Claims
- 1. A packaging and interconnection of a contact structure, comprising:a contact structure made of conductive material and formed on a contact substrate, said contact structure having a base portion vertically formed on said contact substrate, a horizontal portion, one end of which being formed on said base portion, and a contact portion vertically formed on another end of said horizontal portion; a contact trace formed on said contact substrate and electrically connected to said contact structure at one end, the other end of said contact trace being formed of a contact pad; a connector for establishing electrical connection with said contact pad; a conductive lead for electrically connecting an upper surface of the contact pad and the connector; an elastomer provided under said contact substrate for allowing flexibility in said interconnection and packaging; and a support structure provided under said elastomer for supporting said contact structure, said contact substrate and said elastomer; wherein substantially all portions of said contact structure are projected from said contact substrate to a free space to allow free movements of at least said horizontal portion and said contact portion, and wherein said horizontal portion of said contact structure produces a resilient contact force when said contact structure is pressed against a contact target, thereby scrubbing a surface of the contact target.
- 2. A packaging and interconnection of a contact structure as defined in claim 1, wherein said contact substrate is a silicon substrate on which said contact structure is directly formed through a photolithography process.
- 3. A packaging and interconnection of a contact structure as defined in claim 1, wherein said contact substrate is a dielectric substrate on which said contact structure is directly formed through a photolithography process.
- 4. A packaging and interconnection of a contact structure as defined in claim 1, wherein said contact trace is made of conductive material and formed through either a deposition, evaporation, sputtering or plating process.
- 5. A packaging and interconnection of a contact structure as defined in claim 1, wherein said support structure is made of ceramic, molded plastic or metal.
- 6. A packaging and interconnection of a contact structure as defined in claim 1, wherein said conductive lead has a plurality of vertically aligned leads to be received by said connector.
- 7. A packaging and interconnection of a contact structure as defined in claim 1, wherein said conductive lead is a double layer lead which is formed in a tape automated bonding (TAB) structure.
- 8. A packaging and interconnection of a contact structure as defined in claim 1, wherein said conductive lead is a triple layer lead which is formed in a tape automated bonding (TAB) structure.
Parent Case Info
This is a continuation of U.S. patent application Ser. No. 09/240,457 filed Jan. 29, 1999 now U.S. Pat. No. 6,255,585 B1.
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Continuations (1)
|
Number |
Date |
Country |
Parent |
09/240457 |
Jan 1999 |
US |
Child |
09/764620 |
|
US |