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Buried plated through-holes

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  • CPC
  • H05K2201/09536
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09536Buried plated through-holes
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
    • Publication number 20250227841
    • Publication date Jul 10, 2025
    • TOPPAN Holdings Inc.
    • Masashi SAWADAISHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
    • Publication number 20250227842
    • Publication date Jul 10, 2025
    • TOPPAN Holdings Inc.
    • Masashi SAWADAISHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20250203776
    • Publication date Jun 19, 2025
    • Unimicron Technology Corp.
    • Chin-Sheng Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE
    • Publication number 20250133655
    • Publication date Apr 24, 2025
    • TRIPOD (WUXI) ELECTRONIC CO., LTD.
    • CHI SUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD AND COIL DEVICE
    • Publication number 20250071899
    • Publication date Feb 27, 2025
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    • Masaki MIYABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250048562
    • Publication date Feb 6, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250016917
    • Publication date Jan 9, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Uk LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
    • Publication number 20240389230
    • Publication date Nov 21, 2024
    • NVIDIA Corporation
    • Mingyi Yu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240324103
    • Publication date Sep 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240306299
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Three-Dimensional (3D) Copper in Printed Circuit Boards
    • Publication number 20240306297
    • Publication date Sep 12, 2024
    • Apple Inc.
    • Anne M. Mason
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240306296
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240224426
    • Publication date Jul 4, 2024
    • TOPPAN Holdings Inc.
    • Yuki UMEMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER WIRING BOARD
    • Publication number 20230422412
    • Publication date Dec 28, 2023
    • TOPPAN INC.
    • Akihiro HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING
    • Publication number 20230354522
    • Publication date Nov 2, 2023
    • NIPPON MEKTRON, LTD.
    • Shunsuke AOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE
    • Publication number 20230262890
    • Publication date Aug 17, 2023
    • Unimicron Technology Corp.
    • Chih-Chiang Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE
    • Publication number 20230156909
    • Publication date May 18, 2023
    • Unimicron Technology Corp.
    • Shih-Lian Cheng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR M...
    • Publication number 20220418101
    • Publication date Dec 29, 2022
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • CHENG-JIA LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS
    • Publication number 20220394848
    • Publication date Dec 8, 2022
    • STEERING SOLUTIONS IP HOLDING CORPORATION
    • Ryan D. Yaklin
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    Three-Dimensional (3D) Copper in Printed Circuit Boards
    • Publication number 20220095455
    • Publication date Mar 24, 2022
    • Apple Inc.
    • Anne M. Mason
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Hybrid Boards with Embedded Planes
    • Publication number 20210410273
    • Publication date Dec 30, 2021
    • Intel Corporation
    • Jackson Chung Peng KONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM
    • Publication number 20210161013
    • Publication date May 27, 2021
    • Huawei Technologies Co., Ltd
    • Zongxun CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
    • Publication number 20210153360
    • Publication date May 20, 2021
    • Sanmina Corporation
    • Shinichi Iketani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
    • Publication number 20200043690
    • Publication date Feb 6, 2020
    • Sanmina Corporation
    • Shinichi Iketani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
    • Publication number 20200015364
    • Publication date Jan 9, 2020
    • Sanmina Corporation
    • Shinichi Iketani
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20190254175
    • Publication date Aug 15, 2019
    • HELLA GmbH & Co. KGaA
    • Ralf Stanzmann
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING
    • Publication number 20190124773
    • Publication date Apr 25, 2019
    • Infineon Technologies Americas Corp.
    • Eung San Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
    • Publication number 20190075662
    • Publication date Mar 7, 2019
    • Sanmina Corporation
    • Shinichi Iketani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
    • Publication number 20180352658
    • Publication date Dec 6, 2018
    • Subtron Technology Co., Ltd.
    • Jing-Cyuan Yang
    • H01 - BASIC ELECTRIC ELEMENTS