Number | Date | Country | Kind |
---|---|---|---|
9403477 | Oct 1994 | SE |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/SE95/01177 | WO | 00 | 4/10/1997 | 4/10/1997 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO96/12394 | 4/25/1996 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4951383 | Amao et al. | Aug 1990 | |
5458357 | Wohlhuter | Oct 1995 | |
5534761 | Crippa | Jul 1996 |
Number | Date | Country |
---|---|---|
2 100 626 | Jan 1983 | GB |
2 101 013 | Jan 1983 | GB |
Entry |
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IBM Technical Disclosure Bulletin, vol. 28, No. 11, Apr. 1986, pp. 4764-4765, “Chip Transfer Head With Programmable Probe Centerlines”. |
IBM Technical Disclosure Bulletin, vol. 17, No. 7, Dec. 1974, pp. 1876-1877, Call et al “Electronic Component Assembly Apparatus”. |
IBM Technical Disclosure Bulletin, vol. 22, No. 7, Dec. 1979, pp. 2757-2761, Hoebener: “Multiple Size Chip Pickup, Orientation and Placement Station”. |