1. Field of the Invention
The present invention relates to methods and apparatuses for heat transfer. More particularly, the invention relates to optimized extended surfaces used for cooling electronic components and other objects whereas such methods and apparatuses involve heat transfer, such as the removal, absorption and/or dissipation of heat.
2. Description of the Related Art
A “heat sink” (alternatively spelled “heatsink”) is a device used for removing, absorbing and/or dissipating heat from a thermal system. Generally speaking, conventional heat sinks are founded on well known physical principles pertaining to heat transference. Heat transference concerns the transfer of heat (thermal energy) via conduction, convection, radiation or some combination thereof. In general, heat transfer involves the movement of heat from one body (solid, liquid, gas or some combination thereof to another body (solid, liquid, gas or some combination thereof). In the present invention the term “heatsink” may also apply to heat exchangers, radiators, air and liquid-cooled coldplates, and other devices through which heat is transferred.
The term “conduction” (or “heat conduction” or “thermal conduction”) refers to the transmission of heat via (through) a medium, without movement of the medium itself, and normally from a region of higher temperature to a region of lower temperature. “Convection” (or “heat convection” or “thermal convection”) is distinguishable from conduction and refers to the transport of heat by a moving fluid which is in contact with a heated body. According to convection, heat is transferred, by movement of the fluid itself, from one part of a fluid to another part of the fluid. “Radiation” (or “heat radiation” or “thermal radiation”) refers to the emission and propagation of waves or particles of heat. The three heat transference mechanisms (conduction, convection and radiation) can be described by the relationships briefly discussed immediately hereinbelow.
Conductive heat transfer, which is based upon the ability of a solid material to conduct heat therethrough, is expressed by the equation q=kAcΔT/L, wherein: q=rate of heat transfer (typically expressed in Watts) from a higher temperature region to a lower temperature region; k=thermal conductivity (W/m K), which is a characteristic of the material composition; Ac=cross-sectional area (m2) of the material (perpendicular to the direction of heat flow; ΔT=temperature difference (° C.), which is the amount of temperature drop between the higher temperature region and the lower temperature region; and L=length (m) of the thermal path through which the heat is to flow.
Convective heat transfer, which is based upon the ability of a fluid to transfer heat energy through intimate contact with a solid surface, is expressed by the equation q=hcAsΔT, wherein: hc=fluid convection coefficient (W/m2 K), wherein hc is determined by factors including the fluid's composition, temperature, velocity, and turbulence; and, As=surface area (m2) which is in contact with the fluid.
Radiative heat transfer, which is based upon the ability of a solid material to emit or absorb energy waves or particles from a solid surface to fluid molecules or to different temperature solid surfaces, is expressed by the equation q=As∈σ(Ts4−Ta4), wherein: ∈=dimensionless emissivity coefficient of a solid surface, which is a characteristic of the material surface; σ=Stefan−Boltzmann constant; As=surface area (m2) which radiates heat; Ts=absolute temperature of the surface (K); and, Ta absolute temperature of the surrounding environment (K).
It is theoretically understood that, regardless of the heat transfer mechanism, heat transfer rate q can be increased by increasing one or more of the numerator factors on the right side of the equation.
In current practical contexts, heat sinks, coldplates and heat exchangers are generally designed with a view toward furthering the conductive properties of the heat sink by augmenting the thermal conductivity k, for conduction; the surface area, As, and heat transfer coefficient hc, for convection. In this regard, according to conventional practice, a heat sink structure is made of a highly thermally conductive solid material, thereby maximizing the conductivity k characteristic of the heat sink; an extended surface comprising a plurality of manufacturable fins or pins, thereby maximizing the surface area As; and a geometric shape in contact with the fluid medium, thereby maximizing the heat transfer coefficient hc.
Following conventional design practice, the heat sink structure tends to be rendered large (e.g., bulky or voluminous), therefore heat sinks are often rated by a heat transfer efficiency, or thermal resistance θ, found by dividing the ΔT, temperature rise of the heat source by the power input, i.e., ° C./W, whereby a lower value for thermal resistance θ, equates to a more efficient design.
As surface area and volume is increased, ancillary issues such as flow resistance and mass must be minimized. In order to gauge these ancillary effects on the efficiency of a heat sink, pumping power Pp, (measured in W), and mass M, (in kg) can be weighted and added to the efficiency equation resulting in η=ΔTPpM/W. Flow resistance can be particularly important because this resistance increases at the square power of coolant velocity. High flow resistance may require larger pumps or fans to generate additional pumping power, which may also require additional cooling capability.
Due to manufacturing costs, optimized heat sinks are usually limited to a linear array of identical fins having fixed spacing, which are intended to increase the surface area available for heat transfer and increase the heat transfer coefficient. These heat sinks are further compromised by containing simple fin shapes such as squares or rectangles, and occasionally round pins.
Several factors combine to reduce the effectiveness of these conventional heat sinks. One of the most common problems is that the heat absorbed by a coolant media results in a higher temperature media. Due to the temperature rise of the coolant and because a passive heat sink can not cool a heat source below the temperature of the coolant, the temperature of the last device in a row of equally powered components will be hotter than the upstream components. The temperature rise of the coolant is found by ΔT=q/{dot over (m)}cp, where {dot over (m)}=mass flow rate (kg/s) and cp=specific heat (J/kg K) of the coolant media. This effect can also greatly change the coolant properties. Therefore, a linear fin array which is optimized for a specific inlet coolant temperature will not provide optimum heat transfer for the coolant after heat is absorbed. An extreme aspect of coolant media property change is in high heat flux applications whereby a saturated liquid enters a heat exchanger, becomes a two-phase flow through nucleate boiling, and subsequent vapor flow.
In addition, heat is not usually spread evenly across the heat input surface of the heat sink. Common practice is to have a plurality of small heat sources share a common heat sink. In such cases, a linear array of fin protrusions will require the same amount of pumping power to flow through the unheated regions as the heated regions.
Thus, there are potential problems associated with conventional approaches to effectuating heat sink cooling of an entity behaving at a high power density. Firstly, prior art manufacturing approaches result in an array of fin protrusions that are more optimized for cost and not for heat transfer. Secondly, a low-cost prior art fin array, consisting of identical fins with identical spacing, will waste pumping power on unheated regions, usually resulting in the need for larger fans or pumps. Thirdly, prior art fin arrays have no provision to account for the temperature rise of a coolant media or the changes in physical properties of the coolant, resulting in decreased efficiency. Fourthly, prior art heat sinks are often grossly overweight, due to the limitations of the manufacturing approach.
Of interest in the art are several United States patents, each of which is hereby incorporated herein by reference Klein et al. U.S. Pat. No. 4,151,548 issued Apr. 24, 1979 teaches the use of square or diagonal cross-section pegs in a fluid flow whereby turbulence is created to enhance cooling. Klein also teaches that opposing inlet and outlet ports cause a higher velocity between the ports. Klein does not teach the use of efficient structures or the role of flow resistance.
Pellant et al. U.S. Pat. No. 4,188,996 issued Feb. 19, 1980 describes a device that contains a plurality of spaced parallel channels. The channels being divided by studs spaced longitudinally in an effort to promote more fluid turbulence. Pellant does not teach the use of efficient structures or the role of flow resistance.
Iversen U.S. Pat. No. 4,712,609 issued Dec. 18, 1987 discloses a roughened heat exchanger surface with a coolant flow heated to boiling and producing pressure gradients to remove nucleate bubbles. Although Iversen teaches that low flow resistance is important, Iversen does not teach, and makes no provision for the fact that the optimum heat transfer surface for liquid flow is very different than the optimum for two-phase and gaseous flow.
Steffen et al. U.S. Pat. No. 4,997,034 issued Mar. 5, 1991 teaches a heat transfer surface consisting of diamond-shaped protrusions on a pie-shaped plate and recognition of manufacturing ease and flow resistance. Steffen does not teach that different aspect ratios will produce different heat transfer and flow resistance results, nor does Steffen teach the use of mixed shapes and heights of protrusions.
Wolgemuth et al. U.S. Pat. No. 5,453,911 issued Sep. 26, 1995 discloses the use of nozzles to cause impingement of a coolant onto the baseplate of an insulated gate bipolar transistor (IGBT) or silicon-controlled rectifier (SCR), and deflectors to cause greater a greater heat transfer coefficient at hot spots. Wolgemuth does not teach the importance of flow resistance, or that gross changes in flow direction and velocity can have a very negative impact on flow resistance, nor does Wolgemuth disclose the use of shaped protrusions to efficiently cool hot spots.
Romero et al. U.S. Pat. No. 5,915,463 issued Jun. 29, 1999 instructs the use of an optimized fin array to cool discrete components and a method of manufacture. Romero asserts that the fin surfaces perpendicular to coolant flow do not significantly contribute to heat transfer, directly contradicting a large body of published literature.
Frey et al. U.S. Pat. No. 5,978,220 issued Nov. 2, 1999 discloses the use of fusion bonded heat sinks to cool IGBT modules, whereby the heat sink pins are circular, perpendicular to coolant flow, and in a hexagonal pattern. Although Frey teaches that thermal resistance can be optimized by varying pin diameter and spacing, Frey does not disclose the detrimental effect of flow resistance in that optimization or a method to counter heat absorption by the coolant.
Becker et al. U.S. Pat. No. 6,039,114 issued Mar. 21, 2000 instructs the use of a cooling body consisting of protruding lugs. Becker teaches that the volume of the lugs is greater than the volume of the flow channels thereby producing homogeneous flow resistance. Becker does not disclose how the shape or pattern of said lugs can be optimized to reduce said flow resistance, or how the geometric shape of the cooling body may be changed to cool local regions of greater heat flux.
Cannell et al. U.S. Pat. No. 6,729,383 issued May. 4, 2004 teaches a heat sink with non-thermally conductive fins, heat transfer occurring on the heat sink plate. The pins serve to promote fluid turbulence. Cannell teaches that a disparity among pins is acceptable, but that configurational regularity promotes uniformity of heat transfer. Cannell does not teach that flow resistance is an important variable or that certain shapes are more efficient than other shapes. Although Cannell discloses a large number of embodiments there is no rational for using one embodiment over another.
Rinehart et al. U.S. Pat. No. 7,173,823 issued Feb. 6, 2007 discloses a fluid-cooled assembly wherein lies a heat sink. Rinehart teaches that the cooling pins at the fluid inlet may be of a smaller diameter than at the fluid outlet because of heat absorption by the fluid, but does not disclose that other shapes and spacing of fins are more effective, or that shortening the pins can offer less flow resistance while simultaneously increasing fin efficiency.
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In view of the foregoing, it is an object of the present invention to provide heat sink method and apparatus which are capable of dissipating/removing heat from a device or other to-be-cooled object which is characterized by a high power density.
It is another object of this invention is to provide heat sink method and apparatus which provides cooling, for a to-be-cooled object (such as a module) having a baseplate, wherein the cooling is non-uniform over the surface area of the baseplate.
Another object of the present invention is to provide heat sink method and apparatus which are not large, cumbersome or heavy.
A further object of this invention is to provide heat sink method and apparatus in which extended surface protrusions are optimally shaped in recognition of convective heat transfer, conductive heat transfer, and flow resistance.
Another object of the present invention is to provide heat sink method and apparatus which offsets the temperature rise of a coolant media and provide enhanced cooling for the local coolant temperature.
A further object of this invention is to provide heat sink method and apparatus which delivers optimized cooling efficiency per the local physical properties of the coolant media.
The present invention provides a heat sink for cooling an object, and a methodology for accomplishing same. The inventive heat sink is capable of being used in association with a fluid (liquid or gas) for effectuating cooling. Either liquid coolant, gas coolant or a combination two-phase flow can be used in inventive practice.
The present invention further features turbulence enhancement of the coolant stream by a pin array through which the coolant stream passes. According to many embodiments, this invention additionally features a non-linear shape, spacing, and height pattern to provide optimal cooling while simultaneously reducing volume and flow resistance.
In accordance with many embodiments of the present invention, a heat sink device for utilization in association with fluid for cooling an object comprises a heat transfer structure which includes a foundation section, plural protrusions, side surfaces, and a lid surface. The foundation section has an upper surface. The protrusions are situated on the upper surface. The foundation bottom surface is adaptable to engagement with a heat source. The fluid streams approximately longitudinally with respect to the upper surface and with respect to the object. According to typical inventive practice, the structure is adaptable to such engagement and association wherein at least one protrusion affects the streaming of the fluid—more typically, wherein plural protrusions, which are some or all of the protrusions, affect the streaming of the fluid.
In another embodiment of the present invention a heat sink device for utilization in association with fluid for cooling an object comprises a structure which includes a foundation section, plural protrusions, side surfaces, and a lid surface. Wherein protrusions are situated on both the upper surface of the foundation and the lower surface of the lid. The foundation bottom surface is adaptable to engagement with a heat source. The fluid streams approximately longitudinally with respect to the foundation upper surface, the lid lower surface, and the object. Accordingly, the pins on the upper surface and the lower surface may have different shapes spacing, and heights, that when assembled, produce multiple local flowfields within the heat transfer structure.
The inventive cooling apparatus is for application to any body—for example, an electronic circuitry device or other electronic component.
The inventive fluid-cooling heat sink apparatus typically comprises fluidity means (e.g., a fluid generation system) and a member. The subject body has a body surface portion. The member has a member surface portion and a plurality of pins projecting therefrom. According to frequent inventive practice the pins are approximately parallel; however, such parallelness is not required in accordance with the present invention. Each pin has a pin end surface portion opposite the member surface portion. The fluidity means includes means emissive of a fluid which is flowable along at least a part of the member surface portion so as to be contiguous at least a part of the body surface portion when at least a part of the body surface portion communicates with at least some of the pin end surface portions. Typically, the pins are arranged and configured in such manner as to be capable of increasing the turbulence of the fluid which passes between the member surface portion and the body surface portion.
Many inventive embodiments provide a method for cooling an entity such as an electronic component. The inventive method comprises the following steps: (a) providing a device having a device surface area and plural members which jut from the device surface area, the members having corresponding extremities opposite the device surface area; (b) associating the entity with the device, the entity having an entity surface area, the associating including placing the entity surface area in contact with at least some of the extremities; and (c) discharging fluid between the device surface area and the entity surface area so as to be disturbed by at least some of the members.
This invention meets most military and commercial requirements for dissipating/removing heat. The inventive heat sink: is capable of dissipating heat from a single or multiple high power density devices; can provide uniform or localized cooling over a baseplate surface area; is highly efficient in terms of mass, total volume, pumping power, and thermal resistance; and, carries relatively low manufacture and assembly costs.
The terms “pin” and “fin,” in relation to the present invention, are used somewhat interchangeably. The term “pin” is usually applied to an extended surface protrusion of any height having roughly equivalent dimensions parallel and perpendicular to the general coolant flow direction. The term “fin” usually refers to an extended surface protrusion of any height having a greater dimension parallel to the general flow than perpendicular to the general flow. Hereinafter, “fin” is used to present the structure inside the heat sink.
In accordance with many embodiments of the present invention, the protrusions may be made of a thermally conductive material such as metal, thereby adding surface area and complementing heat convection by the working fluid with heat conduction by the fins.
According to inventive embodiments which thus implement thermally nonconductive fins, there is no significant or appreciable thermal conductivity; all or practically all of the heat which is removed from the heat source is removed via convection, wherein the cooling fluid comes into direct contact with a surface or surface portion of the heat source object. A thermally nonconductive material will generally be a nonmetallic material.
For instance, in inventive applications involving a module having a dielectric (e.g., ceramic) baseplate, the entirety of the heat is removed through the baseplate by the working fluid (e.g., water or air). The invention's fins serve as mechanical support for the ceramic baseplate and to enhance the turbulent flow of the working fluid; the turbulent flow increases the heat-removal effectiveness of the working fluid. The present invention not only provides support for the baseplate to prevent breakage, but also cools the baseplate.
It should be understood that, according to this invention, the fins do not necessarily project from the heat sink's base section. An inventive feature is that the fins may be interposed between the heat source and the heat sink surface. The heat sink surface bounds the working fluid flow on one side, and a heat source object surface bounds the working fluid flow on the opposite side. In inventive practice, the fins can project from either (i) a base which is part of a module for holding an electronic component, or (ii) a base section which is part of the heat sink device, this base section itself representing a sort of “base plate.”
In accordance with many embodiments of the present invention, the terms “heat source” and “coolant media” can be replaced with the terms “cold source” and heated media”. The invention can thus operate in either direction of heat flow, i.e. heat source to coolant media or heated media to cold source.
It should be understood that, according to this invention, the protrusions may be made of a thermally conductive material such as metal, thereby adding surface area and complementing heat convection by the working fluid with heat conduction by the fins.
The invention can thus operate regardless of which of two opposing substrates the fins project from, viz., an object surface (e.g., a “modular baseplate surface”) or a heat sink surface (e.g., a “heatsink baseplate surface”). Therefore, according to many embodiments, a cooling assembly may comprise a modular baseplate, a heatsink base, plural fins and a fluid. The fins located between the two surfaces. The fluid is disposed between the modular baseplate and the heatsink base so as to be disrupted by at least some of the fins. Such inventive arrangements can prove especially propitious for applications involving high heat fluxes, wherein the modular baseplate (and perhaps the rest of the module, as well) is made of a dielectric material, e.g., a nonmetallic material such as ceramic, and thereby affords electrical isolation to the electronic component which is housed by the module.
Further is should be understood that the invention structure applies to different physical geometries. For example, a multi-sided heat transfer structure wherein some sides transfer heat into the structure and other sides transfer heat out of the structure.
Other objects, advantages and features of this invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings. It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:
a is an isometric view of a prior art heat sink device, wherein the extended surface is in the form of a linear array of identical round fins, having identical spacing, in a staggered pattern.
b is a top plan view of the prior art configuration shown in
c is a top plan view of a prior art configuration wherein the extended surface is in the form of a linear array of identical round fins, having identical spacing, in an in-line pattern.
d is a side elevation view of the prior art configuration shown in
a is an isometric view of a prior art heat sink device, wherein the extended surface is in the form of a linear array of identical square fins, having identical spacing, in a staggered pattern.
b is a top plan view of the prior art configuration shown in
c is a top plan close-up view of the prior art configuration shown in
a is an isometric view of a prior art heat sink device, wherein the extended surface is in the form of a linear array of plate-shaped fins, having identical spacing.
b is a top plan view of the prior art configuration shown in
c is a top plan close-up view of the prior art configuration shown in
a is an isometric view of a prior art heat sink device, wherein the extended surface is in the form of a linear array of thin round fins at the coolant inlet, and thick round fins at the coolant outlet, all having identical spacing.
b is a top plan view of the prior art configuration shown in
c is a side elevation view of the prior art configuration shown in
a is a top view of the present invention showing locations of cross sectional views a-a, b-b, c-c, and d-d.
b is a cross sectional front view of the present invention along plane a-a of
c is a cross sectional front view of the present invention along plane b-b of
d is a cross sectional front view of the present invention along plane c-c of
e is a cross sectional front view of the present invention along plane d-d of
f is a cross sectional front view of the present invention along plane e-e of
a is a top plan view of a semi-staggered fin array showing an undulating flow path.
b is a top plan view of the semi-staggered fin array of
a shows a front view of two surfaces with varying fin thickness and varying spaces between adjacent fins.
b shows a front view of the two surfaces of
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A novel feature of the invention is that for each fin 51, longitudinal fin dimension 53, transverse fin dimension 54, and fin height 60, are optimized for the local flow field.
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Another novel feature is that fin aspect ratio, described as fin longitudinal dimension 53 divided by fin transverse dimension 54, progresses along a log curve from high aspect ratio ellipses at the leading edge of the heat sink 62 to low aspect ratio ellipses terminating at a distance approximately ⅞ of the total heat sink length 65. For the remaining roughly ⅛ of the heat sink length 66, fins 51 progress linearly back to high aspect ratio ellipses.
It is know in the art that for fins having a specific volume and height, greater cross-sectional ellipse aspect ratios will yield greater surface area, a lower coefficient of drag, and a lower heat transfer coefficient. Therefore, since one of the objects of the invention is to minimize flow resistance and volume while simultaneously increasing the heat transfer coefficient, fins 51 change aspect ratio as the distance from the leading edge of the heat sink increases. Fins 51 toward the leading edge have higher aspect ratios because at this longitudinal dimension the fluid has not absorbed enough heat to require a high heat transfer coefficient at the expense of volume and flow resistance. As shown in
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The methodology of the present invention is not limited to fin heat sinks. As shown in
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Upper lid 59 and base 52 are depicted to be non-planar, as shown in
The geometry of upper lid 59 and base 52 can be characterized entirely by rectilinearity, entirely by curvilinearity, or by some combination thereof.
Table. 1 shows the results of applying the teachings of the present invention when compared to a heat sink using the prior art teachings. Table. 1 lists the physical characteristics of a prior art fin heat sink and a heat sink of the current invention. Most notable are the decrease in thermal resistance, decrease in pumping power required, and decrease in mass and volume, embodied by the invention.
It is emphasized that inventive practice is not limited to the specific geometric ratios represented herein in the drawings. The geometric modalities shown in these figures are intended herein to be “generic” in nature because dissimilar geometric motifs can manifest similar principles and concepts; in particular, different aspect ratio geometries and forms of the fins and/or the base section can be used to generate attributes of thermal performance. It will be apparent to the ordinarily skilled artisan who reads this disclosure that there are thematic commonalities among the geometric modalities specifically disclosed herein, and that many geometric modalities and ratios not specifically disclosed herein can be inventively practiced in accordance with such thematic commonalities and in accordance with other inventive principles disclosed herein.
The present invention admits of a diversity of embodiments. As elaborated upon hereinbelow, the inventive practitioner can vary one or more dimensional, configurational and/or geometric parameters, including but not limited to the following: (i) fin length and/or height; (ii) fin cross-sectional shape (e.g., elliptical versus circular versus square, etc.); (iii) fin distribution (e.g., non-staggered rows versus staggered rows, angularity of row staggering, even or parallel row orientations versus offset row orientations, angularity of row orientation offset, etc.); (iv) fin spacing (e.g., distances between various fins in various directions); (v) passage depth (e.g., distance between baseplate and upper lid); (vi) passage shape (e.g., relative dispositions of baseplate and upper lid surface, contour (three-dimensional shape) of baseplate, contour (three-dimensional shape) of heat sink base section, etc.); (vii) heat sink base section's outline (two-dimensional) shape; (viii) heat sink base section's transverse dimensions; (ix) fluid inlet configuration; and, (x) fluid outlet configuration.
Although elliptically-shaped fin 51 cross-sections (having longitudinal fin dimension 53 and transverse fin dimension 54) are portrayed in the embodiment, it is readily appreciated by the ordinarily skilled reader of this disclosure that fin 51 cross-sections of any shape can be disposed either in angularly offset fashion (e.g., oblique with respect to a selected longitudinal line, such as an edge of the upper lid surface 59) or in angularly non-offset fashion (e.g., parallel with respect to a selected longitudinal line, such as an edge of the upper lid surface 59). The figures disclosed herein are merely exemplary insofar as generically demonstrating that inventive practice can use any combination of geometrical cross-sectional shapes, geometrical arrangements and angularities with respect to a longitude (e.g., angle theta can be any value greater than or equal to zero). In fact, the present invention encompasses a potentially infinite number of variations of cross-sectional shapes and locations of fins 51.
It is again emphasized that any number or geometric arrangement of fins 51 can be used in inventive practice. With regard to the properties of staggeredness and uniformity (homogeneity), an inventive fin 51 array can be characterized by staggered uniformity, non-staggered uniformity, staggered nonuniformity or non-staggered non-uniformity. Further, any combination of two or more geometric fin 51 shapes can be used for a given fin 51 array.
Furthermore, the surface roughness of the flow cavity can be varied in accordance with the present invention. Irrespective of the essential geometry defined by upper lid 59 and base 52, the detailed geometry defined by the surfaces can vary in terms of smoothness versus roughness. Not only the essential geometry of fins 51, but also the detailed geometry of the boundary surfaces, can be selected so as to affect the flow of fluid in a desired fashion.
Surface roughness and porosity of fins 51 is an important factor in specific flows. In low viscosity fluids with a relatively high thermal conductivity, fin porosity can add greater surface area and serve to reduce pressure drop. In fluids having a boiling point near the expected operating conditions within non-linear heat sink 50 surface roughness will have a great effect on boiling incipience and wall superheat. In fact, it is a further object of the present invention to affect means for allowing a continuous control of boiling incipience and affectivity as a function of flow length.
It should be now obvious to those skilled in the art than in addition to local longitudinal and transverse dimensional and geometric alterations; fins may be similarly optimized along an axis measured parallel to the height of the fin. The effect of physical changes in fin cross section vs. distance measured from the fin base are well know in the art, but these characteristics can also be altered on an individual fin or fin region basis to affect local optimized flowfields and solid/fluid interaction. Referring now to
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In another embodiment of the invention, utilizing the fin pattern of the preferred embodiment, individual fins can be manufactured from different materials and combined with the geometric effects on coolant flow to control heat transfer or conversely individual fins may be made from more than one material. For example, in order to provide a more uniform base temperature, fins near the leading edge may be constructed of a material having a lower thermal conductivity such as aluminum while fins closer to the trailing edge may be constructed of a material having a higher thermal conductivity such as copper. Fins having different material characteristics may also be combined to produce other thermal effects. For example, the fins closer to a heat source may be manufactured from different materials to more closely match the coefficient of thermal expansion of the heat source. In one region of the heat sink, fins may be constructed of platinum while in another region of the heat sink, fins are constructed of beryllium. Although both materials have similar thermal conductivity, beryllium has almost 15 times the heat capacity, which may be useful in high power transient applications.
In
The effect of having a much higher temperature at the trailing edge can be used to benefit cooling applications that rely on a change in the coolant phase from liquid to gas. In this manner the base can be liquid cooled along the leading edge, and gas cooled at the trailing edge. One reason to impart this effect is for process control and assist chemical reactions. For example, the fins may be constructed of a porous material infused with a chemical, or simply coated with a chemical depending on the application. The application of liquid flow may produce an initial chemical reaction having a desired effect downstream of the leading edge. As the distance from the leading edge increases and the heat of the liquid increases exponentially (depending on the non-linear fin pattern), a secondary thermo-chemical reaction may occur. As the fluid changes phase, the incipience of gaseous nucleation may cause tertiary reactions to occur. One embodiment of the present invention may be used to facilitate vapor compression distillation of urine in a disposable canister. In addition to the specific thermo-chemical reactions caused by the example described, specific regions of a fin pattern may be coated with different chemicals which when combined produce an effect only in the presence of the flowable catalyst.
Depending on the chemical composition of a fin, the fin pattern may be varied to achieve a specific rate of chemical release into the flowable media which depends on the amount of turbulence and/or flow velocity. As shown in
In another embodiment, shown as
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It is reemphasized that the present invention can be practiced in association with any among a multiplicity of geometries. Any of the fin 51 array patterns illustrated in the drawings (and many others not specifically shown) can be inventively practiced regardless of the geometric nature (e.g., planar or non-planar) of the bounding surfaces.
In the previous figures, fins 51 are shown to be made part of base 52, protruding from the upper surface of base 52, toward and contacting the bottom surface of upper lid 59. Base 52 is part of heat source 94. However, inventive practice can provide for the fabrication of fins 51 as part of another separate heat sink baseplate which is then attached to heat source base 52. Again however, those leaned in the art will realize that fins 51 can extend from surface of upper lid 59 and attach to base 52 or any other part of the structure as described for the embodiment of
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Manifold 96 further serves to channel the cooling fluid (liquid or gas) 97 through fins 51, thereby enhancing turbulent flow. Manifold 96 provides an incoming coolant port 101 and an outgoing coolant port 100 to which incoming coolant barb 98 and outgoing coolant barb 99 are respectively attached. Manifold 96 has an upper mounting surface 103 and a lower mounting surface 104 and at least one opening 102 sized for attachment of non-linear fin heat sink 50. Those skilled in the art will see that although
Power conversion module 105 includes module housing 107, which houses at least one heat source 94. Power conversion module 105 has a module baseplate 106 to which heat sources 94 are thermally attached.
As illustrated in
Although shown as flat surfaces, module baseplate 106, heat sink base 52, and any other heat transfer interfaces may have specific geometric surface patterns to aid the conduction of heat. By way of example such patterns as hierarchical nested channels (T. Brunschwiler, U. Kloter, H. Rothuizen, and B. Michel, “Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance”, 21st IEEE SEMI-THERM Symposium, San Jose, Calif. 2000) can provide a marked reduction in interface resistance when used with flowable thermal interface materials.
When assembled, manifold 96 is contiguous with respect to non-linear fin heat sink 50, whereby base 52 and the tips of fins 51 are mounted in a highly thermally conductive leak-proof manner. Likewise heat sources 94 within module housing 107 of power conversion module 105 are attached in a highly thermally conductive manner to module baseplate 106, which is then mounted in a highly thermally conductive manner through thermal interface material 109 to upper mounting surface 103 of manifold 96 by attachment bolts 110. Once power conversion module 105 and the manifold-heatsink unit are joined, fins 51 protrude into the path of coolant fluid 97.
The fluid flow system will typically include fluid flow means (e.g., including fluid pumping means), fluid inlet means and fluid outlet means. In typical inventive practice, heat sink base 52, upper lid inside the manifold 59 and sidewalls of manifold 96 will define an outline shape (e.g., a rectangular shape) which provides a flow cavity.
As shown in
Energy appearing as waste heat emanates from heat sources 94 and passes through several layers of material having various degrees of electrical and thermal conductivity to module baseplate 106, through thermal interface material 109, through heat sink base 52, to fins 51 and convected and conducted to coolant fluid 97.
In inventive practice, components can be made from a wide variety of materials. In reference to the preferred embodiment, nonlinear fin heat sink 50 and module baseplate 106 are made from copper.
Referring now to
Referring now to
When the laminarized flow reaches the edge of inlet cylindrical fin region 165 a portion of the flow will progress through a region of elliptical fins 166 that are aligned parallel to the bulk flow and a region of elliptical fins 167 that are at a slight angle to the bulk flow. Moving radially from the impingement point, elliptical fins 166 aligned parallel to the flow are characterized by having high aspect ratios of longitudinal length to transverse width (measured according to the local flow direction. Past this entrance area at a distance roughly halfway between impingement point 164 and outlet port 163 elliptical fins 166 progress to lower aspect ratios having larger transverse dimensions. This change in aspect ratio and transverse size helps to maintain a constant velocity, disrupt the formation of a boundary layer, and allows elliptical fins 166 to have a higher core temperature providing a higher heat transfer coefficient. Flow resistance in this area is still low because of the elliptical shape of fins 166.
The portion of fluid that did not travel through the region of fins 166 aligned parallel to the bulk flow, moves through a region of elliptical fins 167 that are at a slight angle to the bulk flow. Angled elliptical fins 167 have higher angles relative to the vector of the bulk flow as the distance from impingement point 164 increases. The increasing angle of the downstream fins helps to gradually change the fluid direction without a corresponding increase in flow resistance, prevents the occurrence of a thick boundary layer, and again results in a higher heat transfer coefficient than would normally occur. As the flow approaches the fluid boundary wall 170 of baseplate 161 the fluid is separated into two paths that each lead to an opposing outlet port 163. Separation of the fluid and subsequent impingement at fluid boundary wall 170 provide a slight enhancement in heat transfer while effectively completing the change in fluid direction toward outlet ports 163.
As the fluid leaving the region of elliptical fins 166 aligned parallel to the bulk flow and the region of elliptical fins 167 that are at an angle to the bulk flow combines from different directions, local mass flow, velocity and turbulence are increased and the fluid enters a region of outlet cylindrical fins 168 that are designed to transfer heat to the turbulent flow and allow fluid movement in a substantially perpendicular vector away from baseplate surface 169 and out through outlet ports 163. The fins at this location are necessarily thin to avoid obstructing outlet fluid flow, and because at this radial distance from the central heat source, little heat is left to transfer to the fluid.
Although most of the embodiments of the present invention show a single inlet location and one or several fluid exit locations, the embodiment depicted in
There are numerous fluids (gaseous or liquid) which are conventionally used for cooling purposes in heat sink applications, any of which can be used in practicing the present invention with appropriate changes to fin geometries. Air is commonly used to dissipate low heat fluxes, such as in desktop computers.
Depending on the specific application, utilization of liquids for the cooling of electronic equipment is generally governed by certain requirements, principles and considerations. Among the many such requirements, principles and considerations which would possibly be applicable in inventive practice are the following: (i) a high thermal conductivity will yield a high heat transfer rate. (ii) High specific heat of the fluid will require a smaller mass flow rate of the fluid. (iii) Low viscosity fluids will cause a smaller pressure drop, and thus require a smaller pump. (iv) Fluids with a high surface tension will be less likely to cause leakage problems. (v) A fluid (e.g., liquid) with a high dielectric strength is not required in direct fluid (e.g., liquid) cooling. (vi) Chemical compatibility of the fluid and the heat sink material is required to avoid problems insofar as the fluid reacting to the material with which it comes in contact. (vii) Chemical stability of the fluid is required to assure that the fluid does not decompose under prolonged use. (viii) Nontoxic fluids are safe for personnel to handle and use. (ix) Fluids with a low freezing point and a high boiling point will extend the useful temperature ranges of the fluid; however, for most practical applications, a fluid should be selected to meet the operating conditions of the component to be cooled. (x) Low cost is desirable to maintain affordable systems.
Fluid-cooled heat sinks used in electronic enclosures and such contexts are usually water-cooled. The heat sink is cooled by the water which is passed therethrough. In many electronic applications, distilled or demineralized water is used to increase the dielectric strength of the water, thereby avoiding electrically coupling components. High heat removal rates can be achieved by circulating water systems. Anhydrous refrigerants are used in place of water or in mixtures with water to keep temperatures of heat sinks at subzero temperatures, thereby increasing the performance of the electronic components. Examples of refrigerants other than water include ammonia, carbon dioxide, CFC-based refrigerants such as R-12 (dichlorodifluoromethane or “freon”), HCFC-based refrigerants such as R134A, and non-CFC substitutes (e.g., for freon) such as R-406A.
Other embodiments of this invention will be apparent to those skilled in the art from a consideration of this specification or practice of the invention disclosed herein. Various omissions, modifications and changes to the principles described may be made by one skilled in the art without departing from the true scope and spirit of the invention which is indicated by the following claims.