The present application relates to a plating method.
As a plating module for subjecting a substrate to a plating treatment, a cup type electroplating module is known. The cup type electroplating module includes a substrate holder that holds a substrate (e.g., a semiconductor wafer) with a surface to be plated being oriented downward. The substrate holder includes an electrical contact point for applying a voltage to the substrate, and a sealing member that seals the substrate so that a plating solution does not act on this electrical contact point. In the cup type electroplating module, the substrate is immersed into the plating solution with the surface to be plated being oriented downward, and the voltage is applied between the substrate and an anode, thereby precipitating a conductive film on a substrate surface.
A plating apparatus for treating a plurality of substrates may include a plurality of such cup type electroplating modules. In this example, each of the plurality of cup type electroplating modules may include a substrate holder and a plating tank that are integrated. The plating tank and the substrate holder are integrally configured, and accordingly size reduction of the apparatus can be achieved.
PTL 1: Japanese Patent Laid-Open No. 2001-316869
In a plating apparatus, a substrate may be subjected to a prewetting treatment prior to a plating treatment in a plating module. In the prewetting treatment, a surface to be plated of the substrate prior to the plating treatment is wetted with a treatment liquid such as pure water or de-aired water, to replace air inside a pattern formed on a substrate surface with the treatment liquid. Consequently, during plating, the treatment liquid inside the pattern is replaced with a plating solution, and hence the plating solution can be easily supplied to an interior of the pattern. However, in a case where the prewetting treatment is performed before the substrate is held with a substrate holder as in, for example, an apparatus in which the substrate holder and a plating tank are integrated, a disadvantage might be caused.
Specifically, the prewetting treatment is performed before the substrate is held by the substrate holder, and a prewetting liquid remains in an edge portion of the substrate with which an electrical contact point comes in contact. In this case, there is concern that electrical contact with the electrical contact point is obstructed when the substrate is held by the substrate holder. Also, the plating solution used in a previous plating treatment might be adhered to the substrate holder. In this case, there is concern that, if the prewetting liquid remains in the edge portion of the substrate, the plating solution enters a sealing region.
In view of above-described situations, one object of the present application is to prevent a prewetting liquid from remaining in an edge portion of a substrate.
According to an embodiment, a plating method for subjecting a substrate to a plating treatment is provided, the substrate including a part to be plated that is exposed to a plating solution and an edge portion that is an outer region of the part to be plated, the plating method including a first sealing step of bringing a first seal body into contact with the substrate to seal the edge portion of the substrate, a prewetting step of subjecting, to a prewetting treatment, the substrate sealed by the first sealing step, a first seal removing step of removing the first seal body from the prewetted substrate, a substrate holding step of holding the substrate with a substrate holder including a second seal body, and a plating step of applying the plating solution to the substrate held by the substrate holder.
Hereinafter, description will be made as to embodiments of the present invention with reference to the drawings. In the drawings illustrated below, the same or corresponding constituent component is denoted with the same reference sign, and redundant description will not be repeated.
<Overall Configuration of Plating Apparatus>
The loading/unloading module 100 is a module for loading a substrate such as a semiconductor wafer into the plating apparatus 1000 and unloading the substrate from the plating apparatus 1000, and a cassette for housing the substrate is mounted on the module. In the present embodiment, four loading/unloading modules 100 are arranged in a horizontal direction, but the number and arrangement of the loading/unloading modules 100 are arbitrary. The transfer robot 110 is a robot for transferring the substrate, and configured to deliver the substrate among the loading/unloading module 100, the aligner 120, and the transfer device 700. The transfer robot 110 and the transfer device 700 can deliver the substrate via an unshown temporary stand, when delivering the substrate between the transfer robot 110 and the transfer device 700. The aligner 120 is a module for aligning positions of an orientation flat, a notch and the like of the substrate in a predetermined direction. In the present embodiment, two aligners 120 are arranged in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary.
The prewetting module 200 is a module for adhering a treatment liquid (prewetting liquid) such as pure water or de-aired water to a surface to be treated of the substrate prior to the plating treatment. In the present embodiment, two prewetting modules 200 are arranged in an up-down direction, but the number and arrangement of the prewetting modules 200 are arbitrary. The presoaking module 300 is a module for etching an oxide film on the surface to be plated of the substrate prior to the plating treatment. In the present embodiment, two presoaking modules 300 are arranged in the up-down direction, but the number and arrangement of the presoaking modules 300 are arbitrary.
The plating module 400 is a module for subjecting the substrate to the plating treatment. In the present embodiment, there are two sets of twelve plating modules 400, each set including three plating modules arranged in the up-down direction and four plating modules arranged in the horizontal direction, and 24 plating modules 400 in total are provided. The number and arrangement of the plating modules 400 are arbitrary.
The washing module 500 is a module for washing the substrate subjected to the plating treatment. In the present embodiment, two washing modules 500 are arranged in the up-down direction, but the number and arrangement of the washing modules 500 are arbitrary. The spin rinse dryer module 600 is a module for rotating the substrate subjected to a washing treatment at a high speed to dry the substrate. In the present embodiment, two spin rinse dryer modules are arranged in the up-down direction, but the number and arrangement of the spin rinse dryer modules are arbitrary.
The transfer device 700 is a device for transferring the substrate among a plurality of modules in the plating apparatus 1000. The control module 800 is a module for controlling the plurality of modules of the plating apparatus 1000, and may include a general computer or a dedicated computer including, for example, an input/output interface between the computer and an operator.
An example of a series of plating treatments by the plating apparatus 1000 will be described. First, the substrate is loaded into the loading/unloading module 100. Subsequently, the transfer robot 110 removes the substrate from the loading/unloading module 100, and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch and the like in the predetermined direction. The transfer robot 110 delivers, to the transfer device 700, the substrate aligned in the direction by the aligner 120.
The transfer device 700 transfers, to the prewetting module 200, the substrate received from the transfer robot 110. The prewetting module 200 subjects the substrate to a prewetting treatment. The transfer device 700 transfers, to the presoaking module 300, the substrate subjected to the prewetting treatment. The presoaking module 300 subjects the substrate to a presoaking treatment. The transfer device 700 transfers, to the plating module 400, the substrate subjected to the presoaking treatment. The plating module 400 subjects the substrate to the plating treatment.
The transfer device 700 transfers, to the washing module 500, the substrate subjected to the plating treatment. The washing module 500 subjects the substrate to the washing treatment. The transfer device 700 transfers the substrate subjected to the washing treatment to the spin rinse dryer module 600. The spin rinse dryer module 600 subjects the substrate to a drying treatment. The transfer device 700 delivers the substrate subjected to the drying treatment to the transfer robot 110. The transfer robot 110 transfers the substrate received from the transfer device 700 to the loading/unloading module 100. Finally, the substrate is unloaded from the loading/unloading module 100.
<Configuration of Plating Module>
Next, a configuration of the plating module 400 will be described. The 24 plating modules 400 in the present embodiment have the same configuration, and hence one plating module 400 will only be described.
The plating module 400 includes a membrane 420 that separates an interior of the inner tank 412 in the up-down direction. The interior of the inner tank 412 is separated into a cathode region 422 and an anode region 424 by the membrane 420. Each of the cathode region 422 and the anode region 424 is filled with the plating solution. An anode 430 is disposed on a bottom surface of the inner tank 412 of the anode region 424. In the cathode region 422, a resistor 450 facing the membrane 420 is disposed. The resistor 450 is a member for uniformly performing the plating treatment in a surface to be plated Wf-a of a substrate Wf. Note that in the present embodiment, an example where the membrane 420 is disposed has been described, but the membrane 420 does not have to be disposed.
Also, the plating module 400 includes a substrate holder 440 for holding the substrate Wf in a state where the surface to be plated Wf-a is oriented downward. In a state where a part (part to be plated) Wf-1 in the surface to be plated Wf-a is exposed, an edge portion Wf-2 that is an outer region of the part is grasped by the substrate holder 440. The substrate holder 440 includes a seal body (second seal body) 441 that seals the edge portion Wf-2 so that the plating solution does not act on the edge portion Wf-2 of the substrate Wf. The substrate holder 440 also includes a power supply contact point that comes in contact with the edge portion Wf-2 of the substrate Wf to supply power from an unshown power source to the substrate Wf. The plating module 400 includes an elevating/lowering mechanism 442 for elevating and lowering the substrate holder 440. The elevating/lowering mechanism 442 can be achieved by a known mechanism such as a motor. The substrate Wf is immersed into the plating solution of the cathode region 422 by use of the elevating/lowering mechanism 442, the part to be plated Wf-1 of the substrate Wf is exposed to the plating solution. The plating module 400 is configured to subject the surface to be plated Wf-a (the part to be plated Wf-1) of the substrate Wf to the plating treatment by applying a voltage between the anode 430 and the substrate Wf in this state.
Note that it has been described above that in the plating module 400, the substrate Wf is subjected to the plating treatment in the state where the surface to be plated Wf-a is oriented downward, but the present invention is not limited to this example. As an example, the plating module 400 may perform the plating treatment in a state where the surface to be plated Wf-a is oriented upward or to a side.
<Configuration of Prewetting Module>
A configuration of the prewetting module 200 of the present embodiment will be described. Two prewetting modules 200 in the present embodiment have the same configuration, and hence one prewetting module 200 is only described.
The prewetting substrate holder 240 includes, for example, a first holding member (supporter) 242 including a support surface 242a for supporting a back surface of the surface to be plated Wf-a of the substrate Wf, and a second holding member 244 configured to be detachably attached to the first holding member 242. As an example, the prewetting substrate holder 240 is configured to hold the substrate Wf by moving, to the first holding member 242, a pin 245 attached to the second holding member 244 by an unshown drive mechanism, and holding the substrate Wf between the first holding member 242 and a seal body 246. However, the present invention is not limited to this example, and the prewetting substrate holder 240 may be configured to hold the substrate with a vacuum chuck disposed in the first holding member 242.
The second holding member 244 comes in contact with the surface to be plated Wf-a of the substrate Wf, and forms a stepped portion to the surface to be plated Wf-a. As an example, the stepped portion formed by the second holding member 244 may be formed in a tapered shape with a diameter increasing as being away from the surface to be plated Wf-a of the substrate Wf, as shown in
Subsequently, the prewetting treatment of the substrate Wf by the prewetting module 200 will be described.
When the treatment liquid is adhered to the surface to be plated Wf-a of the substrate Wf in the prewetting treatment as described with reference to
<Plating Method>
<Modification>
The present invention can be described in aspects as follows.
[Aspect 1]
According to Aspect 1, a plating method for subjecting a substrate to a plating treatment is provided, the substrate including a part to be plated that is exposed to a plating solution and an edge portion that is an outer region of the part to be plated, the plating method including a first sealing step of bringing a first seal body into contact with the substrate to seal the edge portion of the substrate, a prewetting step of subjecting, to a prewetting treatment, the substrate sealed by the first sealing step, a first seal removing step of removing the first seal body from the prewetted substrate, a substrate holding step of holding the substrate with a substrate holder including a second seal body, and a plating step of applying the plating solution to the substrate held by the substrate holder.
According to Aspect 1, a prewetting liquid can be prevented from remaining in the edge portion of the substrate.
[Aspect 2]
According to Aspect 2, in Aspect 1, the first seal removing step includes a step of rotating the substrate before removing the first seal body from the substrate.
According to Aspect 2, the prewetting liquid remaining around the first seal body can be reduced, and the prewetting liquid can be more prevented from remaining in the edge portion of the substrate.
[Aspect 3]
According to Aspect 3, in Aspect 1 or 2, in the prewetting step, the substrate is subjected to the prewetting treatment in a state where a surface to be plated is oriented downward.
According to Aspect 3, the prewetting liquid can be more prevented from remaining in the edge portion of the substrate.
[Aspect 4]
According to Aspect 4, in Aspect 1 or 2, in the prewetting step, the substrate is subjected to the prewetting treatment in a state where a surface to be plated is oriented upward.
According to Aspect 4, the prewetting liquid can be uniformly adhered to the surface to be plated of the substrate by use of a small amount of prewetting liquid.
[Aspect 5]
According to Aspect 5, in Aspect 4, the prewetting step includes a step of accumulating a prewetting liquid in a tank-shaped region defined by the first seal body and a surface to be plated of the substrate.
According to Aspect 5, the prewetting liquid can be uniformly adhered to the surface to be plated of the substrate by use of a small amount of prewetting liquid.
[Aspect 6]
According to Aspect 6, in Aspects 1 to 5, the method further includes a step of transferring, by a transfer module, the substrate from a place where the substrate is subjected to the prewetting step in a state where a surface to be plated of the substrate is oriented downward.
According to Aspect 6, the prewetting liquid or another foreign substance can be prevented from being adhered to the edge portion of the substrate during the transfer.
[Aspect 7]
According to Aspect 7, in Aspects 1 to 6, the prewetting step is performed by spraying a prewetting liquid to a surface to be plated of the substrate.
[Aspect 8]
According to Aspect 8, in Aspects 1 to 7, the prewetting step is performed in response to rotation of the substrate.
According to Aspect 8, the prewetting liquid can be more uniformly adhered to the substrate.
[Aspect 9]
According to Aspect 9, in Aspects 1 to 8, in the first sealing step, the substrate is held by a prewetting substrate holder including the first seal body, and the prewetting substrate holder includes a supporter that supports a back surface of a surface to be plated of the substrate, and holds the substrate by holding the substrate between the supporter and the first seal body and/or with a vacuum chuck disposed in the supporter.
[Aspect 10]
According to Aspect 10, in Aspect 9, the prewetting substrate holder includes a resistance measuring mechanism that measures an electric resistance of a conductive layer of the edge portion of the substrate, and the plating method further includes a step of measuring the electric resistance of the substrate held by the prewetting substrate holder.
According to Aspect 10, a defect of the substrate can be detected prior to the plating step.
[Aspect 11]
According to Aspect 11, in Aspects 1 to 10, in a surface to be plated of the substrate, a stepped portion including the first seal body is formed, and the stepped portion is formed in a tapered shape with a diameter increasing as being away from the surface to be plated of the substrate.
According to Aspect 11, the prewetting liquid can be more prevented from remaining in the edge portion of the substrate.
[Aspect 12]
According to Aspect 12, in Aspects 1 to 11, in the plating step, the substrate holder and the substrate are immersed into the plating solution in a state where a surface to be plated is oriented downward.
According to Aspect 12, the prewetting liquid can be more prevented from remaining in the edge portion of the substrate.
The embodiments of the present invention have been described above, but the above embodiments of the present invention are described to facilitate understanding of the present invention, and are not intended to limit the present invention. Needless to say, the present invention may be changed or modified without departing from the spirit, and the present invention includes equivalents to the invention. Also, in a range in which at least some of the above-described problems can be solved or a range in which at least some of effects are exhibited, any arbitrary combination of the embodiments and the modification is possible, and arbitrary combination or omission of respective constituent components described in claims and description is possible.
The present application claims the benefit of priority based on Japanese Patent Application No. 2020-171311 filed on Oct. 9, 2020. All disclosed contents including the description, claims, drawings and abstract of Japanese Patent Application No. 2020-171311 are entirely incorporated herein by reference. All disclosure including the description, claims, drawings and abstract of Japanese Patent Laid-Open No. 2001-316869 (Patent Literature 1) is entirely incorporated herein by reference.
200 prewetting module
240 and 240A prewetting substrate holder
242 first holding member
244 second holding member
245 pin
246 seal body (first seal body)
247 electrical contact point
250 drive mechanism
260A to 260C and 260F jetting mechanism
260D, 260E and 260G treatment liquid supply mechanism
400 plating module
410 plating tank
440 substrate holder
441 seal body (second seal body)
800 control module
1000 plating apparatus
Wf substrate
Wf-a surface to be plated
Wf-1 part to be plated
Wf-2 edge portion
Number | Date | Country | Kind |
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JP2020-171311 | Oct 2020 | JP | national |
Number | Name | Date | Kind |
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20150096883 | Mayer | Apr 2015 | A1 |
Number | Date | Country |
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2001-316869 | Nov 2001 | JP |
2004269923 | Sep 2004 | JP |
Entry |
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Kuriyama et al., Machine Translation, JP 2004-269923 A (Year: 2004). |
Number | Date | Country | |
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20220112620 A1 | Apr 2022 | US |