Claims
- 1. An electro-active device comprising a plurality of layers laminated about at least one electro-active ceramic layer to form an electro-active ceramic package, and including
- a first and a second electro-active ceramic layer, at least one of said first and second electro-active ceramic layers extending over a region and having a first surface and a second surface opposite to said first surface region;
- a flexible circuit covering a substantial portion of said first surface of said electro-active ceramic layer, the flexible circuit including a non-conductive polymer film layer having opposing first and second surfaces and a conductive lead layer, said first surface of said polymer film layer being attached to said conductive lead layer; and
- a bonding layer attaching said electro-active ceramic layer to said flexible circuit,
- wherein said first and second electro-active ceramic layers are oriented to produce torsional actuation
- wherein said lead layer includes a pattern of lead segments forming a conductive line extending in a path across said film layer and protruding therefrom;
- wherein said flexible circuit is configured such that
- i) said conductive line extends substantially entirely across and is attached to said first surface of the electro-active ceramic layer for energizing said entire first surface while bridging cracks; and
- ii) said polymer film layer covers said electro-active ceramic layer and said conductive line, and
- wherein said bonding layer attaches said electro-active ceramic layer to said flexible circuit such that in-plane strain of the electro-active ceramic layer is shear-coupled from substantially said entire first surface of the electro-active ceramic layer through the flexible circuit
- so that said in-plane strain is effectively transferred to said second surface of the polymer film layer for utilization of strain produced by the electro-active ceramic layer.
- 2. An electro-active device according to claim 1, wherein said first and second electro-active ceramic layers are in different layers of the device and are connected for moving in different senses.
Parent Case Info
This application is a continuation of application of Ser. No. 08/188,145 filed on Jan. 27, 1994. The contents of the aforementioned application are hereby incorporated by reference.
US Referenced Citations (25)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0 005 265 |
Nov 1979 |
EPX |
2435910 |
Feb 1975 |
DEX |
1370164 |
Oct 1974 |
GBX |
WO 9112953 |
Sep 1991 |
WOX |
Non-Patent Literature Citations (1)
Entry |
R/flex Circuit Materials Product Data Sheet DS20903J, "Flex-I-MID 3000, High Performance Adhesiveles Circuit Materials", by Rogers Corporation, Microwave and Circuit Materials Division. |
Continuations (1)
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Number |
Date |
Country |
Parent |
188145 |
Jan 1994 |
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