The disclosure pertains to microlithography (transfer of a fine pattern by an energy beam to a substrate that is “sensitive” to exposure by the energy beam). Microlithography is a key technology used in the manufacture of microelectronic devices such as integrated circuits, displays, magnetic pickup heads, and micromachines. More specificically, the disclosure pertains to microlithography in which the energy beam is a “soft X-ray” beam (also termed an “extreme ultraviolet” or “EUV” beam), to EUV optical systems in general, and to optical components (specifically reflective elements) used in EUV optical systems.
As the size of circuit elements in microelectronic devices (e.g., integrated circuits) has continued to decrease, the inability of optical microlithography (microlithography performed using ultraviolet light) to achieve satisfactory resolution of pattern elements is increasingly apparent. Tichenor et al., Proc. SPIE 2437: 292 (1995).
Hence, intense effort currently is being expended to develop a practical “next-generation” microlithography technology that can achieve substantially greater resolution than obtainable with optical microlithography. A principal candidate next-generation microlithography involves the use of extreme ultraviolet (“EUV”; also termed “soft X-ray”) radiation as the energy beam. The EUV wavelength range currently being investigated is 11-14 nm, which is substantially shorter than the wavelength range (150-250 nm) of conventional “vacuum” ultraviolet light used in current state-of-the-art optical microlithography. EUV microlithography has the potential to yield an image resolution of less than 70 nm, which is beyond the capacity of conventional optical microlithography.
In the EUV wavelength range, the refractive index of substances is very close to unity. Hence, in this wavelength range, conventional optical components that rely upon refraction cannot be used. Consequently, optical elements for use with EUV are limited to reflective elements, such as glancing-incidence mirrors that exploit total reflection from a material having a refractive index slightly less than unity, and “multilayer” mirrors. The latter achieve a high overall reflectivity by aligning and superposing the phases of weakly reflected light from the respective interfaces of multiple thin layers, wherein the weakly reflected fields add constructively at certain angles (producing a Bragg effect). For example, at a wavelength near 13.4 nm, a Mo/Si multilayer mirror (comprising alternatingly stacked molybdenum (Mo) and silicon (Si) layers) exhibits a reflectivity of 67.5% of normal-incidence EUV light. Similarly, at a wavelength near 11.3 nm, a Mo/Be multilayer mirror (comprising alternatingly stacked Mo and beryllium (Be) layers) exhibits a reflectivity of 70.2% of normal-incidence EUV light. See, e.g., Montcalm, Proc. SPIE 3331: 42 (1998).
An EUV microlithography system principally comprises an EUV source, an illumination-optical system, a reticle stage, a projection-optical system, and a substrate stage. For the EUV source, a laser-plasma light source, a discharge-plasma light source, or an external source (e.g., electron-storage ring or synchrotron) can be used. The illumination-optical system normally comprises: (1) a grazing-incidence mirror that reflects EUV radiation, from the source, incident at a grazing angle of incidence on the reflective surface of the mirror, (2) multiple multilayer mirrors of which the reflective surface is a multilayer film, and (3) a filter that only admits the passage of EUV radiation of a prescribed wavelength. Thus, the reticle is illuminated with EUV radiation of a desired wavelength.
Because no known materials can transmit EUV radiation to any useful extent, the reticle is a “reflection” reticle rather than a conventional transmissive reticle as used in optical microlithography. EUV radiation reflected from the reticle enters the projection-optical system, which focuses a reduced (demagnified) image of the illuminated portion of the reticle pattern on the substrate. The substrate (usually a semiconductor “wafer”) is coated on its upstream-facing surface with a suitable resist so as to be imprintable with the image. Because EUV radiation is attenuated by absorption by the atmosphere, the various optical systems, including the reticle and substrate, are contained in a vacuum chamber evacuated to a suitable vacuum level (e.g., 1×10−5 Torr or less).
The projection-optical system typically comprises multiple multilayer mirrors. Because the maximal reflectivity of a multilayer mirror to EUV radiation currently achievable is not 100%, to minimize the loss of EUV radiation during propagation through the projection-optical system, the system should contain the fewest number of multilayer mirrors as possible. For example, a projection-optical system consisting of four multilayer mirrors is described in Jewell and Thompson, U.S. Pat. No. 5,315,629, and Jewell, U.S. Pat. No. 5,063,586, and a projection-optical system consisting of six multilayer mirrors is described in Williamson, Japan Kôkai Patent Publication No. Hei 9-211332 and U.S. Pat. No. 5,815,310.
In contrast to a refractive optical system through which the light flux propagates in one direction, in a reflective optical system, the light flux typically propagates back-and-forth from mirror to mirror as the flux propagates through the system. Due to the need to avoid diminution of the light flux by the multilayer mirrors as much as possible, it is difficult to increase the numerical aperture (NA) of a reflective optical system. For example, in a conventional four-mirror optical system, the maximum obtainable NA is 0.15. In a conventional six-mirror optical system, a considerably higher NA (e.g., 0.25) can be obtained. Normally, the number of multilayer mirrors in the projection-optical system is an even number, which allows the reticle stage and substrate stage to be disposed on opposite sides of the projection-optical system.
In view of the constraints discussed above, in an EUV projection-optical system aberrations must be corrected using a limited number of reflective surfaces. Due to the limited ability of a small number of spherical-surface mirrors in achieving adequate correction of aberrations, the multilayer mirrors in the projection-optical system normally have aspherical reflective surfaces. Also, the projection-optical system normally is configured as a “ring-field” system in which aberrations are corrected only in the vicinity of a prescribed image height. With such a system, to transfer the entire pattern on the reticle onto the substrate, exposure is conducted by moving the reticle stage and substrate stage at respective scanning velocities that differ from each other by the demagnification factor of the projection-optical system.
The EUV projection-optical system described above is “diffraction-limited” and cannot achieve its specified performance level unless the wavefront aberration of EUV radiation propagating through the system can be made sufficiently small. An allowable value for the wavefront aberration for diffraction-limited optical systems normally is less than or equal to {fraction (1/14)} of the wavelength used, in terms of a root-mean-square (RMS) value, according to Marechal's criterion. Born and Wolf, Principles of Optics, 7th ed., Cambridge University Press, p. 528 (1999). The Marechal's condition is necessary to achieve a Strehl intensity of 80% or greater (the ratio between maximum point-image intensities for an optical system having aberrations versus an aberration-free optical system). For optimal performance, the projection-optical system for an actual EUV microlithography apparatus desirably exhibits aberrations sufficiently reduced so as to fit within this criterion.
As noted above, in EUV microlithography technology that is the object of intensive research efforts, an exposure wavelength mainly in the range of 11 nm to 13 nm is used. With respect to the wavefront aberration (WFE) in an optical system, the maximal profile error (FE) that can be allowed per multilayer mirror is expressed as follows:
FE=(WFE)/2/(n)1/2 (1)
wherein n denotes the number of multilayer mirrors in the optical system. The reason for dividing by 2 is that, in a reflective optical system, both the incident light and the reflected light are subject to profile errors; hence, an error of twice the profile error is applied to the wavefront aberration. In a diffraction-limited optical system, the profile error (FE) allowable per multilayer mirror can be expressed in terms of the wavelength λ and the number (n) of multilayer mirrors:
FE=λ/28/(n)1/2 (2)
At λ=13 nm the value of FE is 0.23 nm RMS for an optical system consisting of four multilayer mirrors, and 0.19 nm RMS for an optical system consisting of six multilayer mirrors.
Unfortunately, it is extremely difficult to fabricate such high-precision aspherical multilayer mirrors, which is a major factor currently hampering efforts to commercialize EUV microlithography. To date, the maximum mechanical accuracy with which aspherical multilayer mirrors can be fabricated is 0.4 to 0.5 nm RMS. Gwyn, Extreme Ultraviolet Lithography White Paper, EUV LLC, p. 17 (1998). Thus, commercial realization of EUV microlithography still requires substantial improvements in machining technology and measurement techniques for aspherical multilayer mirrors.
Recently, an important technique was disclosed offering prospects of correcting sub-nanometer profile errors of a multilayer mirror. Yamamoto, 7th International Conference on Synchrotron Radiation Instrumentation, Berlin, Germany, Aug. 21-25, 2000, POS 2-189. In this technique the surface of a multilayer mirror is locally “shaved” one layer-pair at a time. The basic principles of this technique are described with reference to FIGS. 29(A)-29(B). Referring first to
OP=(nA)(dA)+(nB)(dB) (3)
wherein dA and dB denote the respective thicknesses of the layers A, B, such that dA+dB=d. The terms nA and nB denote the respective refractive indices of the substances A and B, respectively.
In
Δ=OP′−OP (4)
As noted above, in the EUV wavelength region, the refractive index of substances is very close to unity. Thus, Δ is small, which offers the prospect of making accurate wavefront-profile corrections using this method.
For example, consider a Mo/Si multilayer mirror irradiated at a wavelength of 13.4 nm. At direct (normal) incidence, let d=6.8 nm, dMo=2.3 nm, and dSi=4.5 nm. At λ=13.4 nm, nMo=0.92 and nSi=0.998. Calculating optical path lengths yields OP=6.6 nm, OP′=6.8 nm, and Δ=0.2 nm. By performing a conventional surface-machining step that removes the topmost pair of layers of Mo and Si (collectively having a thickness of 6.8 nm) wavefront-profile corrections of 0.2 nm can be made. In the case of a Mo/Si multilayer film, because the refractive index of the Si layer is close to unity, changes in the optical path length mainly depend upon the presence or absence of a Mo layer rather than the respective Si layer. Therefore, when removing a surficial pair of layers from a Mo/Si multilayer film, accurate control of the thickness of the Si layer is unnecessary. For example, a dSi=4.5 nm allows a layer-removal machining step to be stopped in the middle of the Si layer. Thus, by performing layer-removal machining at an accuracy of a few nanometers, it is possible to achieve a wavefront-profile correction in the order of 0.2 nm.
The reflectivity of a multilayer mirror generally increases with the number of stacked layers, but the increase is asymptotic. I.e., upon forming a certain number of layers (e.g., about 50 layer pairs), the reflectivity of the multilayer structure becomes “saturated” at a particular constant and exhibits no further increase with additional layer pairs. Hence, with a multilayer mirror having a sufficient number of layer pairs to yield a saturated reflectivity, no significant change in reflectivity results when a few surficial layers are removed from the multilayer film.
The Yamamoto method (by removing one or more surficial pairs of layers from selected regions of the multilayer film) yields a discontinuous correction of the wavefront profile of light reflected from the mirror. For example, consider a transverse profile of a reflective-surface of a multilayer mirror as shown in
According to Yamamoto, to remove a selected region of a surficial pair of layers, a mask technique is used, as shown in
For clarity, in FIGS. 29(A)-29(B), 30(A)-30(B), and 31(A)-31(B), the depicted number of layers is fewer than the number that would be used in an actual multilayer mirror.
Corrections of a reflected wavefront performed according to Yamamoto produces on-surface discontinuous phases of reflected waves, especially at the edges of regions in which a surficial pair of layers has been removed. This results in a jagged (discontinuous) cross-sectional profile of the reflection wavefront. A discontinuous reflection wavefront can produce unexpected phenomena, such as diffraction, that degrades the performance of the optical system and seriously compromises any prospect of achieving a desired high resolution. As a result, a correction of less than 0.2 nm cannot be achieved.
In other words, with a target profile error of 0.19-0.23 nm RMS for an EUV optical system (see Equation (2), above), the unit of machining according to Yamamoto is in the order of 0.2 nm, as noted above. Hence, because the Yamamoto technique is inadequate for achieving the target profile error of the optical system, there is a need for methods that achieve more accurate machining of the multilayer-mirror surface.
Furthermore, when removing selected local regions of surficial layers as described above, the local regions can be shaved unequally by the ion beam. As a result, the machined surface can include portions in which substance A is exposed and other portions in which substance B is exposed, wherein the thickness of these exposed regions is not uniform. In these situations, the reflectivity of EUV radiation from the mirror surface exhibits a distribution and this is not constant over the surface of the multilayer mirror. Generally, a substance such as Mo is the topmost layer. If the thickness of the exposed Mo layer is approximately equal to the thickness of each of the other Mo layers in the periodic multilayer structure, then an increase in the thickness of Mo increases the reflectivity. On the other hand, if Si is the topmost layer, then the reflectivity decreases with an increase in the number of Si layers. Furthermore, in regions in which Mo is exposed, the exposed Mo tends to oxidize, which reduces the EUV reflectivity of the regions.
Hence, whenever local machining is conducted on a Mo/Si multilayer film (normally having a pre-machining uniform in-surface reflectivity distribution), such that the multilayer film surface is machined unevenly, an uneven in-surface reflectivity of the multilayer film surface results. If the multilayer mirror is used in a reduction projection-exposure system using EUV radiation, if an in-surface reflectivity distribution is created on a multilayer mirror used in such an optical system, then illumination irregularities in the exposure field and non-uniform values of Δ can result, which reduces exposure performance. Therefore, there is a need for methods for reducing the in-surface reflectivity distribution for a multilayer film on which localized machining has been conducted.
In addition, accurate surficial machining requires that required corrections be determined accurately in advance of machining. Fizeau interferometers using visible light (e.g., He—Ne laser light) have been used widely for performing measurements of surface profiles. The accuracy of such measurements, however, usually is inadequate for meeting modern accuracy requirements. Also, a conventional visible-light interferometer cannot be used for measuring a surface “corrected” by localized removal of material from the multilayer-film surface. This is because the profile of a reflected visible light wavefront is different from the profile of a reflected wavefront at an EUV wavelength.
In view of the shortcomings of conventional methods and multilayer mirrors produced thereby, the present invention in its various aspects provides multilayer mirrors that can produce a reflected wavefront having reduced aberrations than conventional multilayer mirrors, without reducing reflectivity of the mirror to EUV radiation.
According to a first aspect of the invention, methods are provided for making a multilayer mirror. In an embodiment of the methods, a stack of alternatingly superposed layers of first and second materials is formed on a surface of a mirror substrate. The first and second materials have different respective refractive indices with respect to EUV radiation. Wavefront aberrations of EUV radiation reflected from a surface of the multilayer mirror are reduced by a method including measuring (at an EUV wavelength at which the multilayer mirror is to be used) a profile of a reflected wavefront from the surface to obtain a map of the surface. The map indicates regions targeted for surficial removal of one or more layers of the multilayer film necessary to reduce wavefront aberrations of EUV light reflected from the surface. Based on the map, at least one surficial layer in each of the indicated regions is removed.
In this embodiment, the measurement step is performed “at wavelength” (i.e., at the EUV wavelength at which the mirror will be used). Desirable measurement techniques utilize a diffractive optical element, and can be any of the following: shearing interferometry, point-diffraction interferometry, the Foucalt test, the Ronchi test, and the Hartmann Test. The measurements can be performed of EUV light reflected from an individual multilayer mirror, or can be performed of EUV light transmitted through an EUV optical system including at least one subject multilayer mirror.
In an example of the latter method, the multilayer mirror is assembled into an EUV optical system that is transmissive to EUV radiation at a wavelength at which the multilayer mirror is to be used. At that EUV wavelength the profile of a wavefront transmitted through the EUV optical system is measured to obtain a map of the surface indicating regions targeted for surficial removal of one or more layers of the multilayer film necessary to reduce wavefront aberrations of EUV light reflected from the surface. Based on the map, one or more surficial layers are removed in the indicated regions.
During the layer-forming step, the stack can be formed with multiple layer pairs each including a first layer (comprising, e.g., Mo) and a second layer (comprising, e.g., Si). To provide the mirror with good reflectivity to EUV radiation, each layer pair typically has a period in a range of 6 to 12 nm.
After forming the multilayer mirror, the mirror can be incorporated into an EUV optical system, which in turn can be incorporated into an EUV microlithography system.
According to another aspect of the invention, multilayer mirrors are provided that are reflective to incident EUV radiation. An embodiment of such a mirror comprises a mirror substrate and a thin-film layer stack formed on a surface of the mirror substrate. The stack includes multiple thin-film first layer groups and multiple thin-film second layer groups alternatingly superposed relative to each other in a periodically repeating manner. Each first layer group includes at least one sublayer of a first material having a refractive index to EUV light substantially equal to the refractive index of a vacuum, and each second layer group includes at least one sublayer of a second material and at least one sublayer of a third material. The first and second layer groups in this embodiment are alternatingly superposed relative to each other in a periodically repeating configuration. The second and third materials have respective refractive indices that are substantially similar to each other but that are different from the refractive index of the first material sufficiently such that the stack is reflective to incident EUV light. The second and third materials have differential reactivities to sublayer-removal conditions such that a first sublayer-removal condition will preferentially remove a sublayer of the second material without substantial removal of an underlying sublayer of the third material. Similarly, a second sublayer-removal condition will preferentially remove a sublayer of the third material without substantial removal of an underlying sublayer of the second material. Typically, the second material can be Mo, the third material can be Ru, and the first material can be Si.
Each second layer group can comprise multiple sublayer sets each comprising a sublayer of the second material and a sublayer of the third material. The sublayers in this configuration are alternatingly stacked to form the second layer group.
In another embodiment of methods according to the invention, on a surface of a mirror substrate, a thin-film layer stack (including multiple thin-film first layer groups and multiple thin-film second layer groups alternatingly superposed relative to each other) are formed in a periodically repeating configuration. Each first layer group includes at least one sublayer of a first material having a refractive index to EUV light substantially equal to the refractive index of a vacuum, and each second layer group includes at least one sublayer of a second material and at least one sublayer of a third material. The first and second layer groups are alternatingly superposed relative to each other in a periodically repeating configuration. The second and third materials have respective refractive indices that are substantially similar to each other but different from the refractive index of the first material sufficiently such that the stack is reflective to incident EUV light. The second and third materials have differential reactivities to sublayer-removal conditions such that a first sublayer-removal condition will preferentially remove a sublayer of the second material without substantial removal of an underlying sublayer of the third material, and a second sublayer-removal condition will preferentially remove a sublayer of the third material without substantial removal of an underlying sublayer of the second material. In selected regions of a surficial second layer group, one or more sublayers of the surficial second layer group are selectively removed so as to reduce wavefront aberrations of EUV radiation reflected from the surface. Removing one or more sublayers of the surficial second layer group can yield a phase difference in EUV components reflected from the indicated regions, compared to EUV light reflected from other regions in which no sublayers are removed or a different number of sublayers are removed. Removing one or more sublayers of the surficial second group layer can comprise selectively exposing the indicated regions to one or both the first and second sublayer-removal conditions as required to achieve an indicated change in a reflected wavefront profile from the surface.
This method embodiment can further include the step of measuring a profile of a reflected wavefront from the surface to obtain a map of the surface indicated the regions targeted for removal of the one or more sublayers of the surficial second layer group.
One or more multilayer mirrors produced according to this method embodiment can be assembled into an EUV optical system, which in turn can be assembled into an EUV microlithography system.
Another embodiment of a multilayer mirror reflective to incident EUV radiation comprises a mirror substrate and a thin-film layer stack formed on a surface of the mirror substrate. The stack includes superposed first and second groups of multiple thin-film layers. Each of the first and second groups comprises respective first and second layers alternatingly superposed relative to each other in a respective periodically repeating manner. Each first layer comprises a first material having a refractive index to EUV light substantially equal to the refractive index of a vacuum, and each second layer comprises a second material having a refractive index that is different from the refractive index of the first material sufficiently such that the stack is reflective to incident EUV light. The first and second groups have similar respective period lengths but have different respective thickness ratios of individual respective first and second layers. The first material desirably is Si, and the second material desirably is Mo and/or Ru. The respective period lengths are within a range of 6 to 12 nm.
In this embodiment, if Γ1 denotes the ratio of the respective second-layer thickness to the period length of the first group, and Γ2 denotes the ratio of the respective second-layer thickness to the period length of the second group, then desirably Γ2<Γ1. Γ2 can be established such that, whenever a reflection-wavefront correction is made to the mirror by removing one or more surficial layers of the mirror, the magnitude of the correction per unit thickness of the second material is as prescribed.
In another embodiment of a method for making a multilayer mirror for use in an EUV optical system, on a surface of a mirror substrate a stack is formed that includes a first group of multiple superposed thin-film layers and a superposed second group of multiple superposed thin-film layers. Each of the first and second groups comprises respective first and second layers alternatingly superposed on each other in a respective periodically repeating configuration. Each first layer comprises a first material having a refractive index to EUV light substantially equal to the refractive index of a vacuum, and each second layer comprises a second material having a refractive index that is different from the refractive index of the first material sufficiently such that the stack is reflective to incident EUV light. The first and second groups have similar respective period lengths but have different respective thickness ratios of individual respective first and second layers. In selected regions of the surface of the stack, one or more layers of the surficial second group are removed so as to reduce wavefront aberrations of EUV light reflected from the surface.
This method can include the step of measuring a profile of a reflected wavefront from the surface to obtain a map of the surface indicating regions targeted for removal of one or more layers of the surficial second layer group as necessary to reduce wavefront aberrations of EUV light reflected from the surface. In the stack-forming step and during formation of the second group of layers, the second group can be formed having a number of respective second layers such that, during the layer-removal step, removing a surficial second layer results in a maximal phase correction of a reflection wavefront from the mirror. As noted above, the first material desirably is Si, and the second material desirably is Mo and/or Ru, wherein the respective period lengths are in a range of 6 to 12 nm.
This method can further comprise the step, after the layer-removal step, of forming a surficial layer of a reflectivity-correcting material, having a refractive index to EUV light substantially equal to the refractive index of a vacuum, at least in regions in which reflectivity has changed due to removal of one or more surficial layers during the layer-removal step. The reflectivity-correcting material desirably comprises Si.
Yet another embodiment of a multilayer mirror comprises a mirror substrate, a multilayer stack, and a cover layer. The stack includes alternatingly superposed layers of first and second materials formed on a surface of the mirror substrate. The first and second materials have different respective refractive indices with respect to EUV radiation, wherein selected regions of the multilayer mirror have been subjected to surficial-layer “shaving” so as to correct a reflected-wavefront profile from the mirror. The cover layer is formed on the surface of the stack. The cover layer is of a material exhibiting a persistent and consistently high transmissivity to electromagnetic radiation of a specified wavelength. The cover layer extends over regions of the surface of the stack including the selected regions and has a substantially uniform thickness. The stack desirably has a period length in the range of 6 to 12 nm. The first material desirably is Si or an alloy including Si, the second material desirably is Mo or an alloy including Mo, and the material of the cover layer desirably is Si or an alloy including Si. The cover layer desirably has a thickness of 1 to 3 nm or a thickness sufficient to add 1-3 nm to a period length of a surficial pair of layers including a respective layer of the first material and a respective layer of the second material.
In yet another embodiment of a method for making a multilayer mirror for use in an EUV optical system, a thin-film layer stack is formed on a surface of a mirror substrate. The stack includes multiple layers of a first material and multiple layers of a second material alternating superposed relative to one another in a periodically repeating manner. The first and second materials have different respective refractive indices with respect to EUV radiation. One or more surficial layers are removed from selected surficial regions of the multilayer mirror so as to correct a reflected-wavefront profile from the mirror. A cover layer is formed on a surface of the stack. As noted above, the cover layer is of a material exhibiting a persistent and consistently high transmissivity to electromagnetic radiation of a specified wavelength. The cover layer extends over regions of the surface of the stack including the selected surficial regions and has a substantially uniform thickness. Desirably, the stack is formed with a period length in a range of 6 to 12 nm. Further desirably, the first material is Si or an alloy including Si, the second material is Mo or an alloy including Mo, and the material of the cover layer is Si or an alloy including Si. The cover layer desirably is formed at a thickness of 1 to 3 nm or a thickness sufficient to add 1-3 nm to a period length of a surficial pair of layers including a respective layer of the first material and a respective layer of the second material.
In yet another embodiment of a method for making a multilayer mirror, on a surface of a mirror substrate a stack is formed of alternating layers of first and second materials having different respective refractive indices with respect to EUV radiation. The stack has a prescribed period length. In selected regions of the surface of the stack, one or more surficial layer pairs are removed as required to correct a reflected-wavefront profile of the surface in a manner such that edges of remaining corresponding layer pairs located outside the selected regions have a smoothly graded topology. The layer-pair-removal step can be, for example, small-tool corrective machining, ion-beam processing, or chemical-vapor machining. Desirably, the first material comprises Si and the second material comprises a material such as Mo and/or Ru. The period length desirably is 6 to 12 nm.
The invention also encompasses multilayer mirrors produced using any of the various method embodiments within the scope of the invention, as well as EUV optical systems that comprise a multilayer mirror made by such a method or otherwise is configured according to any of the mirror embodiments within the scope of the invention. The invention also encompasses EUV microlithography systems that include an EUV optical system within the scope of the invention. The multilayer mirrors, as well as EUV optical systems and EUV microlithography systems comprising the same, are especially suitable for use with EUV radiation in the 12-15 nm wavelength range.
The foregoing and additional features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
FIGS. 15(A)-15(B) are respective elevational sections comparing wavefront-correction machining for a multilayer mirror, performed according to an aspect of the invention (
FIGS. 16(A)-16(B) are respective elevational sections showing a multilayer-film-surface machining method based upon small-tool corrective machining.
FIGS. 17(A)-17(B) are respective elevational sections showing a multilayer-film-surface machining method based upon ion-beam machining.
FIGS. 18(A)-18(B) are respective elevational sections showing a multilayer-film-surface machining method based upon chemical-vapor machining (CVM).
FIGS. 25(A)-25(B) are respective elevational sections of a multilayer film before and after, respectively, being conventionally machined to control the phase of the reflection wavefront.
FIGS. 29(A)-29(B) are respective elevational sections depicting the principles of reflection-wavefront-phase correction achieved by removing a surficial layer pair of a multilayer film, according to conventional practice.
FIGS. 30(A)-30(B) are respective elevational sections showing a reflection wavefront before and after, respectively, performing wavefront-profile correction according to conventional practice.
FIGS. 31(A)-31(B) are respective elevational sections showing a conventional multilayer-film surface-machining method performed using ion-beam machining.
Various aspects of the invention are described below in the context of representative embodiments, which are not intended to be limiting in any way.
To determine an amount of correction to be made to a multilayer mirror, a reflected wavefront from the mirror is measured at the wavelength at which the multilayer mirror is to be used. General aspects of determining where on the mirror surface corrections should be made are depicted in FIGS. 1(A)-1(C), and various measurement techniques with which a profile such as the exemplary profile shown in
The profile shown in
Any of various techniques can be used to measure the profile of a reflected wavefront, at a specified wavelength, from a multilayer mirror. These techniques are summarized below.
Shearing Interferometry
Shearing interferometry is shown in
Point-Diffraction Interferometry
Point-diffraction interferometry (PDI) may be used for at-wavelength measurement of the reflected wavefront. This technique as applied to a multilayer mirror is shown in
As shown in
Foucalt Method
The Foucault method is shown in
Ronchi Test
The Ronchi Test method is depicted in
Hartman Test
The Hartman Test method is depicted in
A variation of the Hartman Test is the Shack-Hartmann Test. In the Shack-Hartman test as used for visible light, instead of the plate 26 defining an array of apertures 27 as used in the Hartman Test, a microlens array is used. The microlens array is situated at the pupil of the subject optical component. By using a zone plate instead of a microlens array, the Shack-Hartmann Test can be employed for measuring the profile of a reflected EUV wavefront.
In some cases, if a lack of accuracy is experienced in the interference-measurement techniques such as those described above, at-wavelength measurements of the reflected wavefront from a multilayer mirror can be difficult to perform. In such an instance, a mockup of an EUV optical system can be configured using suitable optical elements and the multilayer mirror to be evaluated, and at-wavelength measurements of a wavefront transmitted by the optical system. At-wavelength measurements of a wavefront transmitted by an optical system are easier to perform than measuring the surface of a multilayer mirror. The reasons for this are as follows: Most surfaces in EUV optical systems are aspherical. Aspherical surfaces are more difficult to measure than spherical surfaces. However, even though one or more surfaces of the subject optical system are aspherical, a wavefront transmitted by the optical system will be spherical and therefore easier to measure. According to Equation (1), above, the tolerance for a wavefront aberration (WFE) of an optical system is larger than the tolerance for profile error (FE) of the multilayer mirror. Thus, it is easier to measure the wavefront than to measure the mirror surface. Optical-design software can be used to compute respective corrections to be applied to the reflective surface of the mirror from the results of the transmitted wavefront-profile measurements. Subsequent procedures are similar to corresponding procedures for measuring the profile of the reflective surface of a separate multilayer mirror. Exemplary techniques for measuring a transmitted wavefront profile are summarized below:
Shearing Interferometry
Use of shearing interferometry to measure a transmitted wavefront at wavelength is shown in
Point-Diffraction Interferometry
The point-diffraction interferometry (PDI) technique is shown in
Foucalt Test
The Foucalt Test for obtaining at-wavelength measurements of a transmitted EUV wavefront is depicted in
Ronchi Test
The Ronchi Test for obtaining at-wavelength measurements of a transmitted wavefront is shown in
Hartmann Test
The Hartmann Test for obtaining at-wavelength measurements of a transmitted EUV wavefront is shown in
A variation of the Hartman Test is the Shack-Hartmann Test. In the Shack-Hartman test as used for visible light, instead of a plate 26 defining an array of apertures 27 as used in the Hartman Test, a microlens array is used. The microlens array is situated at the pupil of the subject optical system. By using a zone plate instead of a microlens array, the Shack-Hartmann Test can be employed for measuring the profile of a transmitted EUV wavefront.
Although the various test methods described above were described in the context of Mo/Si multilayer films for use in EUV microlithography at a wavelength of 13.4 nm, these parameters are not in any way intended to be limiting. The methods can be applied with equal facility to other wavelength regions and other multilayer-film materials.
The results obtained using any of the test methods described above provide a contour profile of a subject multilayer mirror or EUV optical system including one or more such mirrors. Based on the contour profile, selected region(s) of a mirror are removed in a controlled manner that results in partial or complete removal of one or more surficial layers of the multilayer film. According to one aspect of the invention, the machining yields a smooth transition from the machined region to the non-machined region.
This smooth transition is shown in
On the surface of a multilayer mirror or other reflective optical component, a smooth corrected-wavefront profile can be achieved using any of various “small-tool corrective-machining methods,” including mechanical polishing, ion-beam machining, and chemical vapor machining (CVM). Use of a mechanical polisher is shown in FIGS. 16(A)-16(B). Referring first to
Although FIGS. 16(A)-16(B) depict a polishing tool 50 having a spherical tip 51, such a tip shape is not intended to be limiting. As an alternative, the polishing tool 50 can have a disc-shaped tip, for example. With a disc-shaped polishing tool, the peripheral polishing force is less than at the center of the polishing tool, which also produces a smooth cross-sectional surface profile as shown in
FIGS. 17(A)-17(B) depict ion-beam machining using a mask 3. Unlike the method shown in FIGS. 31(A)-31(B) in which the mask 3 is situated on the surface of the multilayer film 2, the mask 3 in
FIGS. 18(A)-18(B) depict chemical-vapor machining (CVM), during which the workpiece (mirror) 54 is electrically grounded as shown. Machining is performed by positioning an electrode 55 adjacent a desired region on the surface of the multilayer film 2 while applying a radio-frequency (RF) voltage 58 (at a frequency of approximately 100 MHz) to the electrode 55. Meanwhile, a reactive-gas mixture (of, e.g., helium (He) and sulfur hexafluoride (SF6)) is discharged at the surface of the multilayer film 2 from a nozzle 56. Under such conditions between the electrode 55 and the surface of the multilayer film 2, a plasma 57 is generated. In this example, the plasma 57 includes fluorine ions that react with the surface of the multilayer film 2 and produce reaction products having a high vapor pressure. Thus, the surface of the multilayer film 2 adjacent the tip of the electrode 56 is eroded. Processing speed is a function of the density of the plasma 57, and hence is greatest directly beneath the electrode 55 and slower around the periphery of the electrode 55. The resulting differential machining rate yields a smooth elevational profile as indicated in
Although the description above is set forth in the context of a Mo/Si multilayer film on a reflective multilayer mirror intended for use with a 13.4 nm wavelength characteristic of EUV microlithography, it will be understood that this is not intended to be limiting. The same principles discussed above can be applied with equal facility to multilayer films suitable for use with other wavelengths, and made of other film materials besides Mo and Si.
In any event, by reducing the incidence of discontinuous topology when performing surficial machining of one or more layers from the surface of a multilayer film, the optical properties of the multilayer mirror are not as prone to degradation (especially by diffraction) when correcting the wavefront profile of EUV light reflected from the surface of the mirror.
Reactive-ion etching (RIE) also can be used to achieve a smooth corrected-wavefront profile from a multilayer mirror. In using this technique, different etching rates of different thin-film materials can be exploited in a useful way.
By way of example, consider a multilayer film comprising multiple layer pairs (each 6.8 nm thick) of Mo (each 2.4 nm thick) and Si (each 4.4 nm thick). A corrected surface profile of approximately 0.2 nm can be achieved by removing a surficial layer pair from the multilayer film using RIE. The resulting correction is due principally to removal of the Mo layer. However, it is difficult to stop removal of a Mo layer at a desired thickness of the Mo layer.
To provide better control of removing a desired thickness of the Mo layer, the Mo layer is configured as a layer group comprising respective sub-layers of multiple substances, wherein the layer group has a total thickness of 2.4 nm. The different substances exhibit different respective rates of erosion by RIE. By configuring each Mo layer as a respective layer group, it is possible to control the depth of etching of the layer group by RIE by exploiting the differences in the RIE properties of the sublayers.
For example, with respect to EUV radiation, Ru (ruthenium) has an index of refraction that is sufficiently close to that of Mo to allow Ru to be used as a sublayer material along with at least one sublayer of Mo. In other words, at least one surficial Mo layer in the multilayer mirror is substituted with a respective Mo “layer group” having the same total thickness (e.g., 2.4 nm) as the original Mo layer. The layer group consists of at least one sublayer of Mo and at least one sublayer of Ru. The sublayers are formed in an alternating manner with respect to the materials. Since Ru has an index of refraction close to that of Mo in the EUV region, each layer group optically behaves as a respective layer consisting only of Mo, and thus has little effect on the reflective properties of the mirror.
When performing RIE of a layer group as described above, the RIE parameters can be configured to remove Mo preferentially to Ru, or configured to remove Ru preferentially to Mo. For example, a “Mo-sublayer-removal RIE” involving reactive chemical species that react preferentially with Mo compared to Ru can be used to remove a topmost Mo sublayer. Removal of the topmost Mo sublayer exposes the underlying Ru sublayer, which is relatively resistant to the prevailing RIE conditions. Consequently, RIE-mediated removal of material from the surface of the mirror stops at the Ru sublayer. Conversely, a “Ru-sublayer-removal RIE” involving reactive chemical species that react preferentially with Ru but compared to with Mo can be used to remove a topmost Ru layer. Removal of the topmost Ru sublayer exposes the underlying Mo sublayer, which is relatively resistant to the prevailing RIE conditions. Consequently, RIE-mediated removal of material from the surface of the mirror stops at the Mo sublayer.
The selective RIE technique described above allows Mo and Ru layers to be removed selectively from a topmost layer group, one sublayer at a time. The technique is not limited, however, to layer groups each comprising only two sublayers. Each layer group alternatively can comprise multiple sublayer pairs each including a sublayer of Mo and a sublayer of Ru. For example, a layer group can comprise three layer pairs of Mo and Ru sublayers that are alternatingly stacked in the layer group to yield a total thickness of, for example, 2.4 nm for the layer group. In this example, the thickness of each individual Mo and Ru sublayer is 0.4 nm.
Continuing further with this example, if the topmost sublayer in the topmost layer group is Mo, execution of Mo-sublayer-removal RIE followed by Ru-sublayer-removal RIE can be performed to individually remove the topmost Mo sublayer followed by the topmost Ru sublayer of the layer group. Thus, a total of 0.8 nm of surficial material is removed from the layer group, leaving two pairs of Mo and Ru sublayers remaining in the layer group. By removing 0.8 nm of surficial material, a correction of 0.067 nm is made to the surface profile. If only one sublayer had been removed, a 0.033 nm correction would have been made.
Generally, if a Mo layer group is constructed by alternatingly stacking Mo and Ru sublayers for a total of z sublayers (in place of the original Mo layer), the resulting layer group would have z/2 sublayer pairs, and the thickness of each sublayer would be (2.4 nm)/z. This would provide a correction per sublayer of (0.2 nm)/z in the surface profile. By way of another example, if z=4 (two sublayer pairs), then the amount of correction would be 0.05 nm per sublayer. By way of yet another example, if z=10 (five sublayer pairs), then the amount of correction would be 0.02 nm per sublayer.
RIE is performed using halide gases, such as chlorides and fluorides, or chlorine and oxygen gases. The gases are ionized and directed onto the target surface to cause etching of the target surface. Selected combinations of target materials can be etched depending upon the particular etching gas(es) used and the material properties of the target surface to be etched. Selective etching can be conducted by using appropriate reactive gases that react rapidly with specific target materials versus reactive gases that react only slowly or not at all with the specific target materials, thereby allowing complex and detailed surficial profiles to be created. To terminate and control the etching process, a layer that is not etched by a given gas is provided as a protection sublayer so that the etching does not proceed depthwise past the protection sublayer.
In the example described above involving a layer group comprising alternating sublayers of Mo and Ru, RIE parameters can be selected that favor etching of the Mo sublayer (wherein the underlying Ru sublayer acts as a protection layer) or that favor etching of the Ru sublayer (wherein the underlying Mo sublayer acts as a protection layer). Thus, the Mo and Ru sublayers in the layer group can be removed one sublayer at a time.
Thus, in a Mo/Si layer pair in a multilayer film of a multilayer mirror, a Mo layer is replaced with a layer group consisting of at least one Mo sublayer and at least one Ru layer. By combining RIE protocols that achieve selective removal of either a topmost Mo sublayer or a topmost Ru sublayer of the topmost layer group, a smaller depthwise increment of material can be removed from the multilayer film during surficial machining, compared to the conventional 0.2-nm or greater increment that is removed using conventional methods.
Optimizing Reflectivity
As noted above, the change Δ in optical path length due to removing a layer from a multilayer film (comprised of alternating layers of substance A and substance B) can be found from the equation:
Δ=nd−(nAdA+nBdB)
wherein n denotes the refractive index of a vacuum, nA denotes the refractive index of substance A, nB denotes the refractive index of substance B, d is the period length of the multilayer film, dA denotes the thickness of a layer of substance A, and dB denotes the thickness of a layer of substance B.
To obtain high reflectivity, multilayer films generally are composed of multiple layers of a substance (e.g., Mo, Ru, or Be) having a refractive index that differs substantially from the refractive index of a vacuum and of a substance (e.g., Si) having a refractive index that differs very little from the refractive index of a vacuum. In this discussion, substance “A” is designated as having a refractive index that differs substantially from that of a vacuum, and substance “B” is designated as having a refractive index that differs very little from the refractive index of a vacuum. Let Γ denote the ratio of the thickness of a layer of substance A to the period length (d) of the multilayer film. During local machining of a multifilm mirror performed to achieve a corrected wavefront of EUV light from the mirror, a change in optical path length of the multilayer film occurs principally whenever a layer of substance A is removed. Removing a layer of substance B produces little change in optical path length. Therefore, the change, Δ, in optical path length due to the removal of one layer from the multilayer film can be minimized by reducing the value of Γ while holding d constant.
However, changing Γ changes the reflectivity of the multilayer film to EUV light. Nevertheless, there is a value of Γ (denoted Γm) corresponding to maximum reflectivity. Reducing Γ from Γm is accompanied by a rapid reduction in reflectivity. This relationship is depicted in
By way of example, and referring to
The first multilayer film 61 desirably is optimized to obtain the maximum reflectivity R. The second multilayer film 62, formed superposedly on the first multilayer film 61, desirably is configured so as to obtain the desired change Δ in optical path length. As surficial portions of the second multilayer film 62 are removed one layer at a time, the overall reflectivity of the mirror increases, as illustrated in
These changes in reflectivity of the multilayer mirror can create on-surface reflectivity irregularities after correcting the reflection wavefront profile. However, from the allowable on-surface reflectivity irregularities, optimal changes Δ in optical path length and the number of layers to be removed can be determined.
In situations in which the tolerance for on-surface reflectivity irregularities is stringent, a substance having a refractive index that differs only a small amount from the refractive index of a vacuum can be formed on the surface of the mirror after corrective machining has been performed (see below) to provide a correction ensuring uniform reflectivity. For example, at λ=13.4 nm, the refractive index of silicon is 0.998, which is virtually equal to 1. Hence, forming a surficial silicon layer causes little change in optical path length of the multilayer film of the mirror.
The absorption coefficient (“a”) of silicon is a=1.4×10−3 ((nm)−1). Upon propagating a distance x, the intensity of light diminishes by exp(−ax). For example, by forming a surficial layer of silicon that is 37 nm thick, reflectivity could be reduced by 10%. However, the resulting change Δ in optical path length resulting from forming the surficial silicon layer is 0.07 nm, which is acceptably small.
Although this embodiment was described in the context of a Mo/Si multilayer film as used with a 13.4 nm EUV wavelength, it will be understood that this is not intended to be limiting. Alternatively to the configuration discussed above other wavelength regions and other multilayer-film materials can be used. In addition, it is not necessary that the materials A, B making up the first multilayer film 61 and the second multilayer film 62 be the same.
After machining, the exposed surface of the multilayer film 65 is “coated” with a cover layer 66 of Si formed at a thickness of 2 nm, as shown in
As discussed above, the reflectivity of EUV radiation from a Si/Mo multilayer mirror is at a saturated maximum at about N=50 layer pairs. However, because surficial machining potentially can remove more than ten surface layers, a larger number such as 80 layers desirably are formed. Also, because the amount of surficial material removed by the machining step exhibits a continual change with position on the surface, the machined surface (whether of Mo or Si) has any of various profiles to which incident rays have a corresponding angle of incidence.
The surficial Si cover layer 66 achieves a uniform reflectivity of the multilayer film 65 after machining. To illustrate this effect, reference is made to
In regions in which Mo is exposed by machining, the reflectivity gradually increases with increases in the thickness of the topmost Mo layer. In this particular multilayer film, the maximal Mo-layer thickness is 2.45 nm. Hence, the maximal thickness of the topmost Mo layer is 2.45 nm. In regions in which Si is exposed by machining, the reflectivity decreases somewhat with increases in the thickness of the Si layer. At 4.55 nm, the maximal Si-layer thickness in the multilayer film, the reflectivity is equal to the original reflectivity.
In this example, the magnitude of in-surface reflectivity change is approximately 1.5%. In contrast, if a 2-nm Si cover layer 66 is formed on the surface after machining, whereas the reflectivity decreases substantially at locations where Mo was exposed at the topmost layer, the reflectivity does not decline substantially in regions where Si was exposed by machining. Hence, the magnitude of the in-surface change in reflectivity is reduced to 0.7%, which is half the change experienced with no Si cover layer 66.
In addition to the reduced change in reflectivity, the Si cover layer (especially over exposed Mo) prevents oxidation of the exposed Mo. Thus, this embodiment (which includes the Si cover layer) provides a high-precision reflection wavefront while reducing variations in reflectivity over the surface of the mirror.
The material used to form the cover layer is not limited to Si. Alternatively, the cover layer can be of various substances capable of reducing variations in reflectivity of the mirror. Hence, as a result of the presence of the cover layer, the absolute value of the reflectivity of the mirror is not reduced.
Although this embodiment is described using an example in which the multilayer mirror comprises alternating layers of Mo and Si, this is not intended to be limiting. Any of various other materials could be used, taking into account the wavelength of the intended reflected radiation from the mirror, the required thermal stability of the mirror, and other properties or prevailing conditions. In addition, individual layers are not limited to single elements; rather, any layer can be a compound of multiple elements or a mixture of multiple elements or compounds.
Although this embodiment is described in the context of a multilayer film containing 80 stacked layer pairs, this is not intended to be limiting. A multilayer film mirror can have any of various numbers of layer pairs, depending upon the specifications the mirror is intended to meet, the prevailing conditions, characteristics of the radiation to be reflected from the mirror, and other factors.
Although this embodiment is described in the context of Γ=0.35 (wherein Γ is the ratio of the thickness of the Mo layer to d, the period length of the multilayer film), this is not intended to be limiting. This ratio can be any of various other values and need not be constant throughout the full thickness of the multilayer film or over the entire surface area of the multilayer film.
A representative embodiment of an EUV optical system 90 that includes one or more multilayer mirrors configured or produced as described above is shown in
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The multilayer mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=ion-beam sputtering formed 6.8 nm. On each multilayer mirror thus formed, areas of the surface of the multilayer film to be machined were identified by analyzing the reflection wavefront produced by the mirror. As required for each multilayer mirror, the respective surfaces were corrected by locally removing one or more layers from the surface of the respective multilayer film, one layer pair at a time, using the small-tool corrective polishing method depicted in FIGS. 16(A)-16(B). Removal of a pair of layers from the multilayer film 42 changed the optical path length by 0.2 nm. For machining, the tip 51 of the polishing tool 50 comprised a polyurethane sphere 10 mm in diameter. During polishing, a liquid slurry of finely particulate zirconium oxide was used as an abrasive. The amount of machining applied to the surface of the multilayer film 42 was controlled by adjusting the axial load applied to the polishing tool 50, the rotational velocity of the polishing tool 50, and the residency time of the polishing tool 50 on the surface of the multilayer film 42. The localized machining corrected each surface to a profile error of no greater than 0.15 nm RMS.
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The multilayer mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
During fabrication of each multilayer mirror, areas of the surface of the respective multilayer film to be machined were identified by analyzing the reflection wavefront produced by the mirror. As required for each multilayer mirror, the respective surface was corrected by locally removing one or more layers from the surface of the multilayer film, one layer pair at a time, using the ion-beam machining method depicted in FIGS. 17(A)-17(B). Removal of each pair of layers from the multilayer film 2 changed the optical path length by 0.2 nm. The machining was conducted in a vacuum chamber using argon (Ar) ions produced from a Kaufman-type ion source. Because the extent of achieved ion-beam machining varies with time, local machining rates on the multilayer film were measured in advance, and the extent of machining at a given location was controlled by controlling the machining time at that location. The mask 3 was a stainless plate in which openings were formed by etching. The distance h of the mask 3 from the surface of the multilayer film 2 was optimized experimentally beforehand to achieve a smooth elevational profile of machined regions 52 of the multilayer film. The localized machining corrected each surface to a profile error of no greater than 0.15 nm RMS.
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The multilayer mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
During production of each mirror, areas of the surface of the respective multilayer film to be machined were identified by analyzing the reflection wavefront produced by the mirror. As required for each multilayer mirror, the respective surfaces were corrected by locally removing one or more layers from the surface of the multilayer film, one layer pair at a time, using the CVM method depicted in FIGS. 18(A)-18(B). Removal of each pair of layers from the multilayer film 2 changed the optical path length by 0.2 nm. The machining was conducted in a vacuum chamber using a tungsten electrode 55 having a diameter of 5 mm. An RF voltage 58 (100 MHz) was applied to the electrode 55 as a mixture of helium and SF6 was supplied to the region between the tip of the electrode 55 and the surface of the multilayer film 2. The gas mixture, ionized by the RF voltage 58 produced a plasma 57 containing fluorine ions and fluorine radicals that locally reacted with the silicon and molybdenum at the surface the multilayer film 2 and produced gaseous reaction products at room temperature. The reaction products were evacuated continuously during machining using a vacuum pump. Because the extent of achieved CVM is proportional to machining time, local machining rates on the multilayer film 2 were measured in advance, and the extent of machining at a given location was controlled by controlling the machining time at that location. The localized machining corrected each surface to a profile error of no greater than 0.15 nm RMS.
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The multilayer mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Next, the wavelength profile of the reflective surface of each multilayer mirror was measured, at λ=13.4 nm, using shearing interferometry as shown in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Next, the wavefront profile of the reflective surface of each multilayer mirror was measured, at λ=13.4 nm, using point-diffraction interferometry as shown in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Next, the wavefront profile of the reflective surface of each multilayer mirror was measured, at λ=13.4 nm, using the Foucalt Test method as shown in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Next, the wavefront profile of the reflective surface of each multilayer mirror was measured, at λ=13.4 nm, using the Ronchi Test method as shown in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Next, the wavefront profile of the reflective surface of each multilayer mirror was measured, at λ=13.4 nm, using the Hartmann Test method as shown in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Each multilayer mirror was installed in a lens barrel through which a transmitted wavefront was measured while adjusting for minimum wavefront aberrations. Measurement of the transmitted wavefront was performed at λ=13.4 nm using shearing interferometry as depicted in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Each multilayer mirror was installed in a lens barrel through which a transmitted wavefront was measured while adjusting for minimum wavefront aberrations. Measurement of the transmitted wavefront was performed at λ=13.4 nm using point-diffraction interferometry as depicted in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Each multilayer mirror was installed in a lens barrel through which a transmitted wavefront was measured while adjusting for minimum wavefront aberrations. Measurement of the transmitted wavefront was performed at λ=13.4 nm using the Foucalt Test method as depicted in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Each multilayer mirror was installed in a lens barrel through which a transmitted wavefront was measured while adjusting for minimum wavefront aberrations. Measurement of the transmitted wavefront was performed at λ=13.4 nm using the Ronchi Test method as depicted in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. First, a 50-layer multilayer film, in which d=6.8 nm, was formed by ion-beam sputtering. Each mirror was installed in a lens barrel through which a transmitted wavefront was measured while adjusting for minimum wavefront aberrations. Measurement of the transmitted wavefront was performed at λ=13.4 nm using the Hartmann Test method as depicted in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
A multilayer mirror 71 was formed (
In the figure, the region 74 has not been subjected to RIE. The region 75 has been processed by RIE to remove the topmost Si layer 72 and the first Ru sublayer 73a. The region 76 has been processed by RIE to remove not only the topmost Si layer 72 and Ru sublayer 73a but also the first Mo sublayer 73b. In the region 76, RIE has progressed to about the middle of the second Si layer 72.
As described above, removal of the Si layer 72 in the region 75 provided no significant correction. The Ru sublayer 73a removed from the region 75 had a thickness of 1.2 nm, which provided (when removed) a correction of 0.1 nm of surface profile. Similarly, the sublayers 73a, 73b removed from the region 76 had a total thickness of 2.4 nm (not including the Si layer 72), which provided (when the sublayers 73a, 73b were removed) a correction of 0.2 nm of surface profile. Although the subsequent Si layer 72 is also removed to some extent from the region 76, the removed Si does not affect the wavefront aberration of the ML mirror. Since the units of correction (0.1 nm) achieved in this example are half the conventional units of 0.2 nm, this example provided a two-fold improvement, compared to conventional methods, in the accuracy of wavefront control.
When performing RIE to remove surficial material in this example, oxygen gas was used to remove the Ru sublayer 73a. The etching of the Ru sublayer 73a stopped when etching reached the underlying Mo sublayer 73b. Thus, the removal of surficial material was controlled. To remove the Mo sublayer 73b, CF4 gas was used. Although RIE using CF4 progressed into the underlying Si layer 72 to some extent, no adverse effect was realized with respect to wavefront correction.
During RIE, the reactive gas was ionized and irradiated, resulting in a fixed direction of motion of the ions formed from the gas. Hence, regions of the surface of the multilayer film on the mirror 71 that were not to be processed by RIE were shielded with a mask. As a result, ions were irradiated only on regions that were processed by RIE. Thus, it was easy to effect processing differences among the regions 74, 75, and 76.
The corrected multilayer mirrors were assembled into an optical system of an EUV microlithography system. Using the corrected system, a line-and-space pattern resolution as small as 30 nm was observed.
A multilayer mirror 81 was formed (
In the figure, the region 84 has not been subjected to RIE. The region 85 has been processed by RIE to remove the topmost Si layer 82 and the first Ru sublayer 83a. The region 86 has been processed by RIE to remove not only the topmost Si layer 82 and Ru sublayer 83a but also the first Mo sublayer 83b. In the region 86, RIE has progressed to the next Ru sublayer 83a.
As described above, removal of the Si layer 82 in the region 85 provided no significant correction. The Ru sublayer 83a removed from the region 85 had a thickness of 0.4 nm, which provides (when removed) a correction of 0.03 nm of surface profile. Similarly, the sublayers 83a, 83b removed from the region 86 had a total thickness of 0.8 nm (not including the Si layer 82), which provided (when the sublayers 83a, 83b were removed) a correction of 0.067 nm of surface profile. Since the units of correction achieved in this example are one-sixth the conventional units of 0.2 μm, this example provided a six-fold improvement, compared to conventional methods, in the accuracy of wavefront control.
When performing RIE to remove surficial material in this example, oxygen gas was used to remove the Ru sublayer 83a. The etching of the Ru sublayer 83a stopped when etching reached the underlying Mo sublayer 83b. Thus, the removal of surficial material was controlled. To remove the Mo sublayer 83b, chlorine gas was used. RIE using chlorine gas stopped after progressing to the next underlying Ru sublayer 83a.
During RIE, the reactive gas was ionized and irradiated, resulting in a fixed direction of motion of the ions formed from the gas. Hence, regions of the surface of the multilayer film on the mirror 81 that were not to be processed by RIE were shielded with a mask. As a result, ions were irradiated only on regions that were processed by RIE. Thus, it was easy to effect processing differences among the regions 84, 85, and 86.
The corrected multilayer mirrors were assembled into an optical system of an EUV microlithography system. Using the corrected system, a line-and-space pattern resolution as small as 30 nm was observed.
In this working example a subject EUV projection-optical system (as used in an EUV microlithography apparatus) comprised six aspherical multilayer mirrors. The projection-optical system had a numerical aperture (NA) of 0.25, a demagnification ratio of 4:1, and a ring-field exposure area. The aspherical multilayer mirrors were fabricated, using conventional surface-polishing process technology, to a profile accuracy of 0.5 nm RMS. The mirrors were assembled into the projection-optical system, which exhibited a wavefront aberration of 2.4 nm RMS. For satisfactory use at a wavelength of 13.4 nm, the wavefront aberration must be about 1 nm RMS or less. Hence, the profile accuracy of the mirrors was not acceptable.
To produce each multilayer mirror, a Mo/Si multilayer film was formed on the surface of an aspherical mirror substrate. The multilayer film was in two portions. The first portion had a period length d=6.8 nm, Γ1=⅓, and N1=40 layer pairs. The second portion, formed superposedly over the first portion, had a period length d=6.8 nm, Γ2=0.1, and N2=10 layer pairs. The multilayer films were grown by ion-beam sputtering.
The reflection-wavefront profile of each multilayer mirror was measured as described above and corrected as required by removing one or more surficial layers of the respective multilayer film layer-by-layer in selected regions. Removing one layer of the second portion of the multilayer film (of which Γ2=0.1) resulted in a change of only 0.05 nm in the optical path length. By correcting the multilayer mirrors in this manner, the wavefront profile of each mirror was corrected to within 0.15 nm RMS.
The multilayer mirrors were installed in a lens barrel through which a transmitted wavefront was measured while adjusting for minimum wavefront aberrations. The measurement of transmitted wavefront was performed at λ=13.4 nm using the Hartmann Test method as depicted in
The corrected multilayer mirrors were assembled in a lens barrel and aligned with each other in a manner to minimize wavefront aberrations of the resulting projection-optical system. The obtained wavefront aberration of the system was 0.8 nm RMS, which was deemed sufficient for diffraction-limit imaging performance.
The projection-optical system thus fabricated was assembled in an EUV microlithography system, which was used for making test lithographic exposures. With the microlithography system, images of fine line-and-space patterns (having line and space widths as narrow as 30 nm) were resolved successfully.
Whereas the invention has been described in connection with multiple representative embodiments and examples, it will be understood that the invention is not limited to those embodiments and examples. On the contrary, the invention is intended to encompass all modifications, alternatives, and equivalents as may be included within the spirit and scope of the invention, as defined by the appended claims.
Number | Date | Country | Kind |
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2000-321027 | Oct 2000 | JP | national |
2000-321028 | Oct 2000 | JP | national |
2000-321029 | Oct 2000 | JP | national |
2000-321031 | Oct 2000 | JP | national |
2000-321030 | Oct 2000 | JP | national |
This application is a continuation of, and claims the benefit of, co-pending U.S. patent application Ser. No. 10/012,739, filed on Oct. 19, 2001, which is incorporated by reference herein in its entirety.
Number | Date | Country | |
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Parent | 10012739 | Oct 2001 | US |
Child | 11025002 | Dec 2004 | US |