This Application claims the priority of U.S. Provisional Application Serial No. 60/142,751, filed Jul. 8, 1999.
Number | Name | Date | Kind |
---|---|---|---|
4299715 | Whitfield et al. | Nov 1981 | A |
4487856 | Anderson et al. | Dec 1984 | A |
4685987 | Fick | Aug 1987 | A |
4722960 | Dunn et al. | Feb 1988 | A |
4729060 | Yamamoto et al. | Mar 1988 | A |
4879632 | Yamamoto et al. | Nov 1989 | A |
4915167 | Altoz | Apr 1990 | A |
5290624 | Bujard | Mar 1994 | A |
5302344 | Perlman | Apr 1994 | A |
5737187 | Ngtuyen et al. | Apr 1998 | A |
5770318 | Friedman | Jun 1998 | A |
5783862 | Deeney | Jul 1998 | A |
5901040 | Cromwell et al. | May 1999 | A |
5904796 | Freuler et al. | May 1999 | A |
5930115 | Tracy et al. | Jul 1999 | A |
6054198 | Bunyan et al. | Apr 2000 | A |
Number | Date | Country |
---|---|---|
1-248551 | Oct 1989 | JP |
Entry |
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R.C. Miller, “Structure for Achieving Thermal Enhancement in a Semiconductor Package,” IBM Technical Disclosure Bulletin, vol. 23, No. 6, Nov. 1980, p. 2308. |
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J.G. Ameen, et al. “Dealing with the Heat,” Circuits & Devices, Jul. 1998, pp. 38-40. |
R.J. Dombrowskas, et al., “Conduction Cooled Chip Module,” IBM Technical Disclosure Bulletin, vol. 14, No. 9, Feb. 1972, p. 2689. |
Number | Date | Country | |
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60/142751 | Jul 1999 | US |