Buried plated through-holes

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CPC
H05K2201/09536

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09536Buried plated through-holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure
- Patent number 12,144,113
- Issue date Nov 12, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,737,206
- Issue date Aug 22, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,631,611
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,452,214
- Issue date Sep 20, 2022
- HELLA GMBH & CO. KGAA
- Ralf Stanzmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,304,311
- Issue date Apr 12, 2022
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit board
- Patent number 11,224,123
- Issue date Jan 11, 2022
- VITESCO TECHNOLOGIES GERMANY GMBH
- Thomas Rumrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with wall-side capacitors
- Patent number 11,158,568
- Issue date Oct 26, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,037,819
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,827,615
- Issue date Nov 3, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Chan Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,820,427
- Issue date Oct 27, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,811,210
- Issue date Oct 20, 2020
- Sanmina Corporation
- Shinichi Iketani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding into printed circuit board with drilling
- Patent number 10,681,819
- Issue date Jun 9, 2020
- Infineon Technologies Austria AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 10,672,647
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film component sheet, board with built-in electronic component...
- Patent number 10,658,200
- Issue date May 19, 2020
- TDK Corporation
- Hitoshi Saita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure to dampen barrel resonance of unused portion of printed c...
- Patent number 10,595,397
- Issue date Mar 17, 2020
- Dell Products, L.P.
- Stuart Allen Berke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass substrate including passive-on-glass device and semiconductor...
- Patent number 10,523,253
- Issue date Dec 31, 2019
- QUALCOMM Incorporated
- Changhan Yun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,446,356
- Issue date Oct 15, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure
- Patent number 10,448,501
- Issue date Oct 15, 2019
- Industrial Technology Research Institute
- Shih-Hsien Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, antenna, and wireless charging device
- Patent number 10,373,757
- Issue date Aug 6, 2019
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Masahiko Kouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,362,687
- Issue date Jul 23, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuses with integrated metals
- Patent number 10,276,337
- Issue date Apr 30, 2019
- Littelfuse, Inc.
- Michael Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 10,269,619
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser diode chip on printed circuit board
- Patent number 10,257,932
- Issue date Apr 9, 2019
- Microsoft Technology Licensing, LLC
- David Mandelboum
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multilayer wiring substrate
- Patent number 10,237,973
- Issue date Mar 19, 2019
- Canon Kabushiki Kaisha
- Takashi Tokoro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,219,383
- Issue date Feb 26, 2019
- Ibiden Co., Ltd.
- Katsutoshi Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Construction of printed circuit board having a buried via
- Patent number 10,172,244
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Matteo Cocchini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,123,432
- Issue date Nov 6, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250016917
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240365468
- Publication date Oct 31, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240324103
- Publication date Sep 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306299
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20240306297
- Publication date Sep 12, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306296
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224426
- Publication date Jul 4, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING
- Publication number 20230354522
- Publication date Nov 2, 2023
- NIPPON MEKTRON, LTD.
- Shunsuke AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230262890
- Publication date Aug 17, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230156909
- Publication date May 18, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR M...
- Publication number 20220418101
- Publication date Dec 29, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS
- Publication number 20220394848
- Publication date Dec 8, 2022
- STEERING SOLUTIONS IP HOLDING CORPORATION
- Ryan D. Yaklin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20220095455
- Publication date Mar 24, 2022
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid Boards with Embedded Planes
- Publication number 20210410273
- Publication date Dec 30, 2021
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM
- Publication number 20210161013
- Publication date May 27, 2021
- Huawei Technologies Co., Ltd
- Zongxun CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20210153360
- Publication date May 20, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
- Publication number 20200043690
- Publication date Feb 6, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20200015364
- Publication date Jan 9, 2020
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20190254175
- Publication date Aug 15, 2019
- HELLA GmbH & Co. KGaA
- Ralf Stanzmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING
- Publication number 20190124773
- Publication date Apr 25, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20190075662
- Publication date Mar 7, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20180352658
- Publication date Dec 6, 2018
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...
- Publication number 20180316374
- Publication date Nov 1, 2018
- Qualcomm Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180270958
- Publication date Sep 20, 2018
- IBIDEN CO., LTD.
- Katsutoshi KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure to Dampen Barrel Resonance of Unused Portion of Printed C...
- Publication number 20180220527
- Publication date Aug 2, 2018
- DELL PRODUCTS, L.P.
- Stuart Allen Berke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
- Publication number 20170238420
- Publication date Aug 17, 2017
- David Mandelboum
- F21 - LIGHTING
Information Patent Application
STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...
- Publication number 20150319863
- Publication date Nov 5, 2015
- Dhananjaya Turpuseema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EDGE CONTACTS OF CIRCUIT BOARDS, AND RELATED APPARATUS AND METHODS
- Publication number 20150282317
- Publication date Oct 1, 2015
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Buried plated through-holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board structure

Wafer level chip scale packaging intermediate structure apparatus a...

Three-dimensional (3D) copper in printed circuit boards

Circuit board structure

Wafer level chip scale packaging intermediate structure apparatus a...

Printed circuit board

Simultaneous and selective wide gap partitioning of via structures...

Circuit board

Package with wall-side capacitors

Wafer level chip scale packaging intermediate structure apparatus a...

Printed circuit board

Simultaneous and selective wide gap partitioning of via structures...

Multilayer printed circuit board via hole registration and accuracy

Method of manufacturing a component embedded package carrier

Embedding into printed circuit board with drilling

Wafer level chip scale packaging intermediate structure apparatus a...

Thin film component sheet, board with built-in electronic component...

Structure to dampen barrel resonance of unused portion of printed c...

Glass substrate including passive-on-glass device and semiconductor...

Multilayer printed circuit board via hole registration and accuracy

Circuit structure

Printed circuit board, antenna, and wireless charging device

Simultaneous and selective wide gap partitioning of via structures...

Fuses with integrated metals

Wafer level chip scale packaging intermediate structure apparatus a...

Laser diode chip on printed circuit board

Multilayer wiring substrate

Printed wiring board and method for manufacturing the same

Construction of printed circuit board having a buried via

Simultaneous and selective wide gap partitioning of via structures...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING SUBSTRATE

Three-Dimensional (3D) Copper in Printed Circuit Boards

WIRING SUBSTRATE

WIRING SUBSTRATE

MULTILAYER WIRING BOARD

FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING

CIRCUIT BOARD STRUCTURE

CIRCUIT BOARD STRUCTURE

MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR M...

SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS

Three-Dimensional (3D) Copper in Printed Circuit Boards

Hybrid Boards with Embedded Planes

PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

PRINTED CIRCUIT BOARD

EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

GLASS SUBSTRATE INCLUDING PASSIVE-ON-GLASS DEVICE AND SEMICONDUCTOR...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Structure to Dampen Barrel Resonance of Unused Portion of Printed C...

LASER DIODE CHIP ON PRINTED CIRCUIT BOARD

STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...

EDGE CONTACTS OF CIRCUIT BOARDS, AND RELATED APPARATUS AND METHODS