Patent Application
20050241578
This invention relates to an oxidizing method and an oxidizing unit for an object to be processed such as a semiconductor wafer or the like, which carries out an oxidation process to a surface of the object to be processed.
In general, in order to manufacture a desired semiconductor integrated circuit, various thermal processes including a film-forming process, an etching process, an oxidation process, a diffusion process, a modifying process or the like are carried out to a semiconductor wafer, which consists of a silicon substrate or the like. For example, as an oxidation process, there are known an oxidation process that oxidizes a surface of a single-crystal silicon film or a poly-silicon film, and another oxidation process that oxidizes a metal film, and so on. Such an oxidation process is mainly used for forming an insulation film such as a gate oxide film or a capacitor.
In addition, the above oxidation process may be also conducted for repairing damages or the like in a poly-silicon layer caused by plasma while a gate electrode is formed. Conventionally, as a gate electrode, a laminated structure of a silicon layer, which consists of an impurity-doped poly-silicon, and a tungsten silicide (WSi) layer was adopted. However, in order to achieve a lower resistance, as a gate electrode, a laminated structure of a silicon layer, which consists of an impurity-doped poly-silicon, and a metal layer has started to be adopted.
Then, in the above gate electrode 10, a plasma etching process is conducted in order to pattern the tungsten layer 8. In the plasma etching process, an exposed surface of the silicon layer 4 is damaged by plasma. In order to repair the damages, after the gate electrode 10 is formed, an oxidation process is conducted as described above.
As shown in
Herein, according to the above oxidation process, the oxidative effect is weak, because it is necessary to inhibit the oxidation of the surface of the tungsten layer 8 as much as possible. In addition, since the process temperature is low, for example about 850° C., as shown in
In order to inhibit the generation of the bird's-beaks 14, it may be thought that it is effective to raise the process temperature for example to 900 to 950° C. so as to strengthen the oxidative effect. However, in that case, because of the high temperature, impurities doped in the silicon layer 4 may diffuse, so that density distribution of the impurities may be changed. Alternatively, although there is the barrier metal layer 6 consisting of the WN film, silicon atoms may diffuse, so that the tungsten film 8 may be bonded to silicon to become a silicide. Thus, the resistance of the gate electrode 10 may be increased.
This invention is developed by focusing the aforementioned problems in order to resolve them effectively. The object of this invention is to provide an oxidizing method and an oxidizing unit for an object to be processed, wherein a surface of a silicon layer can be selectively and efficiently oxidized, without raising a process temperature, while inhibiting oxidation of a tungsten layer.
The inventors have studied and studied a selective oxidation process of a silicon layer and a tungsten layer. As a result, it was found that an oxidation process under a low pressure using active oxygen species and active hydroxyl species is effective. In addition, it was found that by optimizing density of a hydrogen gas as a reducing gas during the oxidation process, a more preferable selective oxidation process can be achieved and generation of bird's-beaks can be also inhibited.
That is, the present invention is an oxidizing method for an object to be processed, the oxidizing method comprising: an arranging step of arranging a plurality of objects to be processed in a processing container whose inside can be vacuumed, the processing container having a predetermined length, a supplying unit of an oxidative gas and a supplying unit of a reducing gas being provided at the processing container, each of the plurality of objects to be processed having an exposed silicon layer and an exposed tungsten layer; an active-species forming step of supplying the oxidative gas and the reducing gas into the processing container, causing the both gases to react on each other under a reduced pressure, and generating active oxygen species and active hydroxyl species in the processing container; and an oxidizing step of oxidizing surfaces of the silicon layers of the plurality of objects to be processed by means of the active species.
According to the invention, since the oxidative gas and the reducing gas are used and they are caused to react on each other under a reduced pressure in order to generate the active oxygen species and the active hydroxyl species, for the objects to be processed having the exposed silicon layers and the exposed tungsten layers, the surfaces of the silicon layers can be selectively and efficiently oxidized, and also generation of defectives such as bard's-beaks can be remarkably inhibited.
For example, the oxidizing step is conducted under a process pressure not higher than 466 Pa (3.5 Torr).
In addition, preferably, density of the reducing gas in total of the oxidative gas and the reducing gas is not less than 75% and less than 100%.
In addition, for example, the oxidizing step is conducted under a process temperature within a range of 450° C. to 900° C.
In addition, for example, the oxidative gas includes one or more gases selected from a group consisting of O2, N2O, NO, NO2 and O3, and the reducing gas includes one or more gases selected from a group consisting of H2, NH3, CH4, HCl and deuterium.
In addition, the present invention is an oxidizing unit comprising: a processing container whose inside can be vacuumed, the processing container having a predetermined length; a supplying unit of an oxidative gas that supplies an oxidative gas into the processing container; a supplying unit of an reducing gas that supplies a reducing gas into the processing container; a holding unit that supports a plurality of objects to be processed at a predetermined pitch, and that can be arranged in the processing container, each of the plurality of objects to be processed having an exposed silicon layer and an exposed tungsten layer; and a controlling unit that controls the supplying unit of an oxidative gas and the supplying unit of an reducing gas so as to control respective supply flow rates of the oxidative gas and the reducing gas into the processing container in such a manner that the silicon layers of the plurality of objects to be processed are selectively oxidized.
According to the invention, since the oxidative gas and the reducing gas are used and their supply flow rates are suitably controlled, for the objects to be processed having the exposed silicon layers and the exposed tungsten layers, the surfaces of the silicon layers can be selectively and efficiently oxidized, and also generation of defectives such as bard's-beaks can be remarkably inhibited.
In addition, the present invention is a controlling unit for controlling an oxidizing unit including: a processing container whose inside can be vacuumed, the processing container having a predetermined length; a supplying unit of an oxidative gas that supplies an oxidative gas into the processing container; a supplying unit of an reducing gas that supplies a reducing gas into the processing container; and a holding unit that supports a plurality of objects to be processed at a predetermined pitch, and that can be arranged in the processing container, each of the plurality of objects to be processed having an exposed silicon layer and an exposed tungsten layer; the controlling unit being adapted to control the supplying unit of an oxidative gas and the supplying unit of an reducing gas so as to control respective supply flow rates of the oxidative gas and the reducing gas into the processing container in such a manner that the silicon layers of the plurality of objects to be processed are selectively oxidized.
Alternatively, the present invention is a program for controlling an oxidizing unit including: a processing container whose inside can be vacuumed, the processing container having a predetermined length; a supplying unit of an oxidative gas that supplies an oxidative gas into the processing container; a supplying unit of an reducing gas that supplies a reducing gas into the processing container; and a holding unit that supports a plurality of objects to be processed at a predetermined pitch, and that can be arranged in the processing container, each of the plurality of objects to be processed having an exposed silicon layer and an exposed tungsten layer; the program being adapted to cause a computer to execute: a controlling procedure for controlling the supplying unit of an oxidative gas and the supplying unit of an reducing gas so as to control respective supply flow rates of the oxidative gas and the reducing gas into the processing container in such a manner that the silicon layers of the plurality of objects to be processed are selectively oxidized.
Alternatively, the present invention is a storage medium capable of being read by a computer, storing the above program.
Alternatively, the present invention is a storage medium capable of being read by a computer, storing software for controlling an oxidizing method for an object to be processed, the oxidizing method comprising: an arranging step of arranging a plurality of objects to be processed in a processing container whose inside can be vacuumed, the processing container having a predetermined length, a supplying unit of an oxidative gas and a supplying unit of a reducing gas being provided at the processing container, each of the plurality of objects to be processed having an exposed silicon layer and an exposed tungsten layer; an active-species forming step of supplying the oxidative gas and the reducing gas into the processing container, causing the both gases to react on each other under a reduced pressure, and generating active oxygen species and active hydroxyl species in the processing container; and an oxidizing step of oxidizing surfaces of the silicon layers of the plurality of objects to be processed by means of the active species.
Hereinafter, an embodiment of an oxidizing method and an oxidizing unit according to the present invention is explained with reference to attached drawings.
As shown in
An open gas-discharging port 24 is provided at a ceiling part of the processing container 22. A gas-discharging line 26 that has been bent at a right angle in a lateral direction is provided to connect with the gas-discharging port 24. A gas-discharging system 32 including a pressure-control valve 28 and a vacuum pump 30 and the like on the way is connected to the gas-discharging line 26. Thus, the atmospheric gas in the processing container 22 can be discharged. Herein, the inside of the processing container 22 may be a vacuum or a substantially normal-pressure atmosphere, depending on a process manner.
A lower end of the processing container 22 is supported by a cylindrical manifold 34 made of for example stainless steel. Under the manifold 34, a wafer boat 36 made of quartz as a holding unit, on which a large number of semiconductor wafers W as objects to be processed are placed in a tier-like manner at a predetermined pitch, is provided in a vertically movable manner. The wafer boat 36 can be inserted into and taken out from the processing container 22, through a lower opening of the manifold 34. In the embodiment, for example about 25 to 100 wafers W having a 300 mm diameter may be supported in a tier-like manner at substantially the same interval (pitch) by the wafer boat 36. A sealing member 38 such as an O-ring is interposed between a lower end of the processing container 22 and an upper end of the manifold 34. Thus, airtightness between the processing container 22 and the manifold 34 is maintained.
The wafer boat 36 is placed above a table 42 via a heat-insulating cylinder 40 made of quartz. The table 42 is supported on a top part of a rotation shaft 28 that penetrates a lid member 44 for opening and closing the lower end opening of the manifold 34.
For example, a magnetic-fluid seal 48 is provided at a penetration part of the lid member 44 by the rotation shaft 28. Thus, the rotation shaft 28 can rotate while maintaining airtightness by the lid member 44. In addition, a sealing member 50 such as an O-ring is provided between a peripheral portion of the lid member 44 and a lower end portion of the manifold 34. Thus, airtightness between the lid member 44 and the manifold 34 is maintained, so that airtightness in the processing container 22 is maintained.
The rotation shaft 28 is attached to a tip end of an arm 54 supported by an elevating mechanism 52 such as a boat elevator. When the elevating mechanism 52 is moved up and down, the wafer boat 36 and the lid member 44 and the like may be integrally moved up and down.
Herein, the table 42 may be fixed on the lid member 44. In the case, the wafer boat 36 doesn't rotate while the process to the wafers W is conducted.
A heating unit 56, which consists of for example a heater made of a carbon-wire disclosed in JP A 2003-209063, is provided at a side portion of the processing container 22 so as to surround the processing container 22. The heating unit 56 is capable of heating the semiconductor wafers W located in the processing container 22. The carbon-wire heater can achieve a clean process, and is superior in characteristics of rise and fall of temperature.
A heat insulating material 58 is provided around the outside periphery of the heating unit 56. Thus, the thermal stability of the heating unit 56 is assured.
In addition, various gas-supplying units are provided at the manifold 34, in order to introduce various kinds of gases into the processing container 22.
Specifically, at the manifold 34, an oxidative-gas supplying unit 60 that supplies an oxidative gas into the processing container 22 and a plurality of reducing-gas supplying units 62 that supplies a reducing gas into the processing container 22 are respectively provided.
The oxidative-gas supplying unit 60 has a oxidative-gas ejecting nozzle 64 that pierces the side wall of the manifold 34. A tip portion of the oxidative-gas ejecting nozzle 64 is located in an area on a lower end side in the processing container 22. On the way of a gas passage 68 extending from the oxidative-gas ejecting nozzle 64, a flow-rate controller 72 such as a mass flow controller is provided.
The reducing-gas supplying unit 62 has a reducing-gas ejecting nozzle 66 that pierces the side wall of the manifold 34. A tip portion of the reducing-gas ejecting nozzle 66 is also located in the area on a lower end side in the processing container 22. On the way of a gas passage 70 extending from the reducing-gas ejecting nozzle 66, a flow-rate controller 74 such as a mass flow controller is provided.
Then, a controlling part 76 consisting of a micro computer or the like is adapted to control the respective flow-rate controllers 72 and 74 to control supply flow rates of the respective gases into the processing container 22. When the both gases react on each other, active oxygen species and active hydroxyl species may be generated.
The controlling part 76 has also a function of controlling the whole operation of the oxidizing unit 20. The operation of the oxidizing unit 20, which is described below, is carried out based on commands from the controlling part 76. In addition, the controlling part 76 has a storage medium 80 such as a floppy disk or a flash memory in which a program for carrying out various control operations has been stored in advance. Alternatively, the controlling part 76 is connected (accessible) to the storage medium 80.
Herein, an O2 gas is used as the oxidative gas, and an H2 gas is used as the reducing gas. In addition, if necessary, an inert-gas supplying unit, which is not shown but supplies an inert gas such as an N2 gas, may be provided.
Next, an oxidizing method carried out by using the oxidizing unit 20 is explained. As described above, the operations of the oxidizing unit 20 are carried out based on the commands from the controlling part 76 based on the program stored in the storage medium 80.
When the semiconductor wafers W consisting of for example silicon wafers are unloaded and the oxidizing unit 20 is under a waiting state, the processing container 22 is maintained at a temperature, which is lower than a process temperature. Then, the wafer boat 36 on which a large number of, for example fifty, wafers W of a normal temperature are placed is moved up and loaded into the processing container 22 in a hot-wall state from the lower portion thereof. The lid member 44 closes the lower end opening of the manifold 34, so that the inside of the processing container 22 is hermetically sealed.
As shown in
Then, the inside of the processing container 22 is vacuumed and maintained at a predetermined process pressure. On the other hand, electric power supplied to the heating unit 56 is increased so that the wafer temperature is raised and stabilized at a process temperature for the oxidation process. After that, predetermined process gases, herein the O2 gas and the H2 gas, are respectively supplied from the gas ejecting nozzle 64 of the oxidative-gas supplying unit 60 and the gas ejecting nozzle 66 of the reducing-gas supplying unit 62 into the processing container 22 while the flow rates of the gases are controlled.
The both gases ascend in the processing container 22 and react on each other in a vacuum atmosphere in order to generate the active hydroxyl species and the active oxygen species. The active species come in contact with the wafers W contained in the rotating wafer boat 36. Thus, the oxidation process is conducted to the wafer surfaces. That is, the surfaces of the silicon layers 4 are oxidized and thus SiO2 films are formed. On the other hand, the surfaces of the tungsten layers 8 are scarcely oxidized, so that no film is formed. The respective process gases and a reaction product gas are discharged outside from the gas-discharging port 24 at the ceiling part of the processing container 22.
At that time, the total gas flow rate of the H2 gas and the O2 gas is within a range of 2000 sccm to 4000 sccm, for example 2000 sccm. Then, density of the H2 gas in the total gas flow rate is not less than 75% and less than 100%. As described below, if the density of the H2 gas is less than 75%, not only the surfaces of the silicon layers 4 are oxidized, but also the surfaces of the tungsten layers 8 may be oxidized. The oxidized tungsten layers 8 remain as they are, so that a sufficient selective oxidation process can not be achieved. To the contrary, if the density of the H2 gas is 100%, the surfaces of the silicon layers 4 can not be oxidized.
As described above, the H2 gas and the O2 gas separately introduced into the processing container 22 ascend in the processing container 22 of a hot-wall state, cause a burning reaction of hydrogen in the vicinity of the wafers W, and form an atmosphere mainly consisting of the active oxygen species (O*) and the active hydroxyl species (OH*). These active species oxidize the surfaces of the wafers W so that SiO2 films are formed. On the other hand, even if the surfaces of the tungsten layers 8 are oxidized, they are immediately reduced by the H2 gas, so that they are still metal. As a result, a selective oxidation process may be achieved. That is, as shown in
Regarding the process condition at that time, the wafer temperature is within 450 to 900° C., for example 850° C., and the pressure is not higher than 466 Pa (3.5 Torr), for example 46.6 Pa (0.35 Torr). In addition, the processing time is for example about 10 to 30 minutes although it depends on a film thickness of the formed film. If the process temperature is lower than 450° C., the above active species (radicals) may not be generated sufficiently. To the contrary, if the process temperature is higher than 900° C., the tungsten layers 8 may react on silicon atoms to become silicide. In addition, if the process pressure is higher than 3.5 Torr, the above active species may not be generated sufficiently. At that time, preferably, the process pressure is not higher than 1 Torr.
Herein, a forming process of the active species is thought as follows. That is, since the hydrogen and the oxygen are separately introduced into the processing container 22 of a hot-wall state under a reduced-pressure atmosphere, it may be thought that the following burning reaction of the hydrogen is promoted near to the wafers W. In the following expressions, chemical symbols with a mark “*” mean active species thereof.
H2+O2→H*+HO2
O2+H*→OH*+O*
H2+O*→H*+OH*
H2+OH*→H*+H2O
As described above, when the H2 gas and the O2 gas are separately introduced into the processing container 22, the O* (active oxygen species) and the OH* (active hydroxyl species) and the H2O (moisture vapor) are generated during the burning reaction of the hydrogen. These (O*, OH*, H2O) oxide the surfaces of the silicon layers 4 of the wafers, so that the SiO2 films are formed. At that time, in particular, it is thought that the O* and the OH* greatly contribute to the oxidation effect.
Then, an actual selective oxidation process was conducted to wafers of silicon substrates, each of which has an exposed silicon layer and an exposed tungsten layer.
<Evaluation Experiment 1>
At first, as an evaluation experiment 1, in order to find a condition to assure selectivity between an oxidation to a surface of the tungsten layer and an oxidation to a surface of the silicon layer, dependency of the film thickness (film-forming rate) on the process pressure was examined.
As clearly seen from
The reason of the above characteristics is as follows. That is, in an area wherein the process pressure is higher than 1 Torr, the moisture vapor is dominant in the atmosphere, so that oxidizing species contributing to the oxidation of the silicon layers are the moisture vapor. On the other hand, when the process pressure is not higher than 1 Torr, active oxygen species and active hydroxyl species are rapidly generated, and then these active species become dominant in the atmosphere. Thus, these active species contribute to the oxidation of the silicon layers as oxidizing species. As described above, since the both active species oxidize the silicon layers as oxidizing species, the film thickness is rapidly increased, although the process pressure is smaller than 1 Torr.
Herein, if only the film thickness is taken into consideration, it may be evaluated that both the case wherein the moisture vapor is oxidizing species and the case wherein the active oxygen species and the active hydroxyl species are oxidizing species are good. However, it can be found by measuring particles on the surfaces of the tungsten layers that the oxidation process in the atmosphere mainly consisting of the moisture vapor is not preferable, but that the oxidation process in the atmosphere wherein the active oxygen species and the active hydroxyl species are oxidizing species is preferable. Actually, the number of particles on the surface of a tungsten layer obtained by each condition of
On the other hand, when the process pressure is not higher than 3.5 Torr, the number of particles is very small. In other words, the surfaces of the tungsten layers are scarcely oxidized. Thus, when the process pressure is not higher than 3.5 Torr, a selective oxidation process can be achieved with a sufficient selectivity. In the case, from the graph shown in
<Evaluation Experiment 2>
Next, as an evaluation experiment 2, a relationship between H2-gas density in total flow rate of the O2 gas and the H2 gas and selectivity was evaluated.
Herein, the total flow rate of the O2 gas and the H2 gas was fixed to 2000 sccm, and the density of the H2 gas was changed between 50%, 75% and 85%. Regarding the other process conditions, the process temperature was 850° C., the process pressure was 0.35 Torr (47 Pa), which is within a pressure range defined by the above evaluation experiment 1, and the processing time was 20 minutes.
At first, in the respective H2-gas densities, SiO2 films were formed on the surfaces of the silicon layers at sufficient large film-forming rates. On the other hand, as shown in
As shown in
As shown in
As a result, in order to carry out a selective oxidation process with a sufficient high selectivity, it was confirmed that it is necessary to set the H2-gas density at 75% or more with respect to the total flow rate of the process gases to make a hydrogen-rich state, preferably to set the H2-gas density at 85% or more. In the case, the upper limit of the H2-gas density is less than 100%. Taking into consideration the film-forming rates of the oxide films formed on the surfaces of the silicon layers and the throughput, the practical upper limit of the H2-gas density is about 95%. In addition, in the respective H2-gas densities, generation of bird's beaks was not found. That is, it was confirmed that generation of bird's beaks is also inhibited.
<Evaluation Experiment 3>
Next, in order to confirm a crystal structure, an X-ray was irradiated onto the surfaces of the tungsten layers of
In
As shown in
In the above embodiment, each of the gas ejecting nozzles 64 and 66 has one gas ejecting port. However, this invention is not limited thereto. For example, a so-called dispersion-type of gas ejecting nozzle may be used, which has a linear glass tube arranged in a longitudinal direction in the processing container 22 and a plurality of gas ejecting ports provided at the glass tube at a predetermined pitch. In addition, the processing container 22 is not limited to the single tube structure, but may be a processing container having a double tube structure consisting of an inner tube and an outer tube.
In addition, in the above embodiment, the O2 gas is used as an oxidative gas. However, this invention is not limited thereto. An N2O gas, an NO gas, an NO2 gas and the like may be used. In addition, in the above embodiment, the H2 gas is used as a reducing gas. However, this invention is not limited thereto. An NH3 gas, a CH4 gas, an HCl gas and the like may be used.
In addition, this invention is applicable to an LCD substrate, a glass substrate or the like, as an object to be processed, instead of the semiconductor wafer.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2004-050514 | Feb 2004 | JP | national |
| 2005-009630 | Jan 2005 | JP | national |
