Number | Date | Country | Kind |
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63-123899 | May 1988 | JPX | |
63-287570 | Nov 1988 | JPX | |
63-292517 | Nov 1988 | JPX | |
1-84544 | Apr 1989 | JPX |
Number | Name | Date | Kind |
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4422896 | Class et al. | Dec 1983 | |
4431473 | Okano et al. | Feb 1984 | |
4464223 | Gorin | Aug 1984 | |
4492610 | Okano et al. | Jan 1985 | |
4521286 | Horwitz | Jun 1985 | |
4572759 | Benzing | Feb 1986 | |
4585516 | Corn et al. | Apr 1986 | |
4668338 | Maydan et al. | May 1987 |
Number | Date | Country |
---|---|---|
57-159026 | Oct 1982 | JPX |
62-501460 | Jun 1987 | JPX |
63-17530 | Jan 1988 | JPX |
Entry |
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7th Dry Process Symp., 1985 High Rate Etching of Silicon Dioxide, K. Kim et al. |
18th Conference SSDM, Tokyo 1986 Double-Source Excited Reactive Ion Etching and Its Application to Submicron Trench Etching, M. Sato et al., pp. 233-236. |