Claims
- 1. A multiple line grid array package comprising:
a package body having a first surface and a second surface opposite to the first surface; a first pattern formed on the first surface of the package body and including a number of input/output nodes; a second pattern formed on the second surface of the package body; a lead frame having a nonconductive grid body and a number of conductors formed parallel to a longitudinal direction of the nonconductive grid body on the outer peripheral portion and/or within the inner portion of the lead frame and bonded to the package body; wherein each of conductors is electrically isolated from each other and matches the corresponding one of the number of input/output nodes of the first pattern.
- 2. The package according to claim 1, wherein the package body includes at least one layer.
- 3. The package according to claim 2, wherein the layer comprises a ceramic layer, a polymeric layer, or a composite layer of ceramics and polymers.
- 4. The package according to claim 1, wherein the nonconductive grid body of the lead frame is selected from the group consisting of a ceramic, a polymer, a composite material of ceramics and polymers, and silicon.
- 5. The package according to claim 1, wherein the lead frame is formed into one of a rectangular disc, a circular disc, a cylinder, an elliptical disc, a hexahedron disc and a cylinder.
- 6. The package to claim 5, wherein the height of the lead frame is the same as its width or longer than its width.
- 7. The package to claim 4, wherein the height of the lead frame is shorter than its width.
- 8. The package to claim 1, wherein the package body comprises at least two layers selected from the group consisting of a ceramic layer, a polymer layer, a composite layer of ceramics and polymers.
- 9. The package according to claim 1, wherein the first pattern formed the first surface of the package comprises a number of electrode lines, wire bond pads, and via hole pads and input/output modes.
- 10. The package according to claim 1, wherein each of the conductors is bonded to the corresponding input/output node by soldering.
- 11. The package according to claim 9, wherein, the input/output nodes form various configurations in the first pattern depending on the position of the corresponding conductors of the lead frame, some of the number of electrode lines are positioned in the first pattern within an area where the lead frame is located and the other of the number of electrode lines are positioned in the first pattern outside the area where the lead frame is located, some of the number of via hole pads are positioned in the first pattern within the area where the lead frame is located, and the other of the number of via hole pads are positioned in the first pattern outside the area where the lead frame is located.
- 12. The package according to claim 9, wherein the input/output nodes form various configurations in the first pattern depending on the position of the corresponding conductors of the lead frame, all the electrode lines and via hole pads are positioned in the first pattern within an area where the lead frame is located.
- 13. The pattern described in claim 11, wherein the pattern is applicable to QFP, BGA, CSP, flip chip packages and wafer level packages, printed circuit board and ceramic substrate for hybrid ICs.
- 14. The pattern described in claim 12, wherein the pattern is applicable to QFP, BGA, CSP, flip chip packages and wafer level packages, printed circuit board and ceramic substrate for hybrid ICs.
- 15. The lead frame described in claim 1, wherein the lead frame is applicable to array type packages, chip scale packages, flip chip packages, wafer level packages, and connectors.
Priority Claims (1)
Number |
Date |
Country |
Kind |
97-15770 |
Apr 1997 |
KR |
|
Parent Case Info
[0001] This application is a continuation-in-part of co-pending U.S. patent application Ser. No. 09/065,882, filed on Apr. 24, 1998, entitled MUTIPLE LINE GRID ARRAY PACKAGE AND METHOD OF MANUFACTURING THE SAME and from which priority is claimed under 35USC § 120.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09065882 |
Apr 1998 |
US |
Child |
09203196 |
Nov 1998 |
US |