Photomasks including multi-layered light-shielding and methods of manufacturing the same

Abstract

Example embodiments may provide photomasks including multi-layered light-shielding, and methods of manufacturing the same. An example embodiment may include a transparent substrate, and a multi-layered light-shielding layer having non-transparent and transparent layers alternately laminated on the transparent substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will become more apparent by describing them in detail with reference to the attached drawings, in which:

FIGS. 1A to 1E are cross-sectional views schematically showing photomasks, according to example embodiments;

FIG. 2 is a graph showing aerial images of the photomasks, according to example embodiments;

FIG. 3 is a graph showing aerial images of the photomasks, according to example embodiments;

FIGS. 4A to 4G are cross-sectional views schematically illustrating a method of manufacturing a photomask, according to example embodiments;

FIGS. 5A and 5B are cross-sectional views schematically showing blank photomasks, according to example embodiments;

FIGS. 6A to 6D are cross-sectional views schematically showing photomasks, according to example embodiments; and

FIGS. 7A and 7B are cross-sectional views schematically showing blank photomasks, according to example embodiments.

Claims

1. A photomask comprising: a transparent substrate; anda multi-layered light-shielding layer having non-transparent layers and transparent layers alternately laminated on the transparent substrate.

2. The photomask of claim 1, wherein the multi-layered light-shielding layer is patterned into multi-layered light-shielding patterns.

3. The photomask of claim 2, wherein: the non-transparent layers are silicon layers; andthe transparent layers are silicon oxide layers.

4. The photomask of claim 2, wherein the non-transparent layer is formed of an inorganic material containing silicon, or a metal selected from the group consisting of chromium, molybdenum, aluminum, titanium, tantalum, and ruthenium.

5. The photomask of claim 2, wherein the transparent layer is formed of a silicon oxide.

6. The photomask of claim 2, further comprising a capping layer on the multi-layered light-shielding patterns.

7. The photomask of claim 6, wherein the capping layer is formed of a metal selected from the group consisting of chromium, molybdenum, aluminum, titanium, and ruthenium, or a non-transparent inorganic material.

8. The photomask of claim 2, wherein the multi-layered light-shielding patterns are formed by randomly laminating at least three layers of two or more different kinds of non-transparent layers and a transparent layer.

9. The photomask of claim 2, wherein the non-transparent layers and transparent layers are laminated in pairs by an integer multiple N, where N is greater than or equal to one.

10. The photomask of claim 9, wherein: the non-transparent layers are silicon layers; andthe transparent layers are silicon oxide layers.

11. The photomask of claim 9, further comprising a chromium layer on the multi-layered light-shielding patterns.

12. The photomask of claim 1, wherein the transparent substrate is formed of one of glass and quartz.

13. The photomask of claim 1, further comprising a photosensitive film on the light-shielding layer.

14. The photomask of claim 13, wherein the light-shielding layer has the transparent and transparent layers laminated in pairs by an integer multiple N, where N is greater than or equal to one.

15. The photomask of claim 13, wherein the non-transparent layer is formed of an inorganic material containing silicon, or a metal selected from a group of chromium, molybdenum, aluminum, titanium, tantalum, and ruthenium.

16. The photomask of claim 13, wherein the transparent layer is formed of silicon oxide.

17. The photomask of claim 13, wherein the light-shielding layer is formed by randomly laminating at least three layers of non-transparent and transparent layers.

18. The photomask of claim 13, further comprising a capping layer between the light-shielding film and the photosensitive film.

19. The blank photomask of claim 18, wherein the capping layer is formed of a metal selected from the group consisting of chromium, molybdenum, aluminum, titanium, tantalum and ruthenium, or a non-transparent inorganic material.

20. The photomask of claim 13, wherein: the non-transparent layers are silicon layers; andthe transparent layers are silicon oxide layers.

21. The photomask of claim 20, wherein a chromium layer is formed between the light-shielding layer and the photosensitive film.

22. A method of manufacturing a photomask, the method comprising: laminating non-transparent layers and transparent layers alternately on a transparent substrate to form a light-shielding layer;forming a photosensitive film on the light-shielding layer;patterning the photosensitive film so as to form photosensitive film patterns;patterning the light-shielding layer using the photosensitive film patterns as an etching mask so as to form light-shielding patterns; andremoving the photosensitive film patterns.

23. The method of claim 22, wherein the light-shielding layer has the non-transparent layers and transparent layers laminated in pairs by an integer multiple N, where N is greater than or equal to one.

24. The method of claim 22, wherein the non-transparent layers are formed of an inorganic material containing silicon, or a metal selected from the group consisting of chromium, molybdenum, aluminum, titanium, tantalum, and ruthenium.

25. The method of claim 22, wherein the transparent layers are formed of silicon oxide.

26. The method of claim 22, further comprising forming a capping layer on the light-shielding layer.

27. The method of claim 26, wherein the capping layer is formed of a metal selected from the group consisting of chromium, molybdenum, aluminum, titanium, tantalum, and ruthenium, or a non-transparent inorganic material.

28. The method of claim 22, wherein: patterning of the non-transparent layer is performed using gas containing a chlorine radical (Cl—) or a fluorine radical (F—); andpatterning of the transparent layer is performed using gas containing a fluorine radical (F—), and carbon (C) or sulfur (S).