Claims
- 1-9. Cancel
- 10. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:
a lead frame having a chip carrier part and a connection part; a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function and which is secured on the chip carrier part; an encapsulation surrounding the semiconductor chip and at least a partial region of the chip carrier part; said connection part being arranged at a distance from the chip carrier part; said chip carrier part and said connection part each having two external connections which project from the encapsulation at opposite sides.
- 11. A semiconductor component as claimed in claim 1, wherein said encapsulation further comprises a base body having formed a recess therein and a radiation-permeable window arranged in the recess and wherein the semiconductor chip is positioned within the recess.
- 12. A semiconductor component as claimed in claim 2, wherein the recess having inner surfaces which are coated with reflection-enhancing material.
- 13. A semiconductor component as claimed in claim 1, wherein the encapsulation is formed completely of a radiation-permeable material.
Priority Claims (1)
Number |
Date |
Country |
Kind |
195 36 454.6 |
Sep 1995 |
DE |
|
RELATED APPLICATION DATA
[0001] The present application is a continuation of application Ser. No. 09/043,840 filed Nov. 18, 1999, whose disclosure is incorporated by reference in its entirety herein.
Continuations (2)
|
Number |
Date |
Country |
Parent |
10173055 |
Jun 2002 |
US |
Child |
10819638 |
Apr 2004 |
US |
Parent |
09043840 |
Nov 1999 |
US |
Child |
10173055 |
Jun 2002 |
US |