PLANARIZATION APPARATUS

Abstract

The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the substrate; and a contact body drive mechanism for pressing the contact body against the front surface of the coating film and moving the contact body along the front surface of the coating film. The contact body is pressed against the coating film before it is hardened, and moved along the front surface of the coating film, whereby the coating film can be planarized to a predetermined film thickness. According to the present invention, the coating film can be planarized without using the CMP apparatus.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the outline of a configuration of a substrate processing system;

FIG. 2 is a front view of the substrate processing system in FIG. 1;

FIG. 3 is a rear view of the substrate processing system in FIG. 1;

FIG. 4 is an explanatory view of a longitudinal section showing the outline of a configuration of a planarization apparatus;

FIG. 5 is an explanatory view of a transverse section showing the outline of the configuration of the planarization apparatus;

FIG. 6 is an explanatory view of a longitudinal section showing the outline of a configuration of a brush mechanism;

FIG. 7 is an explanatory view of a longitudinal section of a wafer showing the state in which a coating insulating film is formed on a base pattern;

FIG. 8 is an explanatory view showing an arrangement of the brush mechanism, a processing liquid supply nozzle, and a sub-nozzle during a planarization step;

FIG. 9A is an explanatory view of a longitudinal section showing the state in which a brush is pressed against the center of the wafer, FIG. 9B is an explanatory view of a longitudinal section showing the state in which the brush is horizontally moved, and FIG. 9C is an explanatory view of a longitudinal section showing the state in which the brush reaches a position outside the wafer;

FIG. 10 is an explanatory view showing an arrangement of a spray nozzle during a cleaning step;

FIG. 11 is an explanatory view of a longitudinal section showing the outline of the configuration of the brush mechanism where it includes a film thickness sensor;

FIG. 12 is an explanatory view of a longitudinal section showing the outline of the configuration of the brush mechanism where it includes a laser displacement gauge;

FIG. 13 is an explanatory view of a longitudinal section showing the outline of the configuration of the brush mechanism where a liquid supply port is provided at the center of the brush;

FIG. 14 is an explanatory view of a transverse section showing the outline of a configuration of a planarization apparatus including a megasonic nozzle; and

FIG. 15 is an explanatory view of a transverse section showing the outline of a configuration of a planarization apparatus including a cleaning body.

Claims

1. A planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, comprising: a contact body brought into contact with a front surface of the coating film on the substrate; anda contact body drive mechanism for pressing said contact body against the front surface of the coating film and moving said contact body along the front surface of the coating film to planarize the front surface of the coating film.

2. The planarization apparatus as set forth in claim 1, further comprising: a rotary holding member for holding and rotating the substrate,wherein said contact body is pressed against the substrate held and rotated by said rotary holding member.

3. The planarization apparatus as set forth in claim 1, further comprising: a film thickness sensor for detecting a film thickness of the coating film; anda control unit for controlling a pressure of said contact body against the substrate based on a detection result of the film thickness by said film thickness sensor to planarize the coating film to a predetermined film thickness.

4. The planarization apparatus as set forth in claim 3, wherein said contact body drive mechanism has a support member for supporting and moving said contact body, andwherein said film thickness sensor is attached to said support member.

5. The planarization apparatus as set forth in claim 1, further comprising: a distortion detection sensor for detecting distortion of the substrate; anda control unit for controlling a height of said contact body with respect to the substrate based on a detection result of the distortion by said distortion sensor to planarize the coating film to a predetermined film thickness.

6. The planarization apparatus as set forth in claim 5, wherein said contact body drive mechanism has a support member for supporting and moving said contact body, andwherein said distortion detection sensor is attached to said support member.

7. The planarization apparatus as set forth in claim 1, further comprising: a processing liquid supply unit for supplying a processing liquid to be supplied to the substrate when said contact body planarizes the coating film.

8. The planarization apparatus as set forth in claim 7, wherein the processing liquid is a solvent for the coating film.

9. The planarization apparatus as set forth in claim 7, wherein said processing liquid supply unit is provided in said contact body.

10. The planarization apparatus as set forth in claim 7, wherein said processing liquid supply unit has a nozzle for supplying the processing liquid to a central portion of the substrate, and a nozzle for supplying the processing liquid between the central portion and an outer edge portion of the substrate.

11. The planarization apparatus as set forth in claim 1, further comprising: a cleaning solution supply unit for supplying a cleaning solution to the substrate after the coating film is planarized by said contact body.

12. The planarization apparatus as set forth in claim 11, wherein the cleaning solution is a solvent for the coating solution.

13. The planarization apparatus as set forth in claim 11, wherein said cleaning solution supply unit has at least any of a nozzle for spraying the cleaning solution, a nozzle for spraying the cleaning solution to which an ultrasonic vibration is applied, and a cleaning body for supplying the cleaning solution to a contact portion with said cleaning body in contact with the substrate.

14. The planarization apparatus as set forth in claim 1, wherein said contact body is rotationally driven.

15. The planarization apparatus as set forth in claim 1, wherein said contact body is in a sponge form.