movable part can therefore be moved by comparatively large “resonant” and “static” angles of rotation about the two axes of rotation, thereby achieving an increase of a maximum possible angle of rotation for the micromechanical component.
As is stated more precisely below, the micromechanical components realized according to the present invention can have a comparatively simple design. The micromechanical components realized according to the present invention are therefore comparatively easy to produce. In addition, comparatively simple user electronics can be used to operate the micromechanical components realized according to the present invention.
The present invention also creates micromechanical components in which three degrees of rotational freedom are realized for moving the movable part relative to the holder. Moreover, for all three degrees of rotational freedom, relatively large “resonant” and/or “static” angles of rotation of the movable part can be carried out relative to the holder.
In an advantageous specific embodiment, the suspension structure includes at least one bending beam. The at least one bending beam can reliably be set into self-oscillation by the at least one actuator device, a bearing of the at least one oscillation point of the induced self-oscillations being easily ascertainable. Moreover, given a suspension structure having the at least one bending beam, oscillation node points of a plurality of self-oscillations can also be situated at the same location.
For example, the single bending beam of the suspension structure, or at least one of the bending beams of the suspension structure, can run without interruption along a specified beam longitudinal axis. The respective bending beam is thus comparatively easy to realize. For example, such a bending beam can be structured out from a semiconductor layer using easily realizable etching methods.
In a further advantageous specific embodiment, the single bending beam of the suspension structure, or at least one of the bending beams of the suspension structure, has an inner frame situated between a first beam segment and a second beam segment, on which frame the movable part is suspended. In particular, the first beam segment and the second beam segment can run along a first spatial direction, the movable part being suspended on the inner frame via the at least one spring, which extends along a second spatial direction running perpendicular to the first spatial direction. Such a suspension structure fashioned in this way is also easy to produce/etch, and ensures good movability of the movable part relative to the holder, for example in the first spatial direction and in the second spatial direction.
Likewise, the single bending beam of the suspension structure, or at least one of the bending beams of the suspension structure, can be fashioned with a meander shape. A meander-shaped bending beam can also be set into self-oscillations, the self-oscillations (due to the fact that the meander-shaped bending beam can be made long) counteracting a comparatively small resetting force. Although the meander-shaped bending beam for reducing the resetting force can be made comparatively long, a space-saving design is easy to realize at the micromechanical component.
The single bending beam of the suspension structure, or at least one of the bending beams of the suspension structure, can contact the holder with an anchoring region. Alternatively to this, the single bending beam of the suspension structure, or at least one of the bending beams of the suspension structure, can also be connected to the holder via at least one external spring.
The at least one external spring can for example be at least one torsion spring, at least one meander-shaped spring, at least one U-spring, and/or at least one double U-spring. In this way, a multiplicity of easily structurable external springs can be used to suspend the at least one bending beam on the holder. However, shapes deviating from the examples listed here are also possible for the at least one external spring.
The advantages described above can also be realized in an embodiment of the corresponding production method for a micromechanical component. It is to be noted that the production method can be further developed in accordance with the specific embodiments described above of the micromechanical component.
The micromechanical component shown schematically in
Movable part 12 is suspended on holder 10 at least by a suspension structure 16. In the specific embodiment of
In the specific embodiment of
The micromechanical component also includes at least one actuator device 22a, 22b, and 24. The at least one actuator device 22a, 22b, and 24 is designed such that during an operation of the at least one actuator device 22a, 22b, and 24 at least one first subsegment 26a of suspension structure 16 can be set into a first harmonic oscillatory movement along a first axis of oscillation 28a. At the same time, by the operation of the at least one actuator device 22a, 22b, and 24 at least one second subsegment 26b of suspension structure 16 can be set into a second harmonic oscillatory movement along a second axis of oscillation 28b oriented at an incline to first axis of oscillation 28a. Axes of oscillation 28a and 28b are preferably oriented perpendicular to one another. In particular, in the specific embodiment of
This can also be described by saying that actuator device 22a, 22b, and 24 produces at least one oscillation of bending beam 16 in at least one plane of oscillation. The modes of oscillation induced by actuator device 22a, 22b, and 24 are shown for one plane of oscillation in
The actuator principle used can also be described by saying that two translational sinusoidal movements/oscillatory movements of sub-segments 26a and 26b are produced, which are preferably oriented perpendicular to one another. As explained in more detail below, these movements/oscillatory movements of sub-segments 26a and 26b can be used to move movable part 12.
Using the at least one actuator device 22a, 22b, and 24, self-oscillations S1 through S3 can be induced in suspension structure 16/bending beam 16, in the manner described above. In particular, it is possible to induce both self-oscillations of suspension structure 16/bending beam 16 in a first plane spanned by first spatial direction x and first axis of oscillation 28a, and also self-oscillations S1 through S3 of suspension structure 16/bending beam 16 in a second plane spanned by first spatial direction x and second axis of oscillation 28b. (The actual oscillatory behavior of suspension structure 16/bending beam 16 corresponds to a superposition of the various induced self-oscillations.)
The length L of bending beam 16 (or, respectively, its width and/or its height) can in particular be selected such that oscillation node points P2, P31, and P32 of self-oscillations S1 through S3 in the second plane (spanned by first spatial direction x and second axis of oscillation 28b) coincide with oscillation node points of self-oscillations in the first plane (spanned by first spatial direction x and first axis of oscillation 28a). For example for oscillation node point P2 of second self-oscillation S2, this can be realized at ¾ L, or can be realized at ½ L and 21/24 L for the two oscillation node points P31 and P32 of third self-oscillation S3.
Movable part 12 is connected via the at least one spring 20 to at least one oscillation node point P2, P31, and P32 of at least one of the induced self-oscillations S1 through S3 of suspension structure 16. (The at least one spring 20 thus contacts the at least one oscillation node point P2, P31, and P32 of the induced self-oscillations S1 through S3 of suspension structure 16.) Preferably, movable part 12 is connected via the at least one spring 20 to at least one oscillation node point P2, P31, and P32 of at least one of the induced self-oscillations S1 through S3 of suspension structure 16 in the second plane (oriented perpendicular to second spatial direction y′). Preferably, a connection of movable part 12 via the at least one spring 20 is made at at least one point of bending beam 16/suspension structure 16 at which oscillation node points P2, P31, and P32 of self-oscillations S1 through S3 in the second plane coincide with oscillation node points of self-oscillations in the first plane.
In the specific embodiment of
By the connection of movable part 12 via the at least one spring 20 to the at least one oscillation node point P2, P31, and P32 of at least one of the induced self-oscillations S1 through S3 of the bending beam/suspension structure 16, it can be reliably ensured that movable part 12 can be set into a resonant oscillatory movement about the second spatial direction y′, as a first axis of rotation 34a (relative to holder 10), by suspension structure 16 set into self-oscillations S1 through S3.
Moreover, the self-oscillations of bending beam 16/suspension structure 16 in the first plane (spanned by first spatial direction x and first axis of oscillation 28a) also produce a force F on movable part 12 that can be set into the resonant oscillatory movement (about a first axis of rotation 34a). Force F is proportional to the product of a first deflection amplitude of bending beam 16/suspension structure 16 in the first plane and a second deflection amplitude of bending beam 16/suspension structure 16 in the second plane. Moreover, force F is oriented perpendicular to the first plane. Force F therefore exerts a torque on movable part 12. Movable part 12 is therefore also (relative to holder 10) capable of being set, during its resonant oscillatory movement (about first axis of rotation 34a/second spatial direction y′), into a (preferably quasi-static) oscillatory movement/rotational movement about first spatial direction x (oriented at an incline to first axis of rotation 34a) as a second axis of rotation 34b. As is shown in
In summary, movable part 12 can therefore be moved with a comparatively high frequency, which can be for example between 15-30 kHz, (relative to holder 10) about first axis of rotation 34a/second spatial direction y′, and with a significantly slower frequency, or a frequency of (almost) zero (relative to holder 10) about second axis of rotation 34b/first spatial direction x. Reference is made to the above-cited DE 10 2011 006 598 A1 for further explanation for the occurrence of the force F, which causes the quasi-static oscillatory movement of movable part 12 (relative to holder 10).
Preferably, movable part 12 is dimensioned such that its natural frequency, with regard to the resonant oscillatory movement about first axis of rotation 34a (or a multiple of this natural frequency), agrees with at least one natural frequency of a self-oscillation of bending beam 16/suspension structure 16 (or a multiple of such a natural frequency). Preferably, the respective natural frequency of movable part 12 (or a multiple of this natural frequency) agrees with at least one natural frequency of a self-oscillation of bending beam 16/suspension structure 16 in the second plane spanned by first spatial direction x and second axis of oscillation 28b (or with the multiple of such a natural frequency). In this way, an amplitude increase is easily realized when movable part 12 is moved about first axis of rotation 34a relative to holder 10. An angle α16 shown in
In the specific embodiment of
It is to be noted that the design of the at least one actuator device 22a, 22b, and 24 as (strip-shaped) piezoelements 22a, 22b, and 24 is to be interpreted only as an example. For example, it is also possible to use at least one electrode statically acting interdigital electrode, at least one plate electrode, and/or at least one electromagnetic actuation to induce the oscillatory movements of subsegments 26a and 26b.
The micromechanical component shown schematically in
A second pair of two piezoelements 40c and 40d of the four piezoelements 40a through 40d are situated on outer sides of (first) subsegment 26a, which run perpendicular to second axis of oscillation 28b.
The four piezoelements 40a through 40d are connected in such a way that, if a first piezoelement 40a and 40c of the same pair is compressed, a second piezoelement 40b and 40d of the same pair expands. Correspondingly, if first piezoelement 40a and 40c of the same pair expands, then second piezoelement 40b and 40d of the same pair is compressed. As a result, (first) subsegment 26a bends. If the two pairs of piezoelements 40a through 40d are controlled with a phase shift of 90°, there results a “hula hoop” movement of (first) subsegment 26a (or bending beam 16), indicated by arrow 42. The points of a mid-axis running centrically between the surfaces having piezoelements 40a through 40d execute an elliptical movement (preferably a circular movement) during the “hula hoop” movement. This can also be described by saying that (first) subsegment 26a is moved along first axis of oscillation 28a in the first harmonic oscillatory movement, and is moved along second axis of oscillation 28b, oriented at an incline to first axis of oscillation 28a, in the second oscillatory movement. In this way as well, the self-oscillations of bending beam 16 can be induced in the first plane, and self-oscillations S1 through S3 of bending beam 16 can be induced in the second plane. As described above, this brings about the resonant oscillatory movement of movable part 12 (relative to holder 10) about first axis of rotation 34a (or second spatial direction y′) and the quasi-static oscillatory movement of the movable part 12 (relative to holder 10) about second axis of rotation 34b (or first spatial direction x). The quasi-static oscillatory movement of movable part 12 is schematically shown (in section) in
In contrast to the specific embodiments described above, in the specific embodiment of
Through the formation of such a locally tapered segment 44, a torsional rigidity of bending beam 16 can be reduced, in particular when there is a rotational movement of bending beam 16 about first spatial direction x.
The micromechanical component shown schematically in
Movable part 12 is connected directly at at least one oscillation node point P2 of at least one of the self-oscillations S1 through S3 (inducible by the at least one actuator device (not shown)) of suspension structure 50/bending beam 50. In particular, movable part 12 can be fastened directly to an outer side of bending beam 50. As an example, in the specific embodiment of
The connection point between the movable part and bending beam 50 is preferably made small enough in surface that the oscillatory behavior of bending beam 50 is barely influenced or is not influenced. In the connection of movable part 12 at the at least one oscillation node point P2 of the at least one inducible self-oscillation of suspension structure 50/bending beam 50, it is taken into account that the position of the at least one oscillation node point P2 of the at least one inducible self-oscillation of suspension structure 50/bending beam 50 is as a rule influenced by the connection of movable part 12. Optionally, movable part 12 can also include a connection post that is anchored at the at least one oscillation node point P2 situated on the outer side of bending beam 50/suspension structure 50.
In the specific embodiment of
In this case as well, large oscillatory amplitudes for movable parts 12 can be achieved, for which reason a light beam that can be deflected by movable part 12 can be deflected over a large angle.
Bending beam 16 shown schematically in
As can be seen on the basis of
In the specific embodiment of
In addition, movable part 12 can also be connected (as shown in
In the micromechanical component shown schematically in
For completeness, it is also to be noted that in this specific embodiment as well movable part 12 can be connected to bending beam 16 without the at least one spring 20.
The micromechanical component of
Specifically, each of the external springs 52 is fashioned as a double U-spring 52. Each double U-spring 52 has two U-bends between a first spring longitudinal segment extending along the spring line and a second spring longitudinal segment extending along the spring line, fashioned relative to one another such that the U bends are oriented away from the spring line. The design described here of external springs 52 as double U-springs 52 is however to be interpreted only as an example.
By the connection at two sides of bending beam 16 to holder 10, using double U-springs 52, a comparatively soft suspension of bending beam 16 can be realized. This facilitates an excitation of hula hoop oscillation modes H1 and H2 described above, and of the torsion deflection.
In the specific embodiment of
The suspension of bending beam 16 by external springs 52 situated at a distance from end segments 32a and 32b additionally facilitates the inducement of hula hoop oscillation modes H1 and H2. In addition, the torsion deflection is also easily induced.
In the micromechanical component of
The micromechanical component of
The specific embodiment of
A respective external spring 52 is anchored at each of the two end segments 32a and 32b of bending beam 50. Via the two external springs 52, bending beam 50 is connected to holder 10. In the specific embodiment of
Moreover, the specific embodiment of
As can be seen on the basis of
The micromechanical component shown schematically in
The two bending beams 72 of suspension structure 70 are made with a meander shape. Each of the two bending beams 72 has a first end segment 72a whose anchoring region 30 contacts holder 10. Each of the springs 20 contacts at least one oscillation node point of self-oscillations, situated at a second end segment 72b of the associated bending beam 72. While the two first end segments 72a run along first spatial direction x, each of the two second end segments 72b (laterally offset to first end segments 72a) is oriented parallel to first spatial direction x. Each first end segment 72a is connected to the associated second end segment 72b via a bent intermediate segment 72c. However, it is to be noted that it is also possible for a plurality of bent intermediate segments 72c to be situated between a first end segment 72a and second end segment 72b of the same bending beam 72.
Despite the suspension at two sides of movable part 12, a “soft” suspension of movable part 12 of the micromechanical component of
Arrows 71 shown in
In the specific embodiment of
In the specific embodiment of
In the specific embodiment of
The design shown in
In the specific embodiment of
The micromechanical components described above can be used for example in a scanner. Using such a scanner, a light beam, such as a laser beam, can be deflected with a fast frequency about a first specified axis and with a lower constant frequency, or statically (as a function of the excitation frequencies and their phase relations), about a specified second axis. Alternatively, the micromechanical components described above can also be used in micromirrors, optical switches, or optical multiplexers.
All micromechanical components described above can be produced by at least the method steps St1 and St2 described in the following. However, the practicability of the production method is not limited to the production of these micromechanical components.
In method step St1, a part that is movable relative to a holder of the micromechanical component is formed, the movable part being suspended (at least) via a suspension structure on the holder. In further method step St2, at least one actuator device is formed in such a way that, by the at least one actuator device, during operation of the micromechanical component, at least one first subsegment of the suspension structure is set into a first harmonic oscillatory movement along a first axis of oscillation, and the at least one first subsegment and/or at least one second subsegment of the suspension structure is set into a second harmonic oscillatory movement along a second axis of oscillation oriented at an incline to the first axis of oscillation. In this way, self-oscillations of the suspension structure are induced such that the movable part is set, by the suspension structure set into the self-oscillations, into a resonant oscillatory movement about a first axis of rotation and into a quasi-static oscillatory movement about a second axis of rotation oriented at an incline to the first axis of rotation. In order to realize the advantages explained above, in method step St1 the movable part is connected directly or via at least one spring to at least one oscillation node point of at least one of the induced self-oscillations of the suspension structure.
The method steps St1 and St2 can be carried out in any desired sequence, or can be carried out (at least in part) simultaneously.
Number | Date | Country | Kind |
---|---|---|---|
10 2014 211 027.0 | Jun 2014 | DE | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/EP2015/059893 | 5/6/2015 | WO | 00 |