Claims
- 1. In a curable composition for use during microlithographic processes, said composition comprising a polymer binder dissolved in a solvent system, the improvement which comprises a non-aromatic, light attenuating compound which absorbs light at wavelengths of less than about 300 nm in said composition.
- 2. The composition of claim 1, wherein said light attenuating compound is bonded to the polymer binder.
- 3. The composition of claim 1, wherein the polymer binder comprises a backbone, and said light attenuating compound is bonded to said backbone.
- 4. The composition of claim 1, wherein said light attenuating compound is bonded to a linkage unit and said linkage unit is bonded to the polymer binder.
- 5. The composition of claim 4, wherein said linkage unit comprises a moiety selected from the group consisting of cyclic alkyls, acyclic alkyls, acyclic heteroalkyls, and cyclic heteroalkyls.
- 6. The composition of claim 1, wherein said light attenuating compound includes a moiety selected from the group consisting of COOH, OH, CONH2, CONHR′, CH2X, and mixtures thereof, wherein R′ is selected from the group consisting of hydrogen, alkyls, and heteroalkyls, and wherein X is a halogen.
- 7. The composition of claim 1, wherein after curing, said composition has an etch rate of at least about 4000 Å/minute when utilizing an etchant gas comprising a mixture of HBr and O2.
- 8. The composition of claim 1, wherein said light attenuating compound comprises an olefinic moiety including carbon atoms C1 and C2 double-bonded to one another, and an EWG bonded to carbon atom C1.
- 9. The composition of claim 8, wherein the EWG includes a moiety selected from the group consisting of carbonyl, carboxyl, carboxamido, sulfonyl, and non-aromatic heterocyclic groups.
- 10. The composition of claim 8, said light attenuating compound comprising a diolefin, including carbon atoms C3 and C4 double-bonded to one another, and wherein C3 is bonded to C2 so as to form conjugated double bonds.
- 11. The composition of claim 10, further including an EDG bonded to C4.
- 12. The composition of claim 11, wherein the EDG includes a moiety selected from the group consisting of H3CO, OH, and R1—O—, wherein R1 is non-aromatic and is selected from the group consisting of hydrogen, acyclic and cyclic alkyls, and heteroalkyls.
- 13. The composition of claim 10, further including a second EWG, said second EWG being bonded to C4.
- 14. The composition of claim 13, wherein the second EWG includes a moiety selected from the group consisting of carbonyl, carboxyl, carboxamido, sulfonyl, and non-aromatic heterocyclic groups.
RELATED APPLICATION
[0001] This application is a continuation of U.S. patent application Ser. No. 09/450,966 filed Nov. 30, 1999, incorporated by reference herein.
Continuations (1)
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Number |
Date |
Country |
Parent |
09450966 |
Nov 1999 |
US |
Child |
09961751 |
Sep 2001 |
US |