Package structure and manufacturing method thereof

Abstract

A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a chip and a packing material layer. The substrate has a top surface and a lateral surface. The top surface is connected with the lateral surface. The chip is disposed on the top surface. The packing material layer comprises a body portion and a extending portion. The body portion covers at least a part of the chip and substrate. The extending portion is connected with the body portion and covers at least a part of substrate. The extending portion is projected to the lateral surface and made from a transparent material.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A˜1D illustrate a conventional manufacturing process of package structure;

FIGS. 2A˜2C illustrate a transfer molding process of FIG. 1D;

FIG. 3 illustrates a manufacturing process of the package structure according to a preferred embodiment of the invention;

FIG. 4A illustrates a cross-sectional view of the package structure of FIG. 3 along a cross-sectional line A-A′;

FIG. 4B illustrates a cross-sectional view of the package structure of FIG. 3 along a cross-sectional line B-B′;

FIG. 4C illustrates a cross-sectional view of the package structure of FIG. 3 along a cross-sectional line C-C′;

FIG. 5 illustrates a flowchart of a manufacturing method of the package structure according to the invention; and

FIGS. 6A˜6E illustrate a manufacturing process of the package structure of FIG. 3.

Claims

1. A package structure, comprising: a substrate having a top surface and a lateral surface, wherein the top surface is connected with the lateral surface;a chip disposed on the top surface; anda packing material layer, comprising a body portion covering at least a part of the chip and substrate; andan extending portion connected with the body portion and covering at least a part of substrate, the extending portion is projected to the lateral surface and made from a transparent material.

2. The package structure according to claim 1, wherein the packing material layer covers the entire chip.

3. The package structure according to claim 1, wherein the body portion exposes a part of the top surface for carrying the extending portion.

4. The package structure according to claim 1, wherein there is a concavo-convex structure between the body portion and the extending portion, such that the extending portion and the body portion can be engaged.

5. The package structure according to claim 1, wherein the extending portion is adhered onto the body portion.

6. The package structure according to claim 1, wherein the substrate is a rectangular structure with four lateral surfaces, the extending portion is a circular structure and projected to the lateral surfaces.

7. The package structure according to claim 1, wherein the extending portion has a bottom surface, which defines a recess with the lateral surface, the package structure further comprises: a light source disposed inside the recess for emitting a light, the light passes through the extending portion to be projected outside.

8. The package structure according to claim 7, wherein the light source is a filament and is electrified to emit the light.

9. The package structure according to claim 8, wherein the package structure is a fingerprint recognizer and the chip is a fingerprint recognition chip.

10. The package structure according to claim 1, wherein the package structure is a wiring bonding package structure.

11. A manufacturing method of package structure, the method comprising: providing a substrate having a top surface and a lateral surface;disposing a chip on the top surface; andcovering a packing material layer on at least a part of the chip, wherein the packing material layer is projected to the lateral surface.

12. The manufacturing method of package structure according to claim 11, wherein in the step of covering the packing material layer, the packing material layer covers the entire chip.

13. The manufacturing method of package structure according to claim 11, wherein the packing material layer comprises a body portion and an extending portion, and the step of covering the packing material layer further comprises: covering the body portion on at least a part of the chip; andenabling the extending portion to be coupled with the body portion and projected to the lateral surface.

14. The manufacturing method of package structure according to claim 13, wherein in the step of covering the body portion, the body portion exposes a part of the top surface for carrying the extending portion.

15. The manufacturing method of package structure according to claim 13, wherein there is a concavo-convex structure between the extending portion and the body portion, and in the step of coupling the extending portion with the body portion, the body portion and the extending portion are engaged by the concavo-convex structure.

16. The manufacturing method of package structure according to claim 13, wherein in the step of coupling the extending portion with the body portion, the body portion and the extending portion are adhered by an adhesive.

17. The manufacturing method of package structure according to claim 13, wherein the substrate is a rectangular structure with four lateral surfaces, and the extending portion is a circular structure.

18. The manufacturing method of package structure according to claim 13, wherein the extending portion is made from a transparent material.

19. The manufacturing method of package structure according to claim 18, wherein the extending portion has a bottom surface, which contacts the top surface and defines a recess with the lateral surface, the method further comprises: disposing a light source inside the recess for emitting a light, wherein the light passes through the extending portion to be projected outside.

20. The manufacturing method of package structure according to claim 19, wherein the light source is a filament, which is electrified to emit the light.

21. The manufacturing method of package structure according to claim 20, wherein the package structure is a fingerprint recognizer, and the chip is a fingerprint recognition chip.

22. The manufacturing method of package structure according to claim 11, further comprising: wiring bonding the chip and the substrate by a plurality of bonding wires.