Particle control device and particle control method for vacuum processing apparatus

Abstract

A particle control device and a particle control method capable of controlling occurrences of particles in a vacuum reactor are provided. The particle control device for a vacuum processing apparatus having a vacuum reactor, a gas delivery means for supplying process gases to the vacuum reactor, and a sample table for placing and supporting a sample in the vacuum reactor, wherein the apparatus subjects the sample to vacuum processing, the device comprises: a particle monitor for detecting particles floating inside the vacuum reactor; means for generating apparatus condition data indicating a condition of the vacuum processing apparatus; and data managing means for determining a component which is high in a particle occurrence probability based on particle data detected by the particle monitor and the apparatus condition data, thereby enabling the component determined to be displayed.

Description

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a particle control device and a particle control method for a vacuum processing apparatus, and more particularly to a particle control device and a particle control method for a vacuum processing apparatus capable of controlling occurrence of particles in the vacuum processing apparatus.

[0002] A vacuum processing apparatus such as a plasma etching apparatus generates plasma in a vacuum reactor in a state where the vacuum reactor is charged with etching gases. A predetermined semiconductor circuit is formed by reacting radicals and ions generated in the plasma with a wafer surface to be etched. In such plasma etching apparatus, reaction products which are generated in the etching process are deposited on inner walls and electrodes of the vacuum reactor. The deposited reaction products strip off from the inner walls and the electrodes after a certain period of time to float inside the vacuum reactor.

[0003] Further, the plasma etching apparatus is provided with many mechanical components which may be particle sources, such as a robot for carrying wafers in or from the vacuum reactor and valves provided on wafer transferring passages.

[0004] Particles which occur from such components and float inside the vacuum reactor adhere on the wafer surface during the etching process and the like, or fall on the wafer surface when the plasma discharge is terminated after the completion of the etching process. The particles which have adhered or fallen on the wafer surface cause imperfect etching and failures in subsequent processes, ultimately leading to decreased yield or reliability of the semiconductor products.

[0005] In a typical semiconductor manufacture line, apparatus control is conducted in such a manner that a wafer for particle inspection (dummy wafer) or a surface of a product wafer processed is reviewed periodically by using a particle inspection device to detect the number of particles present on the wafer surface and particle sizes of the particles. However, this method cannot detect particles during processing of the product wafer. With the method, therefore, a large amount of defective wafers will undesirably be produced until the particles are detected in the next inspection.

[0006] Japanese Patent Laid-open No. 2002-57143, for example, discloses a floating particle detector capable of real-time detection (in-situ measurement) of particles during the processing of wafer, which relates to the above-mentioned problem. This device irradiates inner walls of a vacuum reactor in a semiconductor manufacturing apparatus with laser light which is emitted from a laser light source, and detects laser light which is scattered from particles therein using an optical system for scattered light detection, thereby detecting the particles floating inside the vacuum reactor.

[0007] Also, Japanese Patent Laid-open No. 6-201600 discloses a particle measurement system capable of measuring particles floating inside a vacuum reactor in synchronization with a process of processing wafers one by one during processing one lot of wafers, and displaying on a display unit or printing out the particle measurement result.

[0008] Although the floating particle detector disclosed in Japanese Patent Laid-open No. 2002-57143 is capable of detecting the occurrence of particles in the semiconductor manufacturing apparatus, it has difficulty in determining particle sources. Further, according to the system disclosed in Japanese Patent laid-open No. 6-201600, it is possible to detect on which wafer in the one lot the particles are present; however, the system has difficulty in determining the particle sources.

[0009] That is to say, although the conventional techniques enable to detect occurrence of particles and when the particles occurred, they have difficulty in determining the particle sources. If the particle sources are not specified, it is difficult to decide a countermeasure to take and it is impossible to provide a drastic solution to the occurrence of particles.

[0010] If the particles occur, the vacuum reactor is usually opened to the air and cleaned by using water or an organic solvent. However, since such treatment is performed without determining the cause of the occurrence of particles, the particles occur soon after the cleaning in many cases. Further, since it takes a considerably long period of time for the cleaning of the vacuum reactor, an operation rate of the vacuum reactor is decreased, resulting in a reduction in productivity of the manufacture line.

SUMMARY OF THE INVENTION

[0011] The present invention has been made in view of the above problems. The invention provides a particle control device and a particle control method capable of controlling the occurrence of particles in a vacuum processing apparatus.

[0012] The present invention employs the following means in order to solve the problems.

[0013] According to an aspect of the present invention, there is provided a particle control device for a vacuum processing apparatus having a vacuum reactor, a gas delivery means for supplying process gases to the vacuum reactor, and a sample table for placing and supporting a sample in the vacuum reactor, wherein said apparatus subjects the sample to vacuum processing, the device comprising: a particle monitor for detecting particles floating inside the vacuum reactor; means for generating apparatus condition data indicating a condition of the vacuum processing apparatus; and data managing means for determining a component which is high in a particle occurrence probability based on particle data detected by the particle monitor and the apparatus condition data, thereby enabling the component determined to be displayed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Other objects and advantages of the invention will become apparent from the following description of embodiments with reference to the accompanying drawings in which:

[0015] FIG. 1 is a diagram illustrating a particle control device according to a first embodiment of the present invention;

[0016] FIG. 2 is a diagram showing a data structure of a particle source database;

[0017] FIG. 3 is a diagram showing an example of display images to be displayed on a display unit;

[0018] FIG. 4 is a diagram showing another example of the display images to be displayed on the display unit;

[0019] FIG. 5 is a diagram showing another example of the display images to be displayed on the display unit;

[0020] FIG. 6 is a diagram illustrating a second embodiment of the present invention;

[0021] FIG. 7 is a diagram illustrating a third embodiment of the present invention;

[0022] FIG. 8 is a diagram illustrating a structure of the particle source database; and

[0023] FIG. 9 is a flowchart illustrating a process of updating the particle source database.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] Embodiments of the present invention will hereinafter be described with reference to accompanying drawings.

[0025] FIG. 1 is a diagram illustrating a particle control device according to a first embodiment of the present invention. As shown in FIG. 1, a vacuum processing apparatus 100 such as a plasma etching apparatus includes a vacuum reactor 2 and a plasma generation unit 3 having an antenna electrode and a coaxial line for supplying high frequency power to the antenna electrode. A particle measurement window 4 is provided on a wall of the vacuum reactor 2. A gas delivery unit 5 supplies process gases to the vacuum reactor 2. A particle monitor 6 emits laser light to the interior of the vacuum reactor 2 and detects laser light which is scattered by the particles in the vacuum reactor 2, to thereby detect the size (particle size) of floating particles and the number of the particles. The detected values are outputted as particle data. A gas exhaust unit 8 exhausts the gases from the vacuum reactor 2 to maintain a gas pressure in the vacuum reactor 2 at a predetermined value. A sample table 9 is used for placing thereon a sample 10 such as a wafer. A gate valve 11 is used for partitioning the vacuum reactor 2 from a buffer chamber 13, which is adapted to open when a transfer robot 12 accesses to the vacuum reactor 2. The robot 12 carries the sample 10 to be etched in or from the sample table 9. The buffer chamber 13 is used when the sample is carried in or from the vacuum reactor. A apparatus control unit 14 is an apparatus control unit, generating process control signals for controlling the plasma etching apparatus in accordance with a recipe and monitoring the state of control. Further, the apparatus control unit 14 generates and outputs apparatus condition data which indicate a condition of the vacuum reactor (e.g., open/close of valve, gas flow rate, sample transfer position, gas pressure, bias potential, time elapsed from the preceding reactor cleaning, accumulated time of sample processing, contents of sample processing, etc.) based on the control signals or the monitor result.

[0026] A data managing unit 200 determines a component which is high in a particle occurrence probability based on the particle data generated by the particle monitor 6 and the apparatus condition data generated by the apparatus control unit 14 or on the particle occurrence timing. The component determined is displayed on a display unit 17. A data combining/managing unit 15 combines time series of the particle data with time series of the apparatus condition data to generate another series of data. A data storage unit 16 stores the combined data, the particle data, and the apparatus condition data, together with data of time and date of the particle occurrence. A particle source determination unit 19 determines, based on the combined data, the component which is high in the particle occurrence probability and with reference to a particle source database 20. The particle source database 20 stores the apparatus condition data, particle source data indicating a probable particle source from which the particles are likely to occur when the vacuum reactor is in a condition of the apparatus condition data, and particle occurrence probability data of the particle source. The particle occurrence probability data may be prepared based on data of past results of countermeasures taken against particles, experiences of operators of the vacuum reactor, or the like. Even if the apparatus condition data does not change, the particle occurrence probability data may preferably be recorded every time the number of particles and the particle size distribution change while a particle source relevant to the changes is determined.

[0027] The display unit 17 displays a plurality of the particle sources, for example, which are determined by the particle source determination unit 19 with the occurrence probability being added to each of the particle sources. It is possible to display countermeasures for the respective particle sources, too. A countermeasure result input unit 18 is used by the operator of the vacuum reactor for inputting a result of the countermeasure which has been taken in accordance with the displayed countermeasure. A history storage unit 21 stores the particle sources which are determined by the particle source determination unit 19, occurrence probabilities of the respective particle sources, countermeasures, countermeasure results, and so forth. In addition, it is possible to store the combined data in the history storage unit 21.

[0028] The combined data, which are generated by combining the time series of the particle data and the time series of the apparatus condition data, are outputted to the particle source determination unit 19 and stored simultaneously in the data storage unit 16. The combined data includes the particle occurrence date and time data and the apparatus condition data at the date and time of the particle occurrence.

[0029] The particle source determination unit 19 receives the combined data and searches the particle source database 20 based on the received combined data using a search key which will be described later in this specification. For example, every time particles occur, the particle source determination unit 19 searches the particle source database 20 using the number of particles per particle size and the reactor condition as the search keys to determine a plurality of components which are high in the likelihood of being the particle source and occurrence probabilities of the likelihood. The determined data is displayed on the display unit 17. Further, if the particle source determination unit 19 searches the particle source database 20, countermeasures to be taken against the particle occurrences can be displayed on the display unit 17.

[0030] FIG. 2 is a diagram showing a data structure of the particle source database 20. As shown in FIG. 2, the particle source database 20 includes search keys and output values. In the search, the apparatus condition data and the particle data or either one of them are assigned as the search key. The output values may be the particle source data and the occurrence probability data of the particle source, the countermeasure data or part of these data.

[0031] Depending on the countermeasure obtained by the search, the particle source determination unit 19 can send signals for performing vacuum reactor control in accordance with the countermeasure to the apparatus control unit 14 immediately after the search. For example, if it has been judged that the particle source was a minor deposition on the inner walls of the vacuum reactor 2, the particle source determination unit 19 instructs the apparatus control unit 14 to perform plasma cleaning automatically before the subsequent wafer processing.

[0032] The combined data including the particle data and the apparatus condition data as well as the countermeasure history are stored in the history storage unit 21. This permits to refer to past situations immediately when so required. Further, after a countermeasure is taken, the countermeasure result input unit 18 registers a result of the countermeasure in the particle source database 20. Thus, it is possible to improve an accuracy of the particle source database 20.

[0033] FIG. 3 is a diagram showing an example of display images to be displayed on the display unit 17, in which a particle occurrence state and a particle occurrence source probability are shown. In FIG. 3, a particle occurrence state display section 30 has an occurrence date and time column 31, number of particles per particle size columns 32 to 35, a total number of particles column 36, and a reactor condition at particle occurrence column 37.

[0034] The example shown in FIG. 3 indicates that particles occurred when the valve 7 was closed, and the total number of the particles was 45, wherein included were 7 particles each having a particle size of 0.2 μm or less, 3 particles each having a particle size of 0.2 to 0.5 μm, 10 particles each having a particle size of 0.5 to 1.0 μm, and 25 particles each having a particle size of 1.0 μm or more.

[0035] A display section 40 indicates a particle source probability, wherein components which are estimated to be sources of the particles, which are displayed on the particle occurrence state display section 30, are displayed as particle sources on a particle source column 41. Also, probabilities of being true particle source of the respective particle sources are displayed on a column 42 of a particle source probability. Further, countermeasures for the respective particle sources are displayed on a countermeasure column 43.

[0036] The particle sources and the countermeasures are displayed as described above. This permits the operator performing the vacuum reactor control to judge instantly what countermeasure is to be taken against a particle occurrence. Further, if the situation is not improved by the countermeasure, the operator can recognize a second nominated countermeasure. Therefore, it is possible to reduce to a large extent shut-down periods of the apparatus caused by the particle occurrence.

[0037] In the example shown in FIG. 3, the combinations of the particle sources and the probabilities are such that the valve 7 has the probability of 50%, the component A has the probability of 20%, the component B has the probability of 15%, the valve 4 has the probability of 5%, the component C has the probability of 2%, the component D has the probability of 2%, and the component E has the probability of 2%. Therefore, the operator performs cleaning of the valve 7 which is the countermeasure for the component having the highest probability. If no improvement is attained by the cleaning, the component A, which has the second highest probability, is subjected to plasma cleaning (1).

[0038] FIG. 4 is a diagram showing another example of the display images to be displayed on the display unit 17. In the example, a display section 50 of course of particle occurrence and particle source has a particle occurrence date and time column 51, a number of particles column 52, a reactor condition column 53, a particle source having the highest probability column 54, and a countermeasure column 55. In the number of particles column 52, numbers of particles per particle size are displayed by using different display patterns or display colors for respective particle sizes which are indicated in a particle particle size legend display section 60.

[0039] The particle source determination unit 19 judges whether or not a countermeasure should be taken by the operator based on the numbers of particles (numbers of particles per particle size) and the reactor condition. The particle source determination unit 19 displays no countermeasure if it is judged that no countermeasure is necessary, or displays one or more countermeasures on the countermeasure column 55 only when it is judged that the countermeasure or countermeasures is/are necessary.

[0040] FIG. 5 is a diagram showing another example of the display images to be displayed on the display unit 17. In the example, a result of determined particle sources is displayed. A particle source determination result display section 70 graphically indicates components which will be determined as the particle sources.

[0041] The particle source determination unit 19 searches the particle source database 20 based on the received merged data to determine a plurality of components which are high in the likelihood of being the particle source as well as occurrence probabilities of the likelihood. The determination result is graphically displayed on the particle source determination result display section 70.

[0042] In the example of FIG. 5, the determined components of the particle source determination result are displayed in different display patterns or display colors. The probabilities (of likelihood) of being the particle source may be displayed together with the particle source determination result. For example, if the component 71 had 50% probability of being the particle source, the component 71 is displayed together with the probability with the display pattern or the display color thereof being varied from that of other components for emphasis. Further, each of the components 72 to 76 is displayed together with the probability in the same emphasized display fashion. In addition, a countermeasure or countermeasures may be displayed only when the operator has to take the countermeasure(s).

[0043] FIG. 6 is a diagram illustrating a second embodiment of the present invention. In FIG. 6, vacuum processing apparatuses 100a, 100b, and 100c are controlled by a data managing unit 200.

[0044] Each of the vacuum processing apparatuses 100a, 100b, and 100c has a particle monitor 6 and an apparatus control unit 14. The data managing unit 200 receives particle data and apparatus condition data from the particle monitor 6 and the apparatus control unit 14 as combined data. In the same manner as in the first embodiment, the data managing unit 200 searches a particle source database 20 using a search key generated based on the received combined data to provide the search result. The particle source database 20 may preferably be provided for each of the vacuum processing apparatuses 100a, 100b, and 100c so that the search and search result for each of the vacuum processing apparatuses 100a, 100b, and 100c are displayed as shown in FIG. 8.

[0045] FIG. 7 is a diagram illustrating a third embodiment of the present invention. In FIG. 7, vacuum processing apparatuses 100a, 100b, and 100c are controlled by a data managing unit 200.

[0046] In the present embodiment, the data managing unit 200 is made portable. In actual use, the operator carries the data managing unit 200 at a location where the vacuum processing apparatuses 100a, 100b, and 100c, which should undergo the particle control, are installed, and attaches it to any one of the vacuum processing apparatuses 100a, 100b, and 100c.

[0047] In this case, too, the data managing unit 200 searches a particle source database 20 using a search key generated based on the received combined data to provide the search result. The particle source database 20 may preferably be provided for each of the vacuum processing apparatuses 100a, 100b, and 100c so that the search and search result for each of the vacuum processing apparatuses 100a, 100b, and 100c are displayed as shown in FIG. 8.

[0048] FIG. 9 is a flowchart showing an update process of the particle source database 20. First of all, reference data are inputted to the particle source database 20 as initial values. The reference data to be inputted include apparatus condition data, particle data, particle source data, probability data, countermeasure data and so forth. The particle source data, the probability data, and the countermeasure data are estimated from the apparatus condition data or the particle data based on experiences of the operator before the reference data is inputted (Step 1).

[0049] Next, a particle occurrence state showing that a particle has actually occurred somewhere is inputted. Contents to be inputted include at least one of the apparatus condition data and the particle data. In inputting the data, it is possible to employ either a method of selecting the data from the combined data outputted from the data combining/managing unit 15 or a means of inputting the data using the countermeasure result input unit 18 (Step 2).

[0050] Next, a countermeasure which was actually taken against the particle occurrence and a result of the countermeasure are inputted. For example, the countermeasures include data on cleaning of a valve 11, plasma cleaning or the like. For the countermeasure result, “OK” is inputted if the particles no longer occur as a result of the countermeasure, and “NG” is inputted if the particles have continued to occur even after taking the countermeasure. In addition, if the particle occurrence was improved to a certain extent, “50% OK” or the like may be inputted (Step 3).

[0051] Then, the particle source database 20 is updated based on the inputs. If “OK” is inputted for the result of the specific countermeasure, the probability of being the particle source associated with the countermeasure is increased. If “NG” is inputted for the result of the countermeasure, the probability of being the particle source associated with the countermeasure is decreased (Step 4).

[0052] In this way, repetitive execution of steps 2 through 4 provides an improvement in an accuracy of the particle source database 20.

[0053] Another example of the process for determining a particle source (process of determining a particle source by deliberately operating a component to generate particles) will hereinafter be described. First of all, the vacuum processing apparatus 100 is actuated in a state where no product wafer is placed in the vacuum reactor 2. For example, part or whole of components constituting the vacuum processing apparatus 100 is/are actuated one by one or in combination. For instance, a following series of operations are performed: lowering the sample table 9 simultaneously with the opening of the valve 11, introducing the robot 12 to the vacuum reactor 2, returning the robot 12 to the buffer chamber 13, closing the valve 11, opening the valve 7, and supplying gases from the gas delivery unit 5 to the vacuum reactor 2.

[0054] After the completion of the series of operations, the operator refers to data such as those displayed on the display unit 17. Thus, it turns out that the particle monitor 6 has detected the occurrence of more than 30 particles each having a particle size of 1.0 μm or more when the robot 12 was introduced into the vacuum reactor 2. Also, it turns that the particle source determination unit 19 determines that the probabilities that the robot 12 and the buffer chamber 13 are the particle sources are 60% and 40%, respectively, and thereby countermeasures of cleaning the robot 12 and the buffer chamber 13 are required.

[0055] In this case, the operator cleans the robot 12 and the buffer chamber 13 in accordance with the countermeasures to prevent the occurrence of particles.

[0056] According to the above-described embodiments, the component having a high particle occurrence probability is determined and displayed based on the particle data generated by the particle monitor and the apparatus condition data generated by the apparatus control unit. Also, in displaying the component determined, the particle occurrence source and a plurality of candidates of countermeasures to be performed therefor are displayed together with the probability. Thus, it is possible to shorten the time required for determining the particle source and to shorten the time required for restoring the vacuum reactor to the normal condition. As a result, it is possible to improve the actual operation rate of the apparatus.

[0057] Further, since the particle source database is corrected based on the data about the particle sources which are actually detected, it is possible to increase an accuracy in determining particle sources and countermeasures for the particle sources. Also, it is possible to determine components and sequence processes which are prone to the particle occurrence. Thus, it is possible to effectively improve hardware and software of the apparatus based on the determination result.

[0058] It is possible to facilitate the operator's monitoring by providing the display unit with a printing unit, for example, and printing out the displayed items.

[0059] In the foregoing, the vacuum processing apparatus used for manufacturing semiconductors is described by way of example of the plasma etching apparatus; however, the present invention is applicable to apparatuses other than the semiconductor manufacturing apparatuses such as liquid crystal display devices and magnetic heads.

[0060] According to the present invention described above, it is possible to provide a particle control device and a particle control method capable of controlling occurrence of particles in a vacuum processing apparatus.

[0061] While the invention has been described in its preferred embodiments, it is to be understood that the words which have been used are words of description rather than limitation and that changes within the purview of the appended claims may be made without departing from the true scope and spirit of the invention in its broader aspects.

Claims

1. A particle control device for a vacuum processing apparatus having a vacuum reactor, a gas delivery means for supplying process gases to the vacuum reactor, and a sample table for placing and supporting a sample in the vacuum reactor, wherein said apparatus subjects the sample to vacuum processing, said device comprising: a particle monitor for detecting particles floating inside the vacuum reactor; means for generating apparatus condition data indicating a condition of the vacuum processing apparatus; and data managing means for determining a component which is high in a particle occurrence probability based on particle data detected by the particle monitor and the apparatus condition data, thereby enabling the component determined to be displayed.

2. A particle control device for a vacuum processing apparatus having a vacuum reactor, a gas delivery means for supplying process gases to the vacuum reactor, and a sample table for placing and supporting a sample in the vacuum reactor, wherein said apparatus subjects the sample to vacuum processing, said device comprising: a particle monitor for detecting on a real-time basis particles floating inside the vacuum reactor; apparatus control means for generating process control data based on a recipe, and controlling the vacuum processing apparatus data and generating apparatus condition data indicating a condition of the vacuum processing apparatus based on the generated process control; and data managing means for determining a component which is high in a particle occurrence probability based on particle data detected by the particle monitor and apparatus condition data generated by the apparatus control means, thereby enabling the component determined to be displayed.

3. A particle control device for a vacuum processing apparatus having a vacuum reactor, a gas delivery means for supplying process gases to the vacuum reactor, and a sample table for placing and supporting a sample in the vacuum reactor, wherein said apparatus subjects the sample to vacuum processing, said device comprising: a particle monitor for detecting particles floating inside the vacuum reactor; apparatus control means for generating process control data based on a recipe, and controlling the vacuum processing apparatus and generating apparatus condition data indicating a state of the vacuum processing apparatus based on the generated process control data; and data managing means for determining a component which is high in a particle occurrence probability based on particle data detected by the particle monitor, apparatus condition data generated by the apparatus control means, when the particle data was detected, and when the apparatus condition data was generated, thereby the component determined to be displayed.

4. The particle control device for the vacuum processing apparatus according to any one of claims 1 to 3, wherein the particle monitor detects the size of the particles and the number of the particles as particle data.

5. The particle control device for the vacuum processing apparatus according to any one of claims 1 to 3, wherein the vacuum processing apparatus comprises a database for storing apparatus condition data indicating a condition of the vacuum processing apparatus, data on components having high likelihood of particle occurrence in the indicated condition, and data on probabilities of the likelihood, and thereby enables a component having a high particle occurrence probability to be determined and displayed based on the database.

6. The particle control device for the vacuum processing apparatus according to any one of claims 1 to 3, wherein the data managing means comprises a database for storing apparatus condition data indicating a condition of the vacuum processing apparatus, data on components having high likelihood of particle occurrence in the indicated condition, and data on probabilities of the likelihood, and an input means for correcting the database based on actually-detected data of components in which the particles have occurred, thereby enabling a component having a high particle occurrence probability to be determined and displayed based on the database corrected.

7. The particle control device for the vacuum processing apparatus according to any one of claims 1 to 3, wherein the single data managing means is provided commonly for a plurality of vacuum processing apparatuses, and the data managing means comprises, for each of the vacuum processing apparatuses, a database for storing apparatus condition data indicating a condition of the vacuum processing apparatus, data on components having high likelihood of particle occurrence in the indicated condition, and data on probabilities of the likelihood.

8. A particle control method for a vacuum processing apparatus having a vacuum reactor, a gas delivery means for supplying process gases to the vacuum reactor, and a sample table for placing and supporting a sample in the vacuum reactor, wherein the sample is subjected to vacuum processing, said method comprising: preparing a particle monitor for detecting particles floating inside the vacuum reactor; and determining a component which is high in a particle occurrence probability based on particle data detected by the particle monitor and apparatus condition data indicating a condition of the vacuum processing apparatus, thereby enabling the component determined to be displayed.

9. A particle control method for a vacuum processing apparatus having a vacuum reactor, a gas delivery means for supplying process gases to the vacuum reactor, and a sample table for placing and supporting a sample in the vacuum reactor, wherein the sample is subjected to vacuum processing, said method comprising: preparing a particle monitor for detecting on a real-time basis particles floating inside the vacuum reactor; preparing an apparatus control means for controlling the vacuum processing apparatus; and determining a component which is high in a particle occurrence probability based on particle data detected by the particle monitor and apparatus condition data generated by the apparatus control means, thereby enabling the component determined to be displayed.

10. A particle control method for a vacuum processing apparatus having a vacuum reactor, a gas delivery means for supplying process gases to the vacuum reactor, and a sample table for placing and supporting a sample in the vacuum reactor, wherein the sample is subjected to vacuum processing, said method comprising: preparing a particle monitor for detecting particles floating inside the vacuum reactor; preparing an apparatus control means for controlling the vacuum processing apparatus; and determining a component which is high in a particle occurrence probability based on particle data detected by the particle monitor, apparatus condition data generated by the apparatus control means, when the particle data was detected, and when the apparatus condition data was generated, thereby enabling the component determined to be displayed.

11. The particle control method for the vacuum processing apparatus according to any one of claims 8 to 10, wherein the particle monitor detects the size of the particles and the number of the particles as particle data.

12. The particle control method for the vacuum processing apparatus according to any one of claims 8 to 10, wherein the vacuum processing apparatus comprises a database for storing apparatus condition data indicating a condition of the vacuum processing apparatus, data on components having high likelihood of particle occurrence in the indicated condition, and data on probabilities of the likelihood, thereby enabling a component having a high particle occurrence probability to be determined and displayed based on the database.

13. The particle control method for the vacuum processing apparatus according to any one of claims 8 to 10, wherein data managing means comprises a database for storing apparatus condition data indicating a condition of the vacuum processing apparatus, data on components having high likelihood of particle occurrence in the indicated condition, and data on probabilities of the likelihood, and corrects the database based on actually-detected data of components in which the particles have occurred.

14. The particle control method for the vacuum processing apparatus according to any one of claims 8 to 10, wherein data managing means is provided commonly for a plurality of vacuum processing apparatuses, and the data managing means comprises, for each of the vacuum processing apparatuses, a database for storing apparatus condition data indicating a condition of the vacuum processing apparatus, data on components having high likelihood of particle occurrence in the indicated condition, and data on probabilities of the likelihood.