Claims
- 1. A method of fabricating an optical cantilever comprising:a step of forming a base portion and a cantilever portion extending from the base portion; a step of forming a hole to penetrate the cantilever portion; a step of depositing a dielectric member in the hole; a step of sharpening the dielectric member to form a sharpened tip at a first end thereof projecting outward of a first surface of the cantilever portion by forming a mask on the dielectric member and etching the dielectric member by isotropic dry etching or isotropic wet etching; and a step of depositing a light shielding film on the first surface of the cantilever portion and the sharpened dielectric member except for a tip thereof so as to provide a very small aperture at the tip.
- 2. A method of fabricating an optical cantilever according to claim 1; further comprising the step of adjusting a thickness of the cantilever portion by thinning the cantilever portion from a direction in which the dielectric member is deposited.
- 3. A method of fabricating an optical cantilever according to claim 1; further comprising the step of partially removing the dielectric member.
- 4. A method of fabricating an optical cantilever according to claim 1; further comprising the step of preventing a face of the dielectric member opposite the sharpened front end from projecting from a face of the cantilever portion.
- 5. A method of fabricating an optical cantilever according to claim 1; wherein the step of forming a base portion and a cantilever portion are performed by etching a silicon substrate; and the step of forming a hole to penetrate the cantilever portion is performed by dry etching the hole in the silicon substrate.
- 6. A method of fabricating an optical cantilever according to claim 1; wherein the step of depositing the dielectric member is performed by one of a gas phase synthesizing process or spin coating.
- 7. A method of fabricating an optical cantilever according to claim 2 wherein the step of adjusting the thickness of the cantilever portion by thinning the cantilever portion from the direction in which the dielectric member is deposited is performed by dry etching.
- 8. A method of fabricating an optical cantilever comprising:a step of forming a base portion and a cantilever portion extending from the base portion; a step of forming a hole to penetrate the cantilever portion; a step of depositing a dielectric member in the hole; a step of sharpening the dielectric member to form a sharpened tip at a first end thereof projecting outward of a first surface of the cantilever portion; and a step of depositing a light shielding film on the first surface of the cantilever portion and on the sharpened dielectric member except for a tip thereof so as to provide a very small aperture at the tip, by depositing a metal on the sharpened dielectric member and removing the metal at the sharpened tip of the dielectric member by dry etching or wet etching.
- 9. A method of fabricating an optical cantilever comprising:a step of forming a base portion and a cantilever portion extending from the base portion; a step of forming a hole to penetrate the cantilever portion; a step of depositing a dielectric member in the hole; a step of sharpening the dielectric member to form a sharpened tip at a first end thereof protecting outward of a first surface of the cantilever portion; a step of depositing a light shielding film on the first surface of the cantilever portion and on the sharpened dielectric member except for a tip thereof so as to provide a very small aperture at the tip; and partially removing the dielectric member by dry etching or wet etching from a side opposed to the sharpened tip of the dielectric member.
- 10. A method of fabricating an optical cantilever comprising:a step of forming a base portion and a cantilever portion extending from the base portion; a step of forming a hole to penetrate the cantilever portion; a step of depositing a dielectric member in the hole; a step of sharpening the dielectric member to form a sharpened tip at a first end thereof projecting outward of a first surface of the cantilever portion; a step of depositing a light shielding film on the first surface of the cantilever portion and on the sharpened dielectric member except for a tip thereof so as to provide a very small aperture at the tip; and preventing a face of the dielectric member opposite the sharpened front end from projecting from a face of the cantilever portion by dry etching or wet etching from a face on a side opposed to the sharpened tip of the dielectric member.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10/320768 |
Nov 1998 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATION
This application is a U.S. national stage application of copending International Application Ser. No. PCT/JP99/06121, filed Nov. 2, 1999 claiming a priority date of Nov. 11, 1998, and published in a non-English language.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP99/06121 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO00/28299 |
5/18/2000 |
WO |
A |
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
5116462 |
Bartha et al. |
May 1992 |
A |
5751686 |
Kuroda et al. |
May 1998 |
A |
5753911 |
Yasuda et al. |
May 1998 |
A |
6194711 |
Tomita |
Feb 2001 |
B1 |
6201226 |
Shimada et al. |
Mar 2001 |
B1 |
Foreign Referenced Citations (3)
Number |
Date |
Country |
08-166390 |
Jun 1996 |
JP |
08-334521 |
Dec 1996 |
JP |
09-054101 |
Feb 1997 |
JP |