Mirror image shielding structure

Abstract

A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from the detailed description given herein below for illustration only, and which thus is not limitative of the present invention, and wherein:

FIG. 1 is a stereogram of the conventional substrate architecture with embedded elements.

FIG. 2A is a stereogram of the mirror image shielding structure according to a first embodiment of the present invention.

FIG. 2B is a stereogram of the mirror image shielding structure according to a second embodiment of the present invention.

FIG. 2C is a stereogram of the mirror image shielding structure according to a third embodiment of the present invention.

FIG. 2D is a stereogram of the mirror image shielding structure according to a fourth embodiment of the present invention.

FIG. 3 is a stereogram of the mirror image shielding structure according to a fifth embodiment of the present invention.

FIG. 4 is a stereogram of another conventional substrate architecture with embedded elements.

FIG. 5 shows the experimental simulation results of the coupling effect.

FIGS. 6A and 6B show the experimental simulation results of the shielding inductance values.

FIG. 7 shows the experimental simulation results of the quality factor (Q factor).

FIG. 8 is a stereogram of the mirror image shielding structure according to a sixth embodiment of the present invention.

FIG. 9 is a stereogram of the mirror image shielding structure according to a seventh embodiment of the present invention.

Claims

1. A mirror image shielding structure, comprising: a first electronic element; anda ground shielding plane, located under the first electronic element;wherein the shape of the ground shielding plane is identical to the projection shape of the first electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the first electronic element.

2. The mirror image shielding structure as claimed in claim 1, further comprising: a second electronic element, located under the ground shielding plane.

3. The mirror image shielding structure as claimed in claim 2, wherein the second electronic element is selected from the group consisting of resistors, capacitors, inductors, and transmission lines.

4. The mirror image shielding structure as claimed in claim 2, further comprising: a first medium material, for electrically isolating the first electronic element with the ground shielding plane; anda second medium material, for electrically isolating the second electronic element with the ground shielding plane.

5. The mirror image shielding structure as claimed in claim 4, wherein the first medium material and the second medium material are made of the same material or different materials.

6. The mirror image shielding structure as claimed in claim 4, wherein the first medium material is a composite material.

7. The mirror image shielding structure as claimed in claim 1, wherein the ground shielding plane is selected from the group consisting of metal sheets and metal meshes.

8. The mirror image shielding structure as claimed in claim 1, wherein the first electronic element comprises: a plurality of sub-components;wherein the shape of the ground shielding plane is identical to the projection shape of the sub-component closest to the ground shielding plane, and the horizontal size of the ground shielding plane is greater than or equal to that of the sub-components.

9. The mirror image shielding structure as claimed in claim 8, wherein the ground shielding plane is selected from the group consisting of metal sheets and metal meshes.

10. The mirror image shielding structure as claimed in claim 8, wherein the sub-component is a metal sheet.

11. The mirror image shielding structure as claimed in claim 8, further comprising: a medium material, for electrically isolating the first electronic element with the ground shielding plane.

12. The mirror image shielding structure as claimed in claim 11, wherein the medium material is a composite material.

13. The mirror image shielding structure as claimed in claim 12, wherein the composite material comprises: a first medium, located between the sub-component and the ground shielding plane; anda second medium, located between the sub-components.

14. The mirror image shielding structure as claimed in claim 13, wherein the second medium is used to enhance the electrical characteristics of the first electronic element.

15. The mirror image shielding structure as claimed in claim 1, further comprising: a first medium, located above the ground shielding plane; anda second medium, located between the first medium and the first electronic element.

16. The mirror image shielding structure as claimed in claim 15, wherein the second medium is used to enhance the electrical characteristics of the first electronic element.

17. The mirror image shielding structure as claimed in claim 1, wherein the first electronic element is selected from the group consisting of resistors, capacitors, inductors, transmission lines, filters, balanced/unbalanced converters, couplers, and antennas.

18. The mirror image shielding structure as claimed in claim 1, wherein the horizontal size of the ground shielding plane is preferred to be 1.1 to 4 times of that of the first electronic element.