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H01L2924/01087

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/01087Francium [Fr]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package and method for fabricating same
- Patent number 11,791,442
- Issue date Oct 17, 2023
- CreeLED, Inc.
- Bernd Keller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 11,411,152
- Issue date Aug 9, 2022
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package and method for fabricating same
- Patent number 10,892,383
- Issue date Jan 12, 2021
- Cree, Inc.
- Bernd Keller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 10,840,424
- Issue date Nov 17, 2020
- Bridgelux, Inc.
- R. Scott West
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip-on-board module with edge connector
- Patent number 10,622,289
- Issue date Apr 14, 2020
- Tessera, Inc.
- Wael Zohni
- G11 - INFORMATION STORAGE
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED packaging with integrated optics and methods of manufacturing t...
- Patent number 10,500,770
- Issue date Dec 10, 2019
- SO-SEMI TECHNOLOGIES, LLC
- Steven D. Oliver
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 10,347,807
- Issue date Jul 9, 2019
- BRIDGELUX INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting die (LED) packages and related methods
- Patent number 10,256,385
- Issue date Apr 9, 2019
- Cree, Inc.
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,115,658
- Issue date Oct 30, 2018
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing the same
- Patent number 9,966,504
- Issue date May 8, 2018
- SHARP KABUSHIKI KAISHA
- Masahiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical components and method of manufacture
- Patent number 9,905,928
- Issue date Feb 27, 2018
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
- Patent number 9,806,017
- Issue date Oct 31, 2017
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing the same
- Patent number 9,755,115
- Issue date Sep 5, 2017
- Sharp Kabushiki Kaisha
- Masahiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip-on-board module with edge connector
- Patent number 9,735,093
- Issue date Aug 15, 2017
- Tessera, Inc.
- Wael Zohni
- G11 - INFORMATION STORAGE
Information Patent Grant
Packaging structural member
- Patent number 9,704,726
- Issue date Jul 11, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip light emitter packages and related methods
- Patent number 9,666,762
- Issue date May 30, 2017
- Cree, Inc.
- Theodore Lowes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die stacking for two or more die
- Patent number 9,640,515
- Issue date May 2, 2017
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317244
- Publication date Nov 2, 2017
- Sharp Kabushiki Kaisha
- Masahiro KONISHI
- F21 - LIGHTING
Information Patent Application
STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR
- Publication number 20170263540
- Publication date Sep 14, 2017
- Tessera, Inc.
- Wael Zohni
- G11 - INFORMATION STORAGE
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE BASED FLIP-CHIP INTEGRATED CIRCUIT AND METHOD FOR...
- Publication number 20140362536
- Publication date Dec 11, 2014
- UMESH MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20140342476
- Publication date Nov 20, 2014
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140339594
- Publication date Nov 20, 2014
- SHARP KABUSHIKI KAISHA
- Masahiro KONISHI
- F21 - LIGHTING
Information Patent Application
Integrated Circuit Package System with Removable Backing Element Ha...
- Publication number 20140332955
- Publication date Nov 13, 2014
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20140332984
- Publication date Nov 13, 2014
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE...
- Publication number 20140332946
- Publication date Nov 13, 2014
- Jae Sung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY
- Publication number 20140315334
- Publication date Oct 23, 2014
- Michael J. Hundt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND IN...
- Publication number 20140291001
- Publication date Oct 2, 2014
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...
- Publication number 20140287555
- Publication date Sep 25, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
- Publication number 20140239513
- Publication date Aug 28, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND METHOD FOR PRODUCING A SENSOR PACKAGE
- Publication number 20140218019
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing an electronic module and an electronic module
- Publication number 20140208588
- Publication date Jul 31, 2014
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140151877
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- HWAN-SIK LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEM HAVING MOVABLE ELEMENT INTEGRATED INT...
- Publication number 20140144013
- Publication date May 29, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Edgar Rolando Zuniga-Ortiz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20140141544
- Publication date May 22, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR
- Publication number 20140131849
- Publication date May 15, 2014
- Tessera, Inc.
- Wael Zohni
- G11 - INFORMATION STORAGE
Information Patent Application
ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING
- Publication number 20140102776
- Publication date Apr 17, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140084440
- Publication date Mar 27, 2014
- HITACHI HOKKAI SEMICONDUCTOR LTD.
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS

Francium [Fr]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Package-on-package assembly with wire bonds to encapsulation surface

Light emitting diode package and method for fabricating same

Package-on-package assembly with wire bonds to encapsulation surface

Packaging photon building blocks with top side connections and inte...

Multi-chip modules including stacked semiconductor dice

Light emitting diode package and method for fabricating same

Packaging photon building blocks with top side connections and inte...

Package-on-package assembly with wire bonds to encapsulation surface

Stacked chip-on-board module with edge connector

Package-on-package assembly with wire bonds to encapsulation surface

LED packaging with integrated optics and methods of manufacturing t...

Semiconductor device

Packaging photon building blocks with top side connections and inte...

Light emitting die (LED) packages and related methods

Electronic part embedded substrate and method of producing an elect...

Semiconductor device

Package-on-package assembly with wire bonds to encapsulation surface

Method of producing a hybridized device including microelectronic c...

Light emitting device and method for manufacturing the same

Electrical components and method of manufacture

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Electronic part embedded substrate and method of producing an elect...

Light emitting device and method for manufacturing the same

Epoxy resin composition for encapsulating semiconductor device and...

Stacked chip-on-board module with edge connector

Packaging structural member

Package-on-package assembly with wire bonds to encapsulation surface

Multi-chip light emitter packages and related methods

Multiple die stacking for two or more die

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

GROUP III NITRIDE BASED FLIP-CHIP INTEGRATED CIRCUIT AND METHOD FOR...

LAND GRID ARRAY SEMICONDUCTOR DEVICE PACKAGES

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

Integrated Circuit Package System with Removable Backing Element Ha...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE...

INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND IN...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON...

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

SENSOR PACKAGE AND METHOD FOR PRODUCING A SENSOR PACKAGE

Method for manufacturing an electronic module and an electronic module

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

MICROELECTROMECHANICAL SYSTEM HAVING MOVABLE ELEMENT INTEGRATED INT...

PACKAGED MICROELECTRONIC COMPONENTS

STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR

ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING

SEMICONDUCTOR DEVICE