Claims
- 1. A polymeric solution comprising a planarizing novolac resin having a weight average molecular weight between about 1000 and 3000 amu; anda surfactant, wherein the planarizing novolac resin is fractionated to remove the molecules with molecular weight below about 350 amu, and wherein the polydispersity of the planarizing novolac resin is less than about 1.6.
- 2. The polymeric solution of claim 1, wherein the planarizing novolac resin has a weight average molecular weight between about 1000 and 2300 amu.
- 3. The polymeric solution of claim 1, wherein the surfactant comprises a non-fluorinated hydrocarbon, a fluorinated hydrocarbon or a combination thereof.
- 4. The polymeric solution of claim 1, wherein the polydispersity is less than about 1.5.
- 5. The polymeric solution of claim 4, wherein the polydispersity is less than about 1.4.
- 6. The polymeric solution of claim 1, wherein the planarizing resin further comprises an organic solvent.
- 7. The polymeric solution of claim 6, wherein the organic solvent comprises at least one of ethyl lactate, ethyl acetate, propyl acetate, and butyl acetate.
- 8. The polymeric solution of claim 1, wherein the planarizing novolac resin has a fraction with molecular weight below about 350 amu that is less than about 22% of the total.
- 9. The polymeric solution of claim 8, wherein the planarizing novolac resin has a fraction with molecular weight below about 350 amu that is less than about 15% of the total.
- 10. The polymeric solution of claim 1, wherein the planarizing novolac resin is a phenolic resin.
- 11. The polymeric solution of claim 1, wherein the planarizing novolac resin has a polydispersity of less than about 1.2.
- 12. The polymeric solution of claim 3, wherein the surfactant is an ester derivative of a fluorinated hydrocarbon.
- 13. The polymeric solution of claim 1, wherein the planarizing novolac resin is spin-coated onto a substrate.
- 14. The polymeric solution of claim 13, wherein the substrate comprises silicon.
- 15. The polymeric solution of claim 13, wherein the substrate comprises a circuit pattern on the surface of the substrate.
- 16. An integrated circuit comprising the polymeric solution of one of claim 1 or 13.
- 17. A microelectronic device comprising the polymeric solution of one of claim 1 or 13.
Parent Case Info
This application is a divisional of allowed application Ser. No. 09/205,006, filed Dec. 2, 1998 now U.S. Pat. No. 6,506,831.
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