by printed shielding conductors, ground planes or power plane

Industry

CPC
H05K1/0218

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0218by printed shielding conductors, ground planes or power plane

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,205,935
- Issue date Jan 21, 2025
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,207,390
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with polymer conductive members
- Patent number 12,200,865
- Issue date Jan 14, 2025
- BizLink International Corp.
- Shi-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,148
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 12,160,947
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board for high frequency transmission and shielding method
- Patent number 12,127,331
- Issue date Oct 22, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,120,820
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Keiichi Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-ground vias for improved signal integrity for high-speed seri...
- Patent number 12,114,419
- Issue date Oct 8, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board comprising via
- Patent number 12,108,531
- Issue date Oct 1, 2024
- LG Innotek Co., Ltd
- Kyo Hun Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device
- Patent number 12,108,521
- Issue date Oct 1, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding process for SIP packaging
- Patent number 12,107,053
- Issue date Oct 1, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Juncheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit cable assembly with electromagnetic shielding
- Patent number 12,101,873
- Issue date Sep 24, 2024
- Microsoft Technology Licensing, LLC
- Jaejin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmission line and circuit board
- Patent number 12,080,935
- Issue date Sep 3, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising printed circuit board assembly
- Patent number 12,069,804
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Kyujin Kwak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scanning radar system with substrate integrated waveguides and heat...
- Patent number 12,055,654
- Issue date Aug 6, 2024
- GM CRUISE HOLDINGS LLC
- -Ing. Sebastian Mann
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board and electronic device
- Patent number 12,058,807
- Issue date Aug 6, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qianlin Pu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed communication jack
- Patent number 12,051,878
- Issue date Jul 30, 2024
- SENTINEL CONNECTOR SYSTEMS
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,048,088
- Issue date Jul 23, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,048,087
- Issue date Jul 23, 2024
- Kyocera Corporation
- Aki Kawase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board module and touch display apparatus
- Patent number 12,048,086
- Issue date Jul 23, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Xianfeng Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Axial field rotary energy device with PCB stator with thermal expan...
- Patent number 12,046,966
- Issue date Jul 23, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
- Publication number 20250018798
- Publication date Jan 16, 2025
- CPS Technology Holdings LLC
- Matthew R. TYLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
SHIELDABLE CIRCUIT BOARD STRUCTURE
- Publication number 20250016910
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...
- Publication number 20250016934
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250016909
- Publication date Jan 9, 2025
- Sumitomo Electric Industries, Ltd.
- Shun IGARASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20250015491
- Publication date Jan 9, 2025
- SAMSUNG DISPALY CO., LTD.
- Ki Seo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- Publication number 20250006647
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD LOCAL ELECTROMAGNETIC SHIELDING
- Publication number 20240431019
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED OPTICAL PACKAGE WITH CONTINUOUS RADIO FREQUENCY (RF) FLE...
- Publication number 20240431022
- Publication date Dec 26, 2024
- CIENA CORPORATION
- Maxime Jacques
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431030
- Publication date Dec 26, 2024
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...
- Publication number 20240397608
- Publication date Nov 28, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wen LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME
- Publication number 20240373547
- Publication date Nov 7, 2024
- LG ELECTRONICS INC.
- Geumsub SIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240365465
- Publication date Oct 31, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL CAVITY SURFACE EMITTING LASER DEVICE WITH AN INTEGRATED GR...
- Publication number 20240348008
- Publication date Oct 17, 2024
- Lumentum Operations LLC
- Siu Kwan CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS
- Publication number 20240341028
- Publication date Oct 10, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianfeng YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...
- Publication number 20240324106
- Publication date Sep 26, 2024
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTI...
- Publication number 20240306354
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Kwangho JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURRENT SENSOR FOR A PRINTED CIRCUIT BOARD
- Publication number 20240237215
- Publication date Jul 11, 2024
- ALSTOM HOLDINGS
- Martin Lindahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...
- Publication number 20240224410
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Jeongseok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shield Can as Stiffener on Flexible Printed Circuits
- Publication number 20240224481
- Publication date Jul 4, 2024
- Meta Platforms Technologies, LLC
- Adam Richard WEBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240206077
- Publication date Jun 20, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186261
- Publication date Jun 6, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE AREA MONITORING APPARATUS
- Publication number 20240179833
- Publication date May 30, 2024
- WIT CORPORATION
- Jae Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS

by printed shielding conductors, ground planes or power plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Module

Circuit board with polymer conductive members

Module

Circuit board with rigid portion and flexible portion having connec...

Circuit board

Electronic module

Method and procedure for miniaturing a multi-layer PCB

Electronic device

Resetting different pair skew of printed circuit board traces

Bus bar link for battery cell interconnections in a battery module

Circuit board for high frequency transmission and shielding method

Electronic device

Micro-ground vias for improved signal integrity for high-speed seri...

Circuit board comprising via

Circuit board and electronic device

Shielding process for SIP packaging

Flexible printed circuit cable assembly with electromagnetic shielding

Transmission line and circuit board

Electromagnetic wave transmission board comprising an inner board w...

Electronic device comprising printed circuit board assembly

Methods of manufacturing circuit board and circuit board assembly

Scanning radar system with substrate integrated waveguides and heat...

Circuit board and electronic device

Devices and methods related to metallization of ceramic substrates...

High speed communication jack

Circuit board

Wiring board

Circuit board module and touch display apparatus

Axial field rotary energy device with PCB stator with thermal expan...

Patents Applicationslast 30 patents

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

SHIELDABLE CIRCUIT BOARD STRUCTURE

CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...

PRINTED WIRING BOARD

DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME

CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

CIRCUIT BOARD LOCAL ELECTROMAGNETIC SHIELDING

HIGH-SPEED OPTICAL PACKAGE WITH CONTINUOUS RADIO FREQUENCY (RF) FLE...

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

Circuit board

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

High Speed Communication Jack

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

VERTICAL CAVITY SURFACE EMITTING LASER DEVICE WITH AN INTEGRATED GR...

CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS

HEAT SPREADER FOR MODIFIED EDGE COOLING

SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...

ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTI...

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

CURRENT SENSOR FOR A PRINTED CIRCUIT BOARD

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...

Shield Can as Stiffener on Flexible Printed Circuits

MANUFACTURING METHOD OF ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

LARGE AREA MONITORING APPARATUS