Claims
- 1. A method for constructing and using a transition metal doped laser media comprising the steps of:
a. forming a crystal of a thickness sufficient for use as a microchip lasing material, where the crystal is selected from the structures of MeZ and MeX2Z4, wherein Me is selected from the group consisting of Zn, Cd, Ca, Mg, Sr, Ba, Hg, and Pb; Z is selected from the group consisting of S, Se, Te, O and their mixtures; and X being selected from the group consisting of Ga, In, and Al; b. depositing a thin film layer of a transition metal on opposing faces of said crystal by a method selected from the group of pulsed laser deposition, cathode arc deposition, and plasma sputtering; c. annealing said crystal in an oven for a period and at a temperature sufficient to allow crystal doping by transition metal diffusion and replacement in selected regions of said crystal.
- 2. The method as defined in claim 1 further comprising, establishing an electrical field across said crystal during said annealing step to promote said transition metal diffusion.
- 3. The method as defined in claim 1 or 2 further comprising polishing the faces of said crystal after doping.
- 4. The method as defined in claim 3 wherein Me is selected from the group of Zn and Cd.
- 5. The method as defined in claim 4 wherein Z is selected from the group of S, Se and Te.
- 6. The method as defined in claim 3 wherein the crystal is ZnS and the transition metal is Cr.
- 7. The method of claim 3 wherein said crystal has a thickness of less than about 3.0 millimeters.
- 8. The method of claim 3 wherein said period ranges between three to twenty days and said temperature is approximately 830° to approximately 1100° C.
- 9. The method of claim 3 wherein said doping occurs only in defined regions near the faces of said crystals.
- 10. The method of claim 3 wherein said doping is varied across the width of said crystal by varying the diffusion gradient such that varying concentrations of transition metal substitution are created in said crystal.
- 11. The method of claim 3 further comprising depositing mirrors on said faces of said crystals subsequent to said annealing and polishing steps.
- 12. The method of claim 8 further comprising dividing said crystal into a plurality of microchip sized units having a TM:MeZ wafer with mirrors on opposing faces.
- 13. The method of claim 9 wherein each microchip sized unit has defined within said TM:MeZ wafer a doping concentration gradient.
- 14. The method of claim 3 further comprising dividing said crystal into a plurality of microchip sized units having a TM:MeZ wafer with opposing highly polished substantially parallel faces providing internal reflectance.
- 15. The method of claim 14 further comprising affixing at least one of said microchip sized units on a plate with an excitation on that plate for providing excitation energy to said microchip.
- 16. The method of claim 14 further comprising the step of providing continuous wave excitation energy to said crystal to excite a continuous wave laser output.
- 17. The method of claim 14 further comprising providing pulsed excitation energy to said crystal to excite a pulsed laser output.
- 18. A laser utilizing a laser media constructed as in claim 3 wherein said laser media has dichroic mirrors positioned on each face thereof, including an output mirror, and a continuous excitation source positioned to supply continuous wave excitation energy to said laser media to excite a continuous laser output.
- 19. A laser utilizing a laser media constructed as in claim 18 wherein said laser media is a microchip.
- 20. A laser utilizing a laser media constructed as in claim 3 where including a pumped excitation source positioned to supply pumped excitation energy to said laser media to excite a pulsed laser output.
- 21. A laser utilizing a laser media constructed as in claim 20 further comprising a set of dichoric mirrors positioned on opposite faces of said crystal.
- 22. A laser utilizing a laser media constructed as in claim 3 wherein said laser medium is a microchip mounted on a plate with an excitation source on said plate for providing excitation energy to said laser medium.
- 23. A laser as in claim 22 wherein the laser media contained Cr++ concentrations of between about 1018cm−3 to about 1020cm−3.
- 24. A laser as in claim 22 wherein the laser media is excited by an Er:glass fiber laser output and has an output tunable over a range of about 2110 to about 2840 nm.
- 25. A laser as in claim 22 wherein said laser has an output tunable between about 2000 nm and about 3500 nm.
- 26. A laser as in claim 22, wherein the laser media is coupled to external etalon cavity in combination with narrowband output coupler.
- 27. A laser as in claim 22, wherein the laser media is butt-coupled to fiber grating.
- 28. A laser as in claim 22, wherein the laser media is coupled to external grating.
- 29. A laser as in claim 22, wherein the laser media is hybridly coupled to phase array demultiplexer.
- 30. A laser as in claim 22, wherein the laser media is coupled to waveguide grating mirror.
- 31. A laser as in claim 22, where in the laser media coupled to spatially dispersive cavity to produce multifrequency or superbroadband output radiation.
- 32. A laser as in claim 22, wherein the laser media is further chip scale integrated on II-VI waveguide with other passive components of the cavity.
- 33. A laser as in claim 32, wherein the laser media is further chip scale integrated on II-VI waveguide with electrooptic modulator.
- 34. A saturable absorber material utilizing media constructed as in claim 3 further comprising a set of dichoric mirrors positioned on opposite faces of said crystal.
Parent Case Info
[0001] This patent application claims priority from provisional patent application No. 60/323,551 filed Sep. 20, 2001.
Provisional Applications (1)
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Number |
Date |
Country |
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60323551 |
Sep 2001 |
US |