Photosensitive resin composition and manufacturing method of semiconductor device using the same

Abstract

A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor device using the composition.

Description

Claims

1. A positive photosensitive resin composition, which comprises: a polybenzoxazole precursor;a quinonediazide photosensitizer; anda carbonate solvent.

2. The positive photosensitive resin composition according to claim 1, which further comprises at least one of alkyl lactate and propylene glycol monoalkyl ether.

3. The positive photosensitive resin composition according to claim 1, wherein the polybenzoxazole precursor has a structure represented by formula (A1-1):

4. The positive photosensitive resin composition according to claim 1, wherein the polybenzoxazole precursor has a structure represented by formula (A2-1):

5. The positive photosensitive resin composition according to claim 4, wherein the structure represented by formula (A2-2) is a structure represented by formula (A2-3):

6. The positive photosensitive resin composition according to claim 1, wherein the polybenzoxazole precursor has a structure represented by formula (A3-1):

7. The positive photosensitive resin composition according to claim 6, wherein the polybenzoxazole precursor has a structure represented by formula (A3-2):

8. The positive photosensitive resin composition according to claim 1, which further comprises an adhesion accelerator.

9. A method of manufacturing a semiconductor device, the method comprising: coating a photosensitive resin composition according to claim 1 on a semiconductor element, so as to form a coated semiconductor element;prebaking the coated semiconductor element, so as to form a prebaked semiconductor element;exposing and developing the prebaked semiconductor element, so as to form a relief pattern; andcuring the relief pattern.