Claims
- 1. A non-cyanide brass electroplating bath composition, comprising:
- about 0.03M to about 0.15M copper,
- about 0.03M to about 0.09M zinc,
- about 0.4M to about 1.2M sodium polyphosphate, and
- about 0.2M to about 0.85M orthophosphate,
- with the proviso that the composition does not contain cyanide, wherein the composition has a metal content of copper and zinc below about 15 g/l.
- 2. The composition of claim 1, wherein the polyphosphate of the sodium metal polyphosphate is pyrophosphate.
- 3. The composition of claim 1, wherein the copper is obtained from copper sulfate or a hydrate thereof.
- 4. The composition of claim 1, wherein the zinc is obtained from zinc sulfate or a hydrate thereof.
- 5. A method of making metallic foil having a brass layer, comprising:
- providing a metallic foil;
- contacting the metallic foil with a non-cyanide brass electroplating bath comprising copper, zinc, sodium polyphosphate, and orthophosphate, with the proviso that the brass plating bath does not contain cyanide, wherein the bath has a metal content of copper and zinc below 20 g/l;
- applying a current to the brass electroplating bath, wherein the current has a current density in the range from about 60 to about 80 ASF; and
- recovering the metallic foil having a brass layer.
- 6. The method of claim 5, wherein the non-cyanide brass electroplating bath comprises:
- about 0.03M to about 0.15M copper,
- about 0.03M to about 0.09M zinc,
- about 0.4M to about 1.2M sodium polyphosphate, and
- about 0.2M to about 0.85M orthophosphate.
- 7. The method of claim 5, wherein the polyphosphate of the sodium polyphosphate is pyrophosphate.
- 8. The method of claim 5, wherein the bath has a metal content of copper and zinc below about 15 g/l.
- 9. The method of claim 5, wherein the bath has a temperature in the range from about 40.degree. C. to about 60.degree. C.
- 10. The method of claim 5, wherein the bath has a pH in the range from about 7.5 to about 9.
- 11. The method of claim 5, wherein the metallic foil contains a layer of copper foil.
- 12. The method of using a non-cyanide brass electroplating bath, comprising:
- contacting a metallic foil with the non-cyanide brass electroplating bath, wherein the non-cyanide brass electroplating bath comprises copper, zinc, sodium polyphoshate, and orthophosphate under a current density from about 60 to about 80 ASF, with the proviso that the brass plating bath does not contain cyanide, wherein the bath has a metal content of copper and zinc below 20 g/l.
- 13. The method of claim 12, wherein the non-cyanide brass electroplating bath comprises:
- about 0.03M to about 0.15M copper,
- about 0.03M to about 0.09M zinc,
- about 0.4M to about 1.2M sodium polyphosphate, and
- about 0.2M to about 0.85M orthophosphate.
- 14. A non-cyanide brass electroplating bath composition, comprising:
- about 0.03M to about 0.15M copper,
- about 0.03M to about 0.09M zinc,
- about 0.4M to about 1.2M sodium polyphosphate, and
- about 0.2M to about 0.85M orthophosphate,
- with the proviso that the composition does not contain cyanide, wherein the composition has a metal content of copper and zinc below 20 g/l.
Parent Case Info
This is a continuation of application Ser. No. 08/600,243 filed on Feb. 12, 1996 now abandoned.
US Referenced Citations (8)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0269208 |
Jun 1988 |
EPX |
495468A2 |
Jul 1992 |
EPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
600243 |
Feb 1996 |
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