Claims
- 1. A device for providing predetermined electrical field boundary conditions for achieving a required electric field potential shape arising principally from an electric field means, comprising:
- an insulator substrate;
- means for applying an electrical current; and
- a preselected thick film configuration disposed on said insulator substrate and coupled to said electric field means, said thick film configuration having a two dimensional pattern of selected substantially, uniform electrically resistive character in selected spatial pattern areas, enabling provision of said predetermined electric field boundary conditions responsive to said electrical current applied to said thick film configuration.
- 2. A thick film structure on a substrate for providing predetermined electric field boundary conditions for modifying an electric field potential generated by electric field means, comprising:
- an insulator substrate;
- means for applying an electrical current; and
- a preselected thick film configuration disposed on said insulator substrate in a two dimensional spatial pattern generates said predetermined electric field boundary conditions responsive to said electrical current applied to said thick film configuration and said spatial pattern having selected, substantially uniform electrically resistive character within selected defined areas thereof.
- 3. A thick film structure for providing predetermined electric field boundary conditions by modifying electric field potential gradients generated by electric field means, comprising:
- a substrate for receiving said thick film structure;
- means for applying an electrical current to said thick film structure; and
- a preselected thick film configuration disposed on said substrate to form said thick film structure, said thick film configuration comprised of a selected two dimensional spatial pattern having selected, substantially uniform electrically resistive character within selected defined areas of said two dimensional spatial pattern and said preselected thick film configuration generating said predetermined electric field boundary conditions responsive to said electrical current.
- 4. A thick film structure for modifying electric field potentials generated by electric field means to provide predetermined electric field boundary conditions around a geometrical shape, comprising:
- a substrate for receiving said thick film structure;
- means for applying an electrical current to said thick film structure; and
- a preselected thick film configuration disposed on said substrate to form said thick film structure, said thick film structure comprised of a selected two dimensional spatial pattern for achieving said predetermined electric field boundary conditions in the presence of said geometrical shape and having selected, substantially uniform electrically resistive character within selected defined areas of said two dimensional spatial pattern with said thick film configuration generating said predetermined electric field boundary condtions responsive to said electrical current.
- 5. The thick film structure as defined in claim 4 wherein said geometrical shape comprises at least one of a protrusion and a hole.
Parent Case Info
This is a divisional of co-pending application Ser. No. 870,437 filed on June 4, 1986 now U.S. Pat. No. 4,864,130.
CONTRACTUAL ORIGIN OF THE INVENTION
The U.S. Government has rights in this invention pursuant to Contract No. W-31-109-ENG-38 between the U.S. Department of Energy and Argonne National Laboratory.
US Referenced Citations (21)
Non-Patent Literature Citations (1)
Entry |
"Continuum Ionization Transition Probabilities of Atomic Oxygen", Samson et al., Physical Review A vol. 9, No. 6, Jun. 1974, pp. 2449-2452. |
Divisions (1)
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Number |
Date |
Country |
Parent |
870437 |
Jun 1986 |
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