by printed shielding conductors, ground planes or power plane

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CPC
H05K1/0218

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0218by printed shielding conductors, ground planes or power plane

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic module
- Patent number 12,160,947
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board for high frequency transmission and shielding method
- Patent number 12,127,331
- Issue date Oct 22, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,120,820
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Keiichi Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-ground vias for improved signal integrity for high-speed seri...
- Patent number 12,114,419
- Issue date Oct 8, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board comprising via
- Patent number 12,108,531
- Issue date Oct 1, 2024
- LG Innotek Co., Ltd
- Kyo Hun Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding process for SIP packaging
- Patent number 12,107,053
- Issue date Oct 1, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Juncheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic device
- Patent number 12,108,521
- Issue date Oct 1, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit cable assembly with electromagnetic shielding
- Patent number 12,101,873
- Issue date Sep 24, 2024
- Microsoft Technology Licensing, LLC
- Jaejin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmission line and circuit board
- Patent number 12,080,935
- Issue date Sep 3, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising printed circuit board assembly
- Patent number 12,069,804
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Kyujin Kwak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scanning radar system with substrate integrated waveguides and heat...
- Patent number 12,055,654
- Issue date Aug 6, 2024
- GM CRUISE HOLDINGS LLC
- -Ing. Sebastian Mann
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board and electronic device
- Patent number 12,058,807
- Issue date Aug 6, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qianlin Pu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed communication jack
- Patent number 12,051,878
- Issue date Jul 30, 2024
- SENTINEL CONNECTOR SYSTEMS
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,048,088
- Issue date Jul 23, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,048,087
- Issue date Jul 23, 2024
- Kyocera Corporation
- Aki Kawase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board module and touch display apparatus
- Patent number 12,048,086
- Issue date Jul 23, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Xianfeng Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Axial field rotary energy device with PCB stator with thermal expan...
- Patent number 12,046,966
- Issue date Jul 23, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded printed wiring board, method for manufacturing shielded pr...
- Patent number 12,028,964
- Issue date Jul 2, 2024
- Tatsuta Electric Wire & Cable Co., Lid.
- Yuusuke Haruna
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 12,016,112
- Issue date Jun 18, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,004,296
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,991,826
- Issue date May 21, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Jongmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board assembly, display assembly and display device
- Patent number 11,991,830
- Issue date May 21, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qizhong Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...
- Publication number 20240397608
- Publication date Nov 28, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wen LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME
- Publication number 20240373547
- Publication date Nov 7, 2024
- LG ELECTRONICS INC.
- Geumsub SIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240365465
- Publication date Oct 31, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL CAVITY SURFACE EMITTING LASER DEVICE WITH AN INTEGRATED GR...
- Publication number 20240348008
- Publication date Oct 17, 2024
- Lumentum Operations LLC
- Siu Kwan CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS
- Publication number 20240341028
- Publication date Oct 10, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianfeng YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...
- Publication number 20240324106
- Publication date Sep 26, 2024
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTI...
- Publication number 20240306354
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Kwangho JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURRENT SENSOR FOR A PRINTED CIRCUIT BOARD
- Publication number 20240237215
- Publication date Jul 11, 2024
- ALSTOM HOLDINGS
- Martin Lindahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...
- Publication number 20240224410
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Jeongseok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shield Can as Stiffener on Flexible Printed Circuits
- Publication number 20240224481
- Publication date Jul 4, 2024
- Meta Platforms Technologies, LLC
- Adam Richard WEBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240206077
- Publication date Jun 20, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186261
- Publication date Jun 6, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE AREA MONITORING APPARATUS
- Publication number 20240179833
- Publication date May 30, 2024
- WIT CORPORATION
- Jae Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR STAIRCASE ANTENNAS
- Publication number 20240170847
- Publication date May 23, 2024
- Analog Devices International Unlimited Company
- Islam A. Eshrah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS INCLUDING STRUCTURES FOR SUPPRESSING RADIATION
- Publication number 20240172356
- Publication date May 23, 2024
- Intel Corporation
- Tejasweeni D LINGAYAT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
- Publication number 20240172405
- Publication date May 23, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Takahiko KATSUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS
- Publication number 20240147602
- Publication date May 2, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianfeng YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SURGE PROTECTIVE DEVICES
- Publication number 20240127991
- Publication date Apr 18, 2024
- Raycap, S.A.
- Georgios Peppas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240090121
- Publication date Mar 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD
- Publication number 20240074034
- Publication date Feb 29, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR WITH INTEGRATED GROUND PLANE
- Publication number 20240063562
- Publication date Feb 22, 2024
- Neoconix, Inc.
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20240064890
- Publication date Feb 22, 2024
- Murata Manufacturing Co., Ltd.
- Keisuke TERANISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by printed shielding conductors, ground planes or power plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module

Method and procedure for miniaturing a multi-layer PCB

Electronic device

Resetting different pair skew of printed circuit board traces

Bus bar link for battery cell interconnections in a battery module

Circuit board for high frequency transmission and shielding method

Electronic device

Micro-ground vias for improved signal integrity for high-speed seri...

Circuit board comprising via

Shielding process for SIP packaging

Circuit board and electronic device

Flexible printed circuit cable assembly with electromagnetic shielding

Transmission line and circuit board

Electromagnetic wave transmission board comprising an inner board w...

Electronic device comprising printed circuit board assembly

Methods of manufacturing circuit board and circuit board assembly

Scanning radar system with substrate integrated waveguides and heat...

Circuit board and electronic device

Devices and methods related to metallization of ceramic substrates...

High speed communication jack

Circuit board

Wiring board

Circuit board module and touch display apparatus

Axial field rotary energy device with PCB stator with thermal expan...

Shielded electronic component package

Shielded printed wiring board, method for manufacturing shielded pr...

Electronic module

Printed circuit board

Flexible printed circuit board

Flexible circuit board assembly, display assembly and display device

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

Circuit board

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

High Speed Communication Jack

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

VERTICAL CAVITY SURFACE EMITTING LASER DEVICE WITH AN INTEGRATED GR...

CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS

HEAT SPREADER FOR MODIFIED EDGE COOLING

SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...

ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTI...

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

CURRENT SENSOR FOR A PRINTED CIRCUIT BOARD

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...

Shield Can as Stiffener on Flexible Printed Circuits

MANUFACTURING METHOD OF ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

LARGE AREA MONITORING APPARATUS

APPARATUS AND METHODS FOR STAIRCASE ANTENNAS

PRINTED CIRCUIT BOARDS INCLUDING STRUCTURES FOR SUPPRESSING RADIATION

ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD

CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS

SURGE PROTECTIVE DEVICES

PRINTED CIRCUIT BOARD

ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD

ELECTRICAL CONNECTOR WITH INTEGRATED GROUND PLANE

MULTILAYER SUBSTRATE