| Number | Date | Country | Kind |
|---|---|---|---|
| 9403477 | Oct 1994 | SE |
| Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
|---|---|---|---|---|---|
| PCT/SE95/01177 | WO | 00 | 4/10/1997 | 4/10/1997 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO96/12394 | 4/25/1996 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 4951383 | Amao et al. | Aug 1990 | |
| 5458357 | Wohlhuter | Oct 1995 | |
| 5534761 | Crippa | Jul 1996 |
| Number | Date | Country |
|---|---|---|
| 2 100 626 | Jan 1983 | GB |
| 2 101 013 | Jan 1983 | GB |
| Entry |
|---|
| IBM Technical Disclosure Bulletin, vol. 28, No. 11, Apr. 1986, pp. 4764-4765, “Chip Transfer Head With Programmable Probe Centerlines”. |
| IBM Technical Disclosure Bulletin, vol. 17, No. 7, Dec. 1974, pp. 1876-1877, Call et al “Electronic Component Assembly Apparatus”. |
| IBM Technical Disclosure Bulletin, vol. 22, No. 7, Dec. 1979, pp. 2757-2761, Hoebener: “Multiple Size Chip Pickup, Orientation and Placement Station”. |