Patent Application
20150029638
The present invention relates to a process for the preparation of an organic electronic device, such as a capacitor or transistor on a substrate, to the device obtainable by that process, to certain novel polyimides, and their use as dielectrics, especially as dielectric layer in printed electronic devices such as capacitors and organic field-effect transistors (OFETs).
Transistors, and in particular OFETs, are used e.g. as components for printed electronic devices such as organic light emitting display, e-paper, liquid crystal display and radiofrequency identification tags.
An organic field effect transistor (OFET) comprises a semiconducting layer comprising an organic semiconducting material, a dielectric layer comprising a dielectric material, a gate electrode and source/drain electrodes.
Especially desirable are OFETs wherein the dielectric material can be applied by solution processing techniques. Solution processing techniques are convenient from the point of processability, and can also be applied to plastic substrates. Thus, organic dielectric materials, which are compatible with solution processing techniques, allow the production of low cost organic field effect transistors on flexible substrates.
Kato, Y.; Iba, S.; Teramoto, R.; Sekitani, T.; Someya, T., Appl. Phys. Lett. 2004, 84(19), 3789 to 3791 describes a Bottom-Gate Bottom-Contact organic field-effect transistors comprising a pentacene top layer (semiconducting layer), a polyimide layer (dielectric gate layer) and a polyethylenenapthalate (PEN) base film (substrate). The transistor is prepared using a process which comprises the following steps:
(i) evaporating gate electrodes consisting of gold and chromium layers through a shadow mask on 125 μm thick PEN film in a vacuum system, (ii) spin-coating a polyimide precursor on the PEN base film and evaporating the solvent at 90° C., (iii) curing the polyimide precursor at 180° C. to obtain a polyimide gate dielectric layer, (iv) subliming pentacene through a shadow mask at ambient temperature on the polyimide gate dielectric layer, and (v) evaporating source-drain electrodes consisting of gold layers through a shadow mask. A transistor with a 990 nm polyimide gate dielectric layer shows a channel length (L) of 100 μm, a width (W) of 1.9 mm, an on/off ratio of 106 (if the source drain current (IDS) at gate voltage (VGS) is 35 V) and a mobility of 0.3 cm2/Vs. The leakage current density of capacitors comprising a 540 nm thick polyimide layer between two gold electrodes is less than 0.1 nA/cm2 at 40 V and less than 1.1 nA/cm2 at 100 V.
Lee, J. H.; Kim, J. Y.; Yi, M. H.; Ka, J. W.; Hwang, T. S.; Ahn, T. Mol. Cryst. Liq. Cryst. 2005, 519, 192-198 describes a Bottom-Gate Bottom-Contact organic field-effect transistor comprising a pentacene top layer (semiconducting layer), a cross-linked polyimide layer (dielectric gate layer) and glass (substrate). The transistor is prepared using a process which comprises the following steps: (i) patterning indium tin oxide of indium tin oxide coated glass as 2 mm wide stripes to obtain glass with indium tin oxide gate electrodes, (ii) spin-coating a solution of hydroxyl group containing polyimide (prepared by reacting 2,2-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride and 3,3′-dihydroxy-4,4′-diaminobiphenyl), trimethylolpropane triglycidyl ether, benzoyl peroxide and triphenylsulfonium triflate as photoacid in γ-butyrolactone on the glass with the indium tin oxide gate electrodes and evaporating the solvent at 100° C., (iii) crosslinking the hydroxyl group containing polyimide and trimethylolpropane triglycidyl ether by exposure to UV light followed by hardening at 160° C. for 30 minutes to obtain a 300 nm thick polyimide gate dielectric layer, (iv) depositing on top of the gate dielectric layer a 60 nm thick pentacene layer through a shadow mask using thermal evaporation at a pressure of 1×10−6 torr, and (v) evaporating source-drain gold electrodes on top of the pentacene layer. The transistor so produced shows a channel length (L) of 50 μm, a width (W) of 1.0 mm, an on/off ratio of 1.55×105 and a mobility of 0.203 cm2/Vs. The leakage current density of capacitors consisting of a 300 nm thick cross-linked polyimide layer between two gold electrodes is less than 2.33×10−10 A/cm2 at 3.3 MV/cm indicating that the dielectric layer is resistant to moisture and other environmental conditions.
Pyo, S.; Lee, M.; Jeon, J.; Lee, J. H.; Yi, M. H.; Kim, J. S. Adv. Funct. Mater. 2005, 15(4), 619 to 626 describes a Bottom-gate Bottom-contact organic field-effect transistor comprising a pentacene top layer (semiconducting layer), a patterned polyimide layer (prepared from 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA) and 7-(3,5-diaminobenzoyloxy)coumarine) (dielectric gate layer) and glass (substrate). The transistor is prepared using a process which comprises the following steps: (i) depositing gold electrodes through a shadow mask by thermal evaporation on the glass substrate (ii) spin-coating the precursor of the polyimide (namely the poly(amic acid)) on top of the gate electrode and baking at 90° C. for 2 minutes, (iii) crosslinking parts of the poly(amic acid) film by irradiating with UV light at 280 to 310 nm through a mask followed by post-exposure baking at 160° C. for 19 minutes, (iv) removing the not cross-linked parts of the poly(amic acid) film by dipping into aqueous tetramethylammonium hydroxide solution followed by rinsing with water, (v) thermally converting the patterned crosslinked poly(amic acid) film obtained in step (iv) to a patterned polyimide layer (300 nm thick) by baking at 250° C. for 1 minute, (vi) depositing a 60 nm thick pentacene layer on top of the polyimide film through a shadow mask by thermal evaporation, and (vii) thermally evaporating gold source and drain electrodes on top of the pentacene layer through a shadow mask. The leakage current density of capacitors consisting of a polyimide layer between two gold electrodes is less than 1.4×10−7 A/cm2. The breakdown voltage of this gate insulator was more than 2 MV cm−1. The capacitance of the film was found to be 129 pF/mm2. The patterned polyamide layer allows the creation of access to the gate electrode.
KR-A-2008-0074417 describes a low temperature soluble mixture consisting of two polyimides, which mixture is suitable as insulating layer in transistors. In both polyimides the group R (which is the group carrying the four carboxylic acid functionalities forming the two imide groups) is at least one tetravalent group including a specific aliphatic cyclic tetravalent group. In the second polyimide the group R2 (which is the group carrying the two amine functionalities forming the two imide groups) is at least a divalent group including a divalent aromatic group having a pendant alkyl group. Exemplified is, for example, a mixture consisting of polyimide SPI-3 (prepared from 1-(3,5-diaminophenyl)-3-octadecyl-succinic imide and 5-(2,5-dioxotetrahydrfuryl)3-methylcyclohexane-1,2-dicarboxylic dianhydride) and polyimide SPI-1 (prepared from 4,4′-diamino diphenylmethane (or methylenedianiline) and 5-(2,5-dioxotetrahydrfuryl)3-methylcaclohexane-1,2-dicarboxylic dianhydride) in γ-butyrolactone and cyclohexanone. A transistor is prepared using a process which comprises the following steps: (i) deposing a gate electrode through a mask, (ii) spin-coating a polyimide mixture and drying at 90° C., (ii) baking at 150° C., (iii) depositing pentacene by vacuum evaporation, (iv) depositing source-drain electrodes. As substrate glass and polyethersulfone is used.
Sim, K.; Choi, Y.; Kim, H.; Cho, S.; Yoon, S. C.; Pyo, S. Organic Electronics 2009, 10, 506-510 describes a bottom gate organic field-effect transistor comprising a 6,13-bis(triisopropyl-silylethynyl)pentacene (TIPS pentacene) top layer (semiconducting layer), a low-temperature processable polyimide layer (prepared from 3,3′,4,4′-benzophenone-tetracarboxylic dianhydride (BTDA) and 4,4′-diamino-3,3′-dimethyl-diphenylmethane (DADM)) (dielectric gate layer) and glass (substrate). A transistor is prepared using a process which comprises the following steps: (i) photo-lithographically patterning indium tin oxide on a glass substrate, (ii) spin-coating a solution of BPDA-DADM polyimide in N-methylpyrrolidone (NMP) on top of the gate electrode, (iii) soft baking at 90° C. for 1 minute, (iv) further baking at 175° C. for 1 hour in vacuum, and (v) drop coating a solution of TIPS pentacene and a polymeric binder in o-dichloromethane on the BPDA-DADM polyimide layer, (vi) baking at 90° C. for 1 hour in vacuum, (vii) thermally evaporating 60 nm thick source and drain gold electrodes through a shadow mask. The transistor so produced shows a channel length (L) of 50 μm, a width (W) of 3 mm, an on/off ratio of 1.46×106 and a mobility of 0.15 cm2/Vs.
Chou, W.-Y.; Kuo, C.-W.; Chang, C.-W.; Yeh, B.-L.; Chang, M.-H. J. Mater. Chem. 2010, 20, 5474 to 5480 describes a bottom gate organic field-effect transistor comprising a pentacene top layer (semiconducting layer), a photosensitive polyimide (prepared from 4,4′-oxydianiline (ODA), 4,4′-(1,3-phenylenedioxy)dianiline (TPE-Q), 4-(10,13-dimethyl-17-(6-methylheptan-2-yl)-2,3,4,7,8,9,10,11,12,13,14,15,16,17-tetradecahydro-1H-cyclopenta[a]phenanthren-3-yloxy)benzene-1,3-diamine (CHDA), pyromellitic dianhydride (PDMA), and cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA)) layer (dielectric gate layer), a silicium dioxide layer (dielectric gate layer) and heavily doped n-type silicium (111) wafer (gate and substrate). The photosensitive polyimide used only absorbs at a wavelength of 250 to 300 nm. The transistor is prepared using a process which comprises the following steps: (i) plasma-enhanced chemical vapour depositing a 300 nm thick silicium dioxide layer, (ii) spin-coating a 80 nm thick photosensitive polyimide layer on the silicium dioxide layer, (iii) baking (removing the solvent of) the photosensitive polyimide layer at 220° C. for 60 minutes, (iv) irradiating with UV light, (v) depositing a 70 nm thick pentacene layer onto the photosensitive polyimide layer at room temperature by vacuum sublimation, and (vi) depositing silver source-drain electrodes on the pentacene film through a shadow mask. The transistor so produced shows a channel length (L) of 120 μm, a width (W) of 1920 μm, an on/off ratio of 103 to 105 (depending on the UV dose applied) and an average mobility of 6.0 cm2/Vs. The surface energy, surface carriers and capacitance of the polyimide gate dielectric can be tuned by varying irradiation doses of UV light on the photosensitive polyimide surface.
KR-A-2010-0049999 describes two soluble photocurable polyimides suitable for use as insulator in transistors. In both polyimides the group R (which is the group carrying the four carboxylic acid functionalities forming the two imide groups) is at least one tetravalent group including a specific aliphatic cyclic tetravalent group. In both polyimide the group R1 (which is the group carrying the two amine functionalities forming the two imide groups) carries an optionally substituted photocurable cinnamoyl group. For example, the polyimide KPSPI-1 is prepared from 5-(2,5-dioxotetrahydrfuryl)-3-methylcyclohexane-1,2-dicarboxylic dianhydride and 3,3-dihydroxybenzidine, followed by reaction with cinnamoyl chloride. The polyimide layer can be prepared by (i) spin-coating a 9 weight % solution of the photocurable polyimide (KPSPI-1) in γ-butyrolactone and baking at 90° C. for 10 minutes, (iii) curing by UV irradiation (300 to 400 nm), (iii) hard-baking at 160° C. for 30 minutes. The leakage current density of capacitors consisting of the photocured polyimide layer (KPSPI-1) between two gold electrodes is 7.84×10−11 A/cm2. The breakdown voltage of KPSPI-1 is 3 MV cm−1.
The disadvantage of above processes for the preparation of organic field effect transistors having a dielectric layer comprising a polyimide is that the formation of the dielectric layer requires temperatures of at least 150° C. These high temperatures are not compliable with all kinds of plastic substrates, for example these temperatures are not compliable with polycarbonate substrates, as polycarbonate has a glass temperature (Tg) of 150° C. and softens gradually above this temperature. However, polycarbonate is an ideal substrate for preparing thin and flexible organic field effect transistors.
It is the object of the present invention to provide a dielectric material which allows easy solution processing while resulting in good dielectric properties, adherence and optionally crosslinking under gentle thermal treatment (preferably below 150°, more preferably below 120° C., e.g. using temperatures from the range 20-140° C., or)30-120° and/or irradiation.
The object of the invention is achieved using a polyimide as a dielectric material, which polyimide (in the following referred to as “polyimide A”) is obtainable by reaction of a primary aromatic diamine with an aromatic dianhydride, where at least a part of the monomer moieties, e.g. 10 mol-% of the diamine and/or the dianhydride, especially of the diamine, is substituted on its aromatic ring by at least one alkyl moiety selected from propyl and butyl. The layer of polyimide A is subsequently cured to obtain the dielectric layer comprising polyimide B as described below in more detail.
The invention thus pertains to an electronic device, generally an organic electronic device, as it may be prepared in a printing process on a substrate. The substrate may be glass, but is typically a plastic film or sheet. Typical devices are capacitors, transistors such as an electronic field effect transistor (OFET), or devices comprising said capacitor and/or transistor. The device of the invention contains at least one dielectric material, usually in the form of a dielectric layer, which comprises a polyimide based on primary aromatic diamine and aromatic dianhydride monomer moieties, wherein one or more of said moieties contain at least one substituent on the aromatic ring selected from propyl and butyl, especially from isopropyl, isobutyl, tert.butyl; most preferred is an aromatic polyimide dielectric containing one or more substituents isopropyl on the aromatic ring. The device of the invention generally contains at least one further layer of a functional material, mainly selected from conductors and semiconductors, which usually stands in direct contact with the present polyimide dielectric material or layer; examples are OFETs containing the layer of dielectric material according to the invention in direct contact with the electrode and/or the semiconductor.
Preferred polyimides are those wherein a fraction of the monomer moieties, e.g. 10 mol-% of the diamine and/or the dianhydride, and especially of the diamine, carries at least one of said propyl and/or butyl substituents on its aromatic ring.
The transistor, especially OFET, of the invention is characterized in that it comprises at least one layer of semiconducting material and at least one dielectric layer, wherein the dielectric layer comprises a polyimide based on primary aromatic diamine and aromatic dianhydride monomer moieties, characterized in that at least a part of the monomer moieties, e.g. 10 mol-% of the diamine and/or the dianhydride and especially of the diamine, is substituted on its aromatic ring by at least one alkyl moiety selected from propyl and butyl, especially from isopropyl, isobutyl, tert.butyl, most especially isopropyl.
Present invention further provides a process of the for the preparation of an electronic device, such as a capacitor or transistor on a substrate, which process comprises the steps of
Preferably, the process does not comprise a step of heat treatment at a temperature of >=150° C., More preferably, the process does not comprise a step of heat treatment at a temperature of >=140° C. Most preferably, the process does not comprise a step of heat treatment at a temperature of >=120° C. Accordingly, the heat treatment in step (ii), if present, usually requires heating the layer to a temperature from the range 30 to 150° C., preferably 40 to 140° C., especially 50 to 120° C.
The curing by irradiation in step (ii) usually is accomplished by irradiation with light from the range of visible (especially blue) to ultraviolet, typically e.g. from the range 440 nm to 220 nm, generally using radiation sources known in the art. Of special industrial interest is a process wherein the layer comprising photocurable polyimide A is irradiated with light of a wavelength from the range 320 to 440 nm in order to form the layer comprising polyimide B. More preferably it is irradiated with light of a wavelength of 365 nm, 405 nm and/or 435 nm. Most preferably it is irradiated with light of a wavelength of 365 nm.
Preferably, the photocurable polyimide A is a photocurable polyimide, which carries (i) at at least one photosensitive group, and (ii) at least one crosslinkable group.
The photosensitive group is a group that generates a radical by irradiation, preferably with light of a wavelength from the range 320 nm to 440 nm, more preferably with light of a wavelength of 365 nm, 405 nm and/or 435 nm, most preferably with light of a wavelength of 365 nm. Typically, the photosensitive group may be a carbonyl group.
The crosslinkable group is a group which is capable of generating a radical by reaction with another radical, such as the radical generated from the photosensitive group by irradiation as noted above. Typically, the crosslinkable group may be an alkyl group, such as methyl, ethyl, propyl, butyl, or a group containing secondary or tertiary CH like the present isopropyl or iso/tert.butyl moiety.
Preferably, the present polyimide A is a polyimide which is obtainable by reacting a mixture of reactants, which mixture of reactants comprise at least one dianhydride A and/or dianhydride B, and at least one diamine A, wherein
The dianhydride A is an organic aromatic compound carrying two —C(O)—O—C(O)— functionalities.
The diamine A is an organic aromatic compound carrying two NH2 functionalities.
Polyimide A is formed by condensation reaction and elimination of one molecule H2O for each linkage formed between the dianhydride moieties with the diamine moieties, thus forming a polyimide of the general structure (I):
wherein
n ranges from about 10 to 100, especially from 10 to 50.
For example, polyimide A may be obtained according to the scheme
where
L1 independently is O, S, C1-10-alkylene, phenylene or C(O), especially C1-C3alkylene such as CH2;
and
each A independently is selected from hydrogen and C1-C4alkyl, provided that at least 2.5% of the residues A, especially 5 to 95% of the residues A in the polyimide A are propyl or butyl, especially isopropyl or isobutyl or tert.butyl; most especially isopropyl.
End groups of polyimide A may be partly unreacted difunctional monomers (i.e. anhydride or derivatives thereof, or amino), or preferably are residues of primary amines (such as C1-C18 alkylamine, aniline etc.) added during the synthesis for endcapping, see below.
To obtain polyimide A, the mixture of reactants preferably is reacted in a suitable solvent, such as N-methylpyrrolidone, tetrahydrofuran or 1,4-dioxane, at a suitable temperature, for example at a temperature in the range of 10 to 150° C., or at a temperature in the range from 10 to 50° C., or at a temperature in the range from 18 to 30° C.
In a preferred embodiment, the photocurable polyimide A is a polyimide which is obtainable by reacting a mixture of reactants, which mixture of reactants comprise at least one dianhydrides A and at least one diamines A, wherein the dianhydride A is preferably selected from dianhydrides carrying at least one photosensitive group, and the diamines A is a diamine carrying at least one crosslinkable group, wherein the photosensitive group and the crosslinkable group are as defined above.
Preferably, the dianhydride A carrying at least one photosensitive group is a benzophenone derivative carrying two —C(O)—O—O(O)— functionalities. More preferably, the dianhydrides A carrying at least one photosensitive group is a benzophenone derivative carrying two —C(O)—O—O(O)— functionalities, wherein the two —C(O)—O—O(O)— functionalities are directly attached to the same or to different phenyl rings of the benzophenone basic structure.
More preferably, the dianhydride A which is a dianhydride carrying at least one photosensitive group, is selected from the group consisting of
wherein
R1 is C1-10-alkyl, C1-10-haloalkyl, halogen or phenyl
g is 0, 1, 2 or 3, preferably 0,
X is a direct bond, CH2, O, S or C(O), preferably X is a direct bond, CH2 or O.
Even more preferably, the dianhydride A which is a dianhydride carrying at least one photosensitive group, is selected from the group consisting of
wherein X can be O, S and CH2.
Examples of the dianhydride of formula (2a) are the dianhydrides of formulae
The most preferred dianhydride A, which is a dianhydride carrying at least one photosensitive group, is the dianhydride of formula
Dianhydrides of formulae (1), (2), (3) and (4) can either be prepared by methods known in the art or are commercially available. For example, dianhydride (2a1) can be prepared as described in EP 0 181 837, example b, dianhydride (2a2) can be prepared as described in EP 0 181 837 A2, example a. Dianhydride (1a) is commercially available.
Preferably, the diamine A, which is a diamine carrying at least one crosslinkable group, is an organic compound carrying
(i) two amino functionalities,
and
(ii) at least one aromatic ring having attached at least one moiety selected from propyl and butyl, especially from isopropyl and isobutyl; most especially, the aromatic ring in diamine A is substituted by at least one isopropyl group.
Examples of aromatic rings are phenyl and naphthyl. Phenyl is preferred.
More preferably the diamine A, which is a diamine carrying at least one crosslinkable group, is selected from the group consisting of
(i) a diamine of formula
wherein
R2, R3 are the same or different and are H, C1-10-alkyl or C4-8-cycloalkyl,
n is 1, 2, 3 or 4
m is 0, 1, 2 or 3
provided n+m<=4,
p is 0, 1, 2, 3 or 4,
L1 is O, S, C1-10-alkylene, phenylene or C(O)
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S,
(ii) a diamine of formula
wherein
R4 is H, C1-10-alkyl or C4-8-cycloalkyl
R5 is O—C1-10-alkyl, O—C1-10-alkylene-O—C1-10-alkyl, O—C1-10-alkylene-N(C1-10-alkyl)2, N(C1-10-alkyl)2, O-phenyl, W, O—C1-10-alkylene-W, O-phenylene-W, N(R6)(C1-10-alkylene-W) or N(R6)(phenylene-W),
wherein
R6 is H, C1-10-alkyl, C4-10-cycloalkyl or C1-10-alkylene-W,
W is O—C2-10-alkenyl, N(R7)(C2-10-alkenyl), O—C(O)—CR8═CH2, N(R7)(C(O)—CR8═CH2), or
wherein
R7 is H, C1-10-alkyl, C4-8-cycloalkyl, C2-10-alkenyl or C(O)—CR8═CH2,
R8 is H, C1-10-alkyl or C4-8-cycloalkyl,
R9 is H, C1-10-alkyl or C4-8-cycloalkyl
q is 1, 2, 3 or 4
o is 0, 1, 2, 3
q+o<=4,
in case o is 0, R5 is W, O—C1-10-alkylene-W, O-phenylene-W, N(R6)(C1-10-alkylene-W) or N(R6)(phenylene-W),
wherein C1-10-alkylene, can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl, and/or C4-8-cycloalkyl, or interrupted by O or S,
and
(iii) a diamine of formula
wherein
R10 and R11 are the same or different and are H, C1-10-alkyl or C4-8-cycloalkyl
R13 and R14 are the same and different and are C1-10-alkyl, C1-10-haloalkyl,
C4-8-cycloalkyl, phenyl, C2-10-alkenyl or C4-10-cycloalkenyl,
L2 is C1-10-alkylene or phenylene
r is 0, 1, 2, 3 or 4
s is 0, 1, 2, 3 or 4
r+s<=4
in case both r and s are 0 then at least one of R13 and R14 is C2-10-alkenyl or C4-10-cycloalkenyl,
t is 0, 1, 2, 3, 4 or 5
u is 0 or 1
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or C1-10-alkylene can be optionally interrupted by O or S;
and wherein in at least 10 mol-% of the diamines (i), (ii) and/or (iii), at least one substituent R2, R3, R4, R10, R11 is present, which is selected from propyl and butyl, especially from isopropyl and isobutyl and most especially from isopropyl. Preferably, at least 20 mol-% of the diamines, preferably 40 to 100 mol-% of the diamine moieties carry said substituent.
Examples of halogen are fluoro, chloro and bromo.
Examples of C1-10-alkyl are methyl, ethyl, propyl, isopropyl, butyl, sec-butyl, isobutyl, tert-butyl, pentyl, 2-ethylbutyl, hexyl, heptyl, octyl, nonyl and decyl. Examples of propyl and butyl are n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl and tert-butyl.
Examples of C4-8-cycloalkyl are cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl and cyclooctyl.
Examples of C1-10-haloalkyl are trifluoromethyl and pentafluoroethyl.
Examples of C2-10-alkenyl are vinyl, CH2—CH═CH2, CH2—CH2—CH═CH2.
Examples of C4-8-cycloalkenyl are cyclopentyl, cyclohexyl and norbornenyl.
Examples of C1-10-alkylene are methylene, ethylene, propylene, butylene, pentylene, hexylene and heptylene. Examples of C1-4-alkylene are methylene, ethylene, propylene and butylene
Examples of C4-8-cycloalkylene are cyclobutylene, cyclopentylene, cyclohexylene and cycloheptylene.
Examples of C1-4-alkanoic acid are acetic acid, propionic acid and butyric acid.
The diamine of formula (5) is preferred to the diamines of formulae (6) and (8).
Preferred diamines of formula (5) are diamines of formula
wherein
R2, R3 are the same or different and are H, C1-10-alkyl or C4-8-cycloalkyl,
n is 1, 2, 3 or 4
m is 0, 1, 2 or 3
provided that n+m<=4, and further provided that at least 10 mol-% of the diamines (5) carry at least one substituent R2 and/or R3 which is selected from propyl and butyl, especially from isopropyl and isobutyl and most especially from isopropyl;
p is 0, 1, 2, 3 or 4,
L1 is O, S, C1-10-alkylene, phenylene or C(O)
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
Examples of diamines of formula (5a) are
In preferred diamines of formula (5a)
R2, R3 are the same or different and are H, C1-10-alkyl or C4-8-cycloalkyl,
n is 1, 2, 3
m is 0, 1, 2
provided n+m=2, 3 or 4
p is 0, 1, 2, 3 or 4,
L1 is O, S or C1-10-alkylene
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl.
In more preferred diamines of formula (5a)
R2, R3 are the same or different and are C1-10-alkyl or C4-8-cycloalkyl,
n is 1, 2,
m is 0, 1,
provided n+m=2
p is 1,
L1 is O or C1-10-alkylene.
In even more preferred diamines of formula (5a)
R2 is C1-4-alkyl,
n is 2,
p is 1,
L1 is O or C1-4-alkylene.
The most preferred diamines of formula (5a) is the diamine of formula
The diamines of formula (5) are either commercially available or can be prepared by methods known in the art, for example as described for the diamine of formula (5a4) in Oleinik, I. I.; Oleinik, I. V.; Ivanchev, S. S.; Tolstikov, G. G. Russian J. Org. Chem. 2009, 45, 4, 528 to 535. For example, 4,4′-methylen-bis-(2,6-diisopropylaniline) (5a5) may be obtained in good yield according to the scheme:
A preferred diamine of formula (6) is a diamine of formula
wherein
R4 is H, C1-10-alkyl or C4-8-cycloalkyl
R5 is O—C1-10-alkyl, O—C1-10-alkylene-O—C1-10-alkyl, O—C1-10-alkylene-N(C1-10-alkyl)2,
N(C1-10-alkyl)2, O-phenyl, W, O—C1-10-alkylene-W, O-phenylene-W, N(R6)(C1-10-alkylene-W) or N(R6)(phenylene-W),
wherein
R6 is H, C1-10-alkyl, C4-8-cycloalkyl or C1-10-alkylene-W,
W is O—C2-10-alkenyl, N(R7)(C2-10-alkenyl), O—C(O)—CR8═CH2, N(R7)(C(O)—CR8═CH2), or
wherein
R7 is H, C1-10-alkyl, C4-8-cycloalkyl, C2-10-alkenyl or C(O)—CR8═CH2,
R8 is H, C1-10-alkyl or C4-8-cycloalkyl,
R9 is H, C1-10-alkyl or C4-8-cycloalkyl
q is 1, 2, 3 or 4
o is 0, 1, 2, 3
q+o<=4,
in case o is 0, R5 is W, O—C1-10-alkylene-W, O-phenylene-W, N(R6)(C1-10-alkylene-W) or N(R6)(phenylene-W),
wherein C1-10-alkylene, can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl, and/or C4-8-cycloalkyl, or interrupted by O or S.
In preferred diamines of formula 6a
o is 0
R5 is W, O—C1-10-alkylene-W, O-phenylene-W, N(R6)(C1-10-alkylene-W) or N(R6)(phenylene-W),
wherein
R6 is H, C1-10-alkyl, C4-10-cycloalkyl or C1-10-alkylene-W,
W is O—C2-10-alkenyl, N(R7)(C2-10-alkenyl), O—C(O)—CR8═CH2, N(R7)(C(O)—CR8═CH2), or
wherein
R7 is H, C1-10-alkyl, C4-8-cycloalkyl, C2-10-alkenyl or C(O)—CR8═CH2,
R8 is H, C1-10-alkyl or C4-8-cycloalkyl,
R9 is H, C1-10-alkyl or C4-8-cycloalkyl
q is 1 or 2
wherein C1-10-alkylene, can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl, and/or C4-8-cycloalkyl, or interrupted by O or S.
In more preferred diamines of formula 6a
o is 0
R5 is O—C1-10-alkylene-W or O-phenylene-W
wherein
W is O—C2-10-alkenyl, N(R7)(C2-10-alkenyl), O—C(O)—CR8═CH2, N(R7)(C(O)—CR8═CH2), or
wherein
R7 is H, C1-10-alkyl, C4-8-cycloalkyl, C2-10-alkenyl or C(O)—CR8═CH2,
R8 is H, C1-10-alkyl or C4-8-cycloalkyl,
R9 is C1-10-alkyl,
q is 1
wherein C1-10-alkylene, can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl, and/or C4-8-cycloalkyl, or interrupted by O or S.
In most preferred diamines of formula 6a
o is 0
R5 is O—C1-10-alkylene-W or O-phenylene-W
wherein
wherein
R9 is methyl,
q is 1
wherein C1-10-alkylene, can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl, and/or C4-8-cycloalkyl, or interrupted by O or S.
The most preferred diamine of formula 6a are the diamines of formulae
The diamines of formula (6) are either commercially available or can be prepared by methods known in the art. For example, the diamine of formula (6) can be prepared by reacting a dinitrocompound of formula (17) with H—R5, followed by reduction of the nitro groups.
A preferred diamine of formula (8) is the diamine of formula
wherein
R10 and R11 are the same or different and are H, C1-10-alkyl or C4-8-cycloalkyl
R13 and R14 are the same and different and are C1-10-alkyl, C1-10-haloalkyl,
C4-8-cycloalkyl, C2-10-alkenyl, C4-10-cycloalkenyl or phenyl,
L2 is C1-10-alkylene or phenylene
r is 0, 1, 2, 3 or 4
s is 0, 1, 2, 3 or 4
r+s<=4
in case both r and s are 0 then at least one of R13 and R14 is C2-10-alkenyl or C4-10-cycloalkenyl,
t is 0 or an integer from 0 to 50, preferably 0 or an integer from 0 to 25, more preferably 0 or an integer from 1 to 6, most preferably 0 or 1,
u is 0 or 1
wherein C1-10-alkylene, can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl, and/or C4-8-cycloalkyl, or interrupted by O or S.
Preferred diamines of formula (8a) are diamines of formulae
wherein
R10 and R11 are the same or different and are H, C1-10-alkyl or C4-8-cycloalkyl
R13 and R14 are the same and different and are C1-10-alkyl, C4-8-cycloalkyl, C2-10-alkenyl, C4-10-cycloalkenyl or phenyl,
r is 0, 1, 2, 3 or 4
s is 0, 1, 2, 3 or 4
r+s<=4
in case both r and s are 0 then at least one of R13 and R14 is C2-10-alkenyl or C4-10-cycloalkenyl,
and
wherein
R10 and R11 are the same or different and are H, C1-10-alkyl or C4-8-cycloalkyl
R13 and R14 are the same and different and are C1-10-alkyl, C4-8-cycloalkyl, C2-10-alkenyl, C4-10-cycloalkenyl or phenyl
L2 is C1-10-alkylene
r is 0, 1, 2, 3 or 4
s is 0, 1, 2, 3 or 4
r+s<=4
in case both r and s are 0 then at least one of R13 and R14 is C2-10-alkenyl or C4-10-cycloalkenyl,
t is 0 or an integer from 0 to 50, preferably 0 or an integer from 0 to 25, more preferably 0 or an integer from 1 to 6, most preferably 0 or 1,
wherein C1-10-alkylene, can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl, and/or C4-8-cycloalkyl, or interrupted by O or S.
Examples of diamines of formula (8aa) are
An example of a diamine of formula (8ab) is the diamine of formula
Diamines of formula (8) are either commercially available or can be prepared by methods known in the art, for example diamines of formula (8aa) can be prepared as described by Ismail, R. M. Helv. Chim. Acta 1964, 47, 2405 to 2410, examples 12 to 14, for example diamines of formula (8ab) can be prepared as described in EP 0 054 426 A2, for example in examples XXVI and XXVIII.
The mixture of reactants may further comprise other diamines and/or dianhydrides such as at least one dianhydride B and/or at least one diamine B, wherein the dianhydride B may be any aromatic dianhydride B different from dianhydride A and the diamine B can be any primary diamine B different from diamine A.
The dianhydride B is an organic compound carrying two —C(O)—O—C(O)— functionalities.
The diamine B is an organic compound carrying two NH2 functionalities.
In case the polyimide A is a polyimide which is obtainable by reacting a mixture of reactants, which mixture of reactants comprise at least one dianhydride A and/or dianhydride B, and at least one diamine A, wherein the dianhydride A is carrying at least one photosensitive group, and the diamine A is a diamine carrying at least one crosslinkable group, the dianhydride B is a dianhydride carrying no photosensitive group, and the diamine B is a diamine carrying no crosslinkable group, wherein the photosensitive group and the crosslinkable group are as defined above.
Preferably, dianhydride B, which is a dianhydride carrying no photosensitive group, is an organic compound containing at least one aromatic ring and carrying two —C(O)—O—C(O)— functionalities, wherein the two —C(O)—O—C(O)— functionalities are attached to the same or different aromatic rings.
More preferably, the dianhydride B, which is a dianhydride carrying no photosensitive group, is selected from the group consisting of
wherein
R12 is C1-10-alkyl, C1-10-haloalkyl, halogen or phenyl
h is 0, 1, 2 or 3, preferably 0,
Y is a C1-10-alkylene, O or S, preferably Y is CH2 or O.
Even more preferably, the dianhydride B, which is a dianhydride carrying no photosensitive group, is selected from the group consisting of
Most preferably, the dianhydride B, which is a dianhydride carrying no photosensitive group, is
The dianhydride B of formulae (9) to (12) are either commercially available or can be prepared by methods known in the art, for example by treatment of the corresponding tetramethyl derivative with HNO3 at 180° C.
The diamine B, which is a diamine carrying no crosslinkable group, may be selected from the group consisting of
(i) a diamine of formula
wherein
R15 is halogen or O—C1-10-alkyl,
d is 0, 1, 2, 3 or 4
v is 0, 1, 2, 3 or 4,
L3 is a direct bond, O, S, C1-10-alkylene or CO,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S,
(ii) a diamine of formula
wherein
R16 is halogen or O-C1-10-alkyl
R17 is O—C1-10-alkyl, O—C1-10-alkylene-O—C1-10-alkyl, O-phenyl,
O—C1-10-alkylene-N(C1-10-alkyl)2 or N(C1-10-alkyl)2
w is 0, 1, 2 or 3
x is 1, 2, 3, 4
w+x<=4,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S,
(iii) a diamine of formula
wherein
R18 is halogen or O—C1-10-alkyl,
R19 and R20 are the same and different and are C1-10-alkyl, C1-10-haloalkyl or C4-8-cycloalkyl or phenyl,
L3 is C1-10-alkylene or phenylene
y is 0, 1, 2, 3 or 4
z is 0 or 1
a is 0 or an integer from 1 to 50, preferably 0 or an integer from 1 to 25,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S,
and
(iv) a diamine of formula
wherein
R21 and R22 are the same and different and are C1-10-alkyl, C1-10-haloalkyl or C4-8-cycloalkyl,
L4 is C1-10-alkylene, C4-8-cycloalkylene or C4-8-cycloalkylene-Z—C4-8-cycloalkylene,
wherein Z is C1-10-alkylene, S, O or CO
b is 0 or 1
c is 0 or an integer from 1 to 50, preferably, 0 or an integer from 1 to 25, more preferably 0 or an integer from 1 to 6, most preferably 0 or 1
e is 0 or 1
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
Preferably, diamine B, which is a diamine carrying no crosslinkable group, is a diamine of formula (14) or (16).
A preferred diamine of formula (13) a diamine of formula
wherein
R15 is halogen or O—C1-10-alkyl,
d is 0, 1, 2, 3 or 4
v is 0, 1, 2, 3 or 4,
L3 is a direct bond, O, S, C1-10-alkylene or CO,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
Examples of diamines of formula 13a are
In preferred diamines of formula (13a)
d is 0, 1 or 2
v is 1
L3 is 0 or C1-10-alkylene,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by 0.
In more preferred diamines of formula (13a)
d is 0
v is 1
L3 is 0 or methylene,
wherein methylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl.
The diamines of formula (13) are either commercially available or can be prepared by methods known in the art, for example as described in Ingold, C. K.; Kidd, H. V. J. Chem. Soc. 1933, 984 to 988.
A preferred diamine of formula (14) is the diamine of formula
wherein
R16 is halogen or O-C1-10-alkyl
R17 is O—C1-10-alkyl, O—C1-10-alkylene-O—C1-10-alkyl, O-phenyl,
O—C1-10-alkylene-N(C1-10-alkyl)2 or N(C1-10-alkyl)2
w is 0, 1, 2 or 3
x is 1, 2, 3, 4
w+x<=4,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
Examples of diamines of formula (14a) are
In preferred diamines of formula (14a)
R16 is halogen or O—C1-10-alkyl
R17 is O—C1-10-alkyl, O—C1-10-alkylene-O—C1-10-alkyl or O-phenyl
w is 0, 1, 2 or 3
x is 1.
In more preferred diamines of formula (14a)
R16 is halogen or O—C1-10-alkyl
R17 is O—C1-10-alkyl
w is 0, 1 or 2
x is 1.
The most preferred diamines of formula (14a) is the diamine of formula
The diamines of formula (14) are either commercially available or can be prepared by methods known in the art.
For example, the diamine of formula (14) can be prepared by reacting a dinitrocompound of formula (19) with H—R17, followed by reduction of the nitro groups.
Preferred diamines of formula (15) are diamines of formula
wherein
R18 is halogen or O—C1-10-alkyl,
R19 and R20 are the same and different and are C1-10-alkyl, C1-10-haloalkyl or C4-8-cycloalkyl or phenyl,
L3 is C1-10-alkylene or phenylene
y is 0, 1, 2, 3 or 4
z is 0 or 1
a is 0 or an integer from 1 to 50, preferably 0 or an integer from 1 to 25,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
Preferred diamines of formula (15a) are the diamines of formulae
wherein
R18 is halogen or O—C1-10-alkyl,
R19 and R20 are the same and different and are C1-10-alkyl, C4-8-cycloalkyl or phenyl,
y is 0, 1, 2, 3 or 4
and
wherein
R18 is halogen or O—C1-10-alkyl,
R19 and R20 are the same and different and are C1-10-alkyl, C4-8-cyclobutyl or phenyl
L3 is C1-10-alkylene or phenylene,
a is 0 or an integer from 1 to 50, preferably 0 or an integer from 1 to 25,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
Examples of diamines of formula (15aa) are
An example of a diamine of formula (15ab) is
Diamines of formula (15) are either commercially available or can be prepared by methods known in the art, for example diamines of formula (15aa) can be prepared as described by Ismail, R. M. Helv. Chim. Acta 1964, 47, 2405 to 2410, examples 12 to 14, for example diamines of formula (15ab) can be prepared as described in EP 0 054 426 A2, for example in examples XXVI and XXVIII.
Preferred diamines of formula (16) are the diamines of formulae
wherein
e is 0
L4 is C1-10-alkylene, C4-8-cycloalkylene or C4-8-cycloalkylene-Z—C4-8-cycloalkylene,
wherein Z is a direct bond, C1-10-alkylene or O,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
and
wherein
R21 and R22 are the same and different and are C1-10-alkyl,
L4 is C1-10-alkylene, C4-8-cycloalkylene or C4-8-cycloalkylene-Z—C4-8-cycloalkylene,
wherein Z is C1-10-alkylene or O,
e is 1
c is 0 or an integer from 1 to 50, preferably, 0 or an integer from 1 to 25, more preferably 0 or an integer from 1 to 6, most preferably 0 or 1,
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
An example of a diamine of formula (16a) is
Examples of diamines of formula (16b) are
In preferred diamines of formula (16a)
e is 0
L4 is C1-4-alkylene, which C1-4-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl.
In more preferred diamines of formula (16a)
e is 0
L4 is C1-4-alkylene.
The most preferred diamine of formula (16a) is
In preferred diamines of formula (16b)
e is 1
R21 and R22 are the same and different and are C1-10-alkyl,
L4 is C1-10-alkylene,
c is 0 or an integer from 1 to 6
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by O or S.
In more preferred diamines of formula (16b) wherein
e is 1
R21 and R22 are the same and different and are C1-4-alkyl
L4 is C1-4-alkylene
c is 0 or 1
wherein C1-10-alkylene can be optionally substituted with one or more C1-10-alkyl, C1-10-haloalkyl and/or C4-8-cycloalkyl, or interrupted by —O—.
In most preferred diamines of formula (16b) the diamine of formula
e is 1
R21 and R22 are the same and different and are C1-4-alkyl
L4 is C1-4-alkylene
c is 1
The most preferred diamine of formula (16b) is the diamine of formula
Diamines of formula (16) are either commercially available or can be prepared by methods known in the art, for example the diamine of formula (16b1) is commercially available.
The mixture of reactants may further comprise at least one dianhydride C and/or at least one diamine C, wherein the dianhydride C can be any dianhydride different from dianhydride A and dianhydride B, and the diamine C can be any diamine different from diamine A and diamine B.
The dianhydride C is an organic compound carrying two —C(O)—O—C(O)— functionalities.
Preferably, dianhydride C is an organic compound containing at least one aromatic ring and carrying two —C(O)—O—C(O)— functionalities, wherein the two —C(O)—O—C(O)— functionalities are attached to the same or different aromatic rings.
The diamine C is an organic compound carrying two amino functionalities.
Preferably, the mixture of reactants does not comprise a dianhydride, which is an organic compound carrying two —C(O)—O—C(O)— functionalities, wherein the two —C(O)—O—C(O)— functionalities are attached to an aliphatic residue.
Examples of aliphatic residues are alicyclic rings, alkyl or alkylene residue.
Examples of alicyclic rings are C4-8-cycloalkyl, C4-8-cycloalkenyl and C4-8-cycloalkylene.
Examples of alkyl are C1-10-alkyl. Examples of alkylene are C1-10-alkylene.
In particular, the mixture of reactants does not comprise a dianhydride selected from the group consisting of
The mixture of reactants may comprise
from 0.1 to 100% by mol of all dianhydride A based on the sum of moles of all dianhydrides A and B and C
from 0 to 99% by mol of all dianhydride B based on the sum of moles of all dianhydrides A and B and C
from 0 to 99% by mol of all dianhydride C based on the sum of moles of all dianhydrides A and B and C
from 0.1 to 100% by mol of all diamine A based on the sum of moles of all diamines A and B and C
from 0 to 99% by mol of all diamine B based on the sum of moles of all diamines A and B and C
from 0 to 99% by mol of all diamine C based on the sum of moles of all diamines A and B and C,
wherein molar ratio of (dianhydride A and dianhydride B and dianhydride C)/(diamine A and diamine B and diamine C) is in the range of 150/100 to 100/150, preferably, in the range of 130/100 to 100/70, more preferably in the range of 120/100 to 100/80, and most preferably, in the range of 110/100 to 100/90.
Preferably, the mixture of reactants comprises
from 20 to 100% by mol of all dianhydride A based on the sum of moles of all dianhydrides A and B and C
from 0 to 80% by mol of all dianhydride B based on the sum of moles of all dianhydrides A and B and C
from 0 to 80%, by mol of all dianhydride C based on the sum of moles of all dianhydrides A and B and C
from 20 to 100%, by mol of all diamine A based on the sum of moles of all diamines A and B and C
from 0 to 80% by mol of all diamine B based on the sum of moles of all diamines A and B and C
from 0 to 80% by mol of all diamine C based on the sum of moles of all diamines A and B and C,
wherein molar ratio of (dianhydride A and dianhydride B and dianhydride C)/(diamine A and diamine B and diamine C) is in the range of 130/100 to 100/70, more preferably in the range of 120/100 to 100/80, and most preferably, in the range of 110/100 to 100/90.
The mixture of reactants can essentially consist of
from 0.1 to 100% by mol of all dianhydride A based on the sum of moles of all dianhydrides A and B and C
from 0 to 99% by mol of all dianhydride B based on the sum of moles of all dianhydrides A and B and C
from 0 to 99% by mol of all dianhydride C based on the sum of moles of all dianhydrides A and B and C
from 0.1 to 100% by mol of all diamine A based on the sum of moles of all diamines A and B and C
from 0 to 99% by mol of all diamine B based on the sum of moles of all diamines A and B and C
from 0 to 99% by mol of all diamine C based on the sum of moles of all diamines A and B and C,
wherein molar ratio of (dianhydride A and dianhydride B and dianhydride C)/(diamine A and diamine B and diamine C) is in the range of 150/100 to 100/150, preferably, in the range of 130/100 to 100/70, more preferably in the range of 120/100 to 100/80, and most preferably, in the range of 110/100 to 100/90.
Preferably, the mixture of reactants essentially consists of
from 20 to 100% by mol of all dianhydride A based on the sum of moles of all dianhydrides A and B and C
from 0 to 80% by mol of all dianhydride B based on the sum of moles of all dianhydrides A and B and C
from 0 to 80%, by mol of all dianhydride C based on the sum of moles of all dianhydrides A and B and C
from 20 to 100%, by mol of all diamine A based on the sum of moles of all diamines A and B and C
from 0 to 80% by mol of all diamine B based on the sum of moles of all diamines A and B and C
from 0 to 80% by mol of all diamine C based on the sum of moles of all diamines A and B and C,
wherein molar ratio of (dianhydride A and dianhydride B and dianhydride C)/(diamine A and diamine B and diamine C) is in the range of 130/100 to 100/70, more preferably in the range of 120/100 to 100/80, and most preferably, in the range of 110/100 to 100/90.
The glass temperature of the photocurable polyimide A is preferably above 150° C., more preferably above 170° C., and more preferably between 170° C. and 300° C.
The molecular weight of the photocurable polyimide A can be in the range of 5,000 to 1,000,000 g/mol, preferably, in the range of 5,000 to 40,000 g/mol, most preferably in the range of 5,000 to 20,000 g/mol (as determined by gel permeation chromatography).
In polyimide A, the substituents on the aromatic rings preferably are located in orthoposition relative to nitrogen. Thus, an especially preferred polyimide A corresponds to the following formula (II):
wherein
n ranges from about 10 to 100, especially from 10 to 50;
L1 independently is O, S, phenylene or C(O), especially C1-C3alkylene such as CH2;
L2 independently is selected from carbonyl, oxygen, sulphur; especially carbonyl; and each A independently is selected from hydrogen and C1-C4alkyl, provided that at least 2.5% of the residues A, especially 5 to 95% of the residues A in the polyimide A are propyl or butyl, especially isopropyl or isobutyl or sec.butyl or tert.butyl; most especially isopropyl.
The propyl and/or butyl substituted moiety usually makes up at least 5% of the monomer moieties in polyimide A, preferred is a percentage of about 10 to 55% of all monomer moieties in polyimide A. Of special industrial importance is the polyamide A, wherein the propyl and/or butyl substituted ring is part of the diamine moiety, making up about 5 to 95 mol-%, especially about 10 to 90 mol-% of the diamine moieties (such as the diamine core in the above structure I). The remaining diamine moieties may be unsubstituted (e.g. all A of structure II being H) or preferably substituted by methyl and/or ethyl (e.g. at least one A of structure II being methyl or ethyl). Polyimide A preferably is photocurable.
Preferably, polyimide A is applied as a solution in an organic solvent A onto the layer of the device (e.g. transistor, semiconductor layer, electrode etc.) or directly on the substrate.
The organic solvent A can be any solvent (or solvent mixture) that can dissolve at least 2% by weight, preferably at least 5% by weight, more preferably, at least 8% by weight of the photocurable polyimide A based on the weight of the solution of photocurable polyimide A.
As the organic solvent A, generally any solvent may be chosen which has a boiling point (at ambient pressure) from the range of about 80 to 250° C. Solvent A may be a mixture of such solvents. In a preferred process, any component of solvent A has a boiling point from the range 100-220° C., especially 100-200° C. Also of importance are blends using a main solvent (e.g. 70% b.w. or more, such as 95%) having a boiling point around 150° C. (e.g. 120 to 180° C.) and a minor component (30% b.w. or less, such as 5%) having a high boiling point of more than 200° C., e.g. from the range 200-250° C.
Preferably, the organic solvent A is selected from the group consisting of N-methylpyrrolidone, C4-8-cycloalkanone, C1-4-alkyl-C(O)—C1-4-alkyl, C1-4-alkanoic acid C1-4-alkyl ester, wherein the C1-4-alkyl or the C1-4-alkanoic acid can be substituted by hydroxyl or O—C1-4-alkyl, and C1-4-alkyl-O—C1-4-alkylene-O—C1-4-alkylene-O—C1-4-alkyl, and mixtures thereof.
Examples of C1-4-alkyl-C(O)—C1-4-alkyl are ethyl isopropyl ketone, methyl ethyl ketone and methyl isobutyl ketone.
Examples of C1-4-alkanoic acid C1-4-alkyl ester, wherein the C1-4-alkyl or the C1-4-alkanoic acid can be substituted by hydroxyl or O—C1-4-alkyl, are ethyl acetate, butyl acetate, isobutyl acetate, (2-methoxy)ethyl acetate, (2-methoxy)propyl acetate and ethyl lactate.
An example of C1-4-alkyl-O—C1-4-alkylene-O—C1-4-alkylene-O—C1-4-alkyl is diethyleneglycoldimethylether.
More preferably, the organic solvent A is selected from the group consisting of C4-8-cycloalkanone, C1-4-alkyl-C(O)—C1-4-alkyl, C1-4-alkanoic acid C1-4-alkyl ester, wherein the C1-4-alkyl or the C1-4-alkanoic acid can be substituted by hydroxyl or O—C1-4-alkyl, and C1-4-alkyl-O—C1-4-alkylene-O—C1-4-alkylene-O—C1-4-alkyl, and mixtures thereof. Examples are methyl ethyl ketone (b.p. 80° C.), 1,4-dioxane, methyl-isobutyl ketone, butylacetate, 2-hexanone, 3-hexanone, 2-methoxy-1,3-dioxolane, Propylene glycol methyl ether acetate (PGMEA), ethyl lactate, DiGlyme, 5-methyl-3H-furan-2-one (b.p. 169° C. [“alpha-angelica lactone”]), dipropylene glycol dimethyl ether (b.p. 175° C. [ProGlyde DMM]), N-methylpyrrolidone (NMP), gamma-butyrolactone, acetophenone, isophorone, gamma-aprolactone, 1,2-propylene carbonate (b.p. 241° C.); blends of Propylene glycol methyl ether acetate (PGMEA, b.p. 145° C., e.g. 95%) and propylene carbonate (e.g. 5%).
Most preferably, the organic solvent A is selected from the group consisting of C5-6-cycloalkanone, C1-4-alkanoic acid C1-4-alkyl ester, and mixtures thereof. Even most preferably the organic solvent A is cyclopentanone or butyl acetate or mixtures thereof. In particular preferred organic solvents A are butyl acetate or mixtures of butyl acetate and pentanone, wherein the weight ratio of butyl acetate/cyclopentane is at least from 99/1 to 20/80, more preferably from 99/1 to 30/70.
If the photocurable polyimide A is applied as a solution in an organic solvent A on the layer of the transistor or on the substrate, the photocurable polyimide A can be applied by any possible solution process, such as spin-coating, drop-casting or printing.
After applying photocurable polyimide A as a solution in an organic solvent A on the layer of the transistor or on the substrate, a heat treatment at a temperature of below 140° C., for example at a temperature in the range of 60 to 120° C., preferably at a temperature of below 120° C., for example in the range of 60 to 110° C. can be performed.
The layer comprising photocurable polyimide A can have a thickness in the range of 100 to 1000 nm, preferably, in the range of 300 to 1000 nm, more preferably 300 to 700 nm.
The layer comprising photocurable polyimide A can comprise from 50 to 100% by weight, preferably from 80 to 100%, preferably 90 to 100% by weight of photocurable polyimide A based on the weight of the layer comprising photocurable polyimide A. Preferably, the layer comprising photocurable polyimide A essentially consists of photocurable polyimide A.
The layer comprising photocurable polyimide A can be irradiated with any suitable light source providing UV light (e.g. of wavelength 250-400 nm) or light of a wavelength of 360 nm or more (e.g. 360-440 nm), for example with an LED lamp, in order to form the layer comprising polyimide B.
The layer comprising polyimide B can comprise from 50 to 100% by weight, preferably from 80 to 100%, preferably 90 to 100% by weight of polyimide B based on the weight of the layer comprising polyimide B. Preferably, the layer comprising polyimide B essentially consists of polyimide B.
The layer comprising photocurable polyimide B can have a thickness in the range of 100 to 1000 nm, preferably, in the range of 300 to 1000 nm, more preferably 300 to 700 nm.
The irradiation of the layer comprising photocurable polyimide A with UV light (e.g. of wavelength 250-400 nm) or light of a wavelength of 320 nm or more (e.g. 360-440 nm) in order to form the cured layer comprising polyimide B may be performed on only part of the layer comprising photocurable polyimide A, for example by using a mask. If the irradiation performed on only part of the layer comprising photocurable polyimide A, the non-irradiated part of the polyimide may be removed by dissolving it in an organic solvent B, leaving behind a patterned layer comprising polyimide B.
The organic solvent B may be any solvent (or solvent mixture) that can dissolve at least 2% by weight, preferably at least 5% by weight, more preferably, at least 8% by weight of the photocurable polyimide A based on the weight of the solution of photocurable polyimide A.
The organic solvent B advantageously is selected from solvents (or solvent mixtures) having a boiling point (at ambient pressure) of below 180° C., preferably below 150° C., more preferably below 130° C.
Preferably, the organic solvent B is selected from the group consisting of N-methylpyrrolidone, C4-8-cycloalkanone, C1-4-alkyl-C(O)—C1-4-alkyl, C1-4-alkanoic acid C1-4-alkyl ester, wherein the C1-4-alkyl or the C1-4-alkanoic acid can be substituted by hydroxyl or O—C1-4-alkyl, and C1-4-alkyl-O—C1-4-alkylene-O—C1-4-alkylene-O—C1-4-alkyl, and mixtures thereof.
After dissolving the non-irradiated part of photocurable polyimide A in an organic solvent B, a heat treatment at a temperature of below 140° C., for example at a temperature in the range of 60 to 120° C., preferably at a temperature of below 120° C., for example in the range of 60 to 110° C. can be performed.
The transistor on a substrate is preferably a field-effect transistor (FET) on a substrate and more preferably an organic field-effect transistor (OFET) on a substrate.
Usually, an organic field effect transistor comprises a dielectric layer and a semiconducting layer. In addition, on organic field effect transistor usually comprises a gate electrode and source/drain electrodes.
Typical designs of organic field effect transistors are the Bottom-Gate design and the Top-Gate design:
In case of the Bottom-Gate Bottom-Contact (BGBC) design, the gate is on top of the substrate and at the bottom of the dielectric layer, the semiconducting layer is at the top of the dielectric layer and the source/drain electrodes are on top of the semiconducting layer (see typical process in
Another design of a field-effect transistor on a substrate is the Top-Gate Bottom-Contact (TGBC) design: The source/drain electrodes are on top of the substrate and at the bottom of the semiconducting layer, the dielectric layer is on top of the disemiconducting layer and the gate electrode is on top of the dielectric layer. When prepared by solution processing, here the solvents used for dielectrics must be fully orthogonal with respect to the semiconductor (i.e. show good solubility of the dielectric and absolute insolubility of the semiconductor), and additionally compatible with photoresist processing (typically as shown in
The semiconducting layer comprises a semiconducting material. Examples of semiconducting materials are semiconducting materials having p-type conductivity (carrier: holes) and semiconducting materials having n-type conductivity (carrier: electrons).
Examples of semiconductors having n-type conductivity are perylenediimides, naphtalenediimides and fullerenes.
Semiconducting materials having p-type conductivity are preferred. Examples of semiconducting materials having p-type conductivity are molecules such as as rubrene, tetracene, pentacene, 6,13-bis(triisopropylethynyl) pentacene, diindenoperylene, perylenediimide and tetracyanoquinodimethane, and polymers such as polythiophenes, in particular poly 3-hexylthiophene (P3HT), polyfluorene, polydiacetylene, poly 2,5-thienylene vinylene, poly p-phenylene vinylene (PPV) and polymers comprising repeating units having a diketopyrrolopyrrole group (DPP polymers).
Preferably the semiconducting material is a polymer comprising units having a diketopyrrolopyrrole group (DPP polymer).
Examples of DPP polymers and their synthesis are, for example, described in U.S. Pat. No. 6,451,459 B1, WO 2005/049695, WO 2008/000664, WO 2010/049321, WO 2010/049323, WO 2010/108873, WO 2010/115767, WO 2010/136353 and WO 2010/136352.
Preferably, the DPP polymer comprises, preferably essentially consists, of a unit selected from the group consisting of
a polymer unit of formula
a copolymer unit of formula
a copolymer unit of formula
and
a copolymer unit of formula
wherein
n′ is 4 to 1000, preferably 4 to 200, more preferably 5 to 100,
x′ is 0.995 to 0.005, preferably x′ is 0.2 to 0.8,
y′ is 0.005 to 0.995, preferably y′ is 0.8 to 0.2, and
x′+y′=1;
r′ is 0.985 to 0.005,
s′ is 0.005 to 0.985,
t′ is 0.005 to 0.985,
u′ is 0.005 to 0.985, and
r′+s′+t′+u′=1;
A is a group of formula
or a group of formula (24),
with the proviso that in case B, D and E are a group of formula (24), they are different from A, wherein
Preferred polymers are described in WO2010/049321.
Ar1 and Ar1′ are preferably
very preferably
and most preferably
Ar2, Ar2′, Ar3, Ar3′, Ar4 and Ar4′ are preferably
more preferably
The group of formula
is preferably
more preferably
most preferred
R40 and R41 are the same or different and are preferably selected from hydrogen, C1-C100alkyl, more preferably a C8-C36alkyl.
A is preferably selected from the group consisting of
Examples of preferred DPP polymers comprising, preferably consisting essentially of, a polymer unit of formula (20) are shown below:
wherein
R40 and R41 are C1-C36alkyl, preferably C8-C36alkyl, and
n′ is 4 to 1000, preferably 4 to 200, more preferably 5 to 100.
Examples of preferred DPP polymers comprising, preferably consisting essentially of, a copolymer unit of formula (21) are shown below:
wherein
R40 and R41 are C1-C36alkyl, preferably C8-C36alkyl, and
n′ is 4 to 1000, preferably 4 to 200, more preferably 5 to 100.
Examples of preferred DPP polymers comprising, preferably essentially consisting of, a copolymer unit of formula (22) are shown below:
wherein
R40 and R41 are C1-C36alkyl, preferably C8-C36alkyl,
R42 is C1-C18alkyl,
R150 is a C4-C18alkyl group,
X′=0.995 to 0.005, preferably x′=0.4 to 0.9,
y′=0.005 to 0.995, preferably y′=0.6 to 0.1, and
x+y=1.
DPP Polymers comprising, preferably consisting essentially of, a copolymer unit of formula (22-1) are more preferred than DPP polymers comprising, preferably consisting essentially of, a copolymer unit of formula (22-2).
The DPP polymers preferably have a weight average molecular weight of 4,000 Daltons or greater, especially 4,000 to 2,000,000 Daltons, more preferably 10,000 to 1,000,000 and most preferably 10,000 to 100,000 Daltons.
DPP Polymers comprising, preferably consisting essentially of, a copolymer unit of formula (21-1) are particularly preferred. Reference is, for example made to example 1 of WO2010/049321:
The dielectric layer comprises a dielectric material. The dielectric material can be silicium/silicium dioxide, or, preferably, an organic polymer such as poly(methylmethacrylate) (PMMA), poly(4-vinylphenol) (PVP), poly(vinyl alcohol) (PVA), anzocyclobutene (BCB), and polyimide (PI).
Preferably the layer comprising the polyimide B is the dielectric layer.
The substrate can be any suitable substrate such as glass, or a plastic substrate. Preferably the substrate is a plastic substrate such as polyethersulfone, polycarbonate, polysulfone, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN). More preferably, the plastic substrate is a plastic foil.
Also part of the invention is a transistor obtainable by above process.
The advantage of the process for the preparation of a transistor, preferably an organic field effect transistor comprising a layer comprising polyimide B, for example as dielectric layer, is that all steps of the process, and in particular the step of forming the layer comprising the photocurable polyimide A, can be performed at a temperatures below 160° C., preferably below 150°, more preferably below 120° C.
Another advantage of the process of the present invention is that the photocurable polyimide A used is resistant to shrinkage.
Another advantage of the process of the present invention is that the photocurable polyimide A preferably has a glass temperature of at least 150° C., preferably of at least 170° C. Thus, photocurable polyimide A and polyimide B (derived from photocurable polyimide A) show a high chemical and thermal stability. As a consequence, the process of the present invention can be used to prepare, for example, an organic field effect transistor, wherein the layer comprising polyimide B is the dielectric layer, wherein the electrodes on top of the dielectric layer can be structured by an etching process.
Another advantage of the process of the present invention is that the photocurable polyimide A allows the formation of patterns.
Another advantage of the process of the present invention is that photocurable polyimide A is soluble in an organic solvent (solvent A). Preferably, it is possible to prepare a 2% by weight, more preferably a 5% by weight and most preferably a 8% by weight solution of photocurable polyimide A in the organic solvent. Thus, it is possible to apply photocurable polyimide A by solution processing techniques.
Another advantage of the process of the present invention is that the organic solvent used to dissolve photocurable polyimide A
Another advantage of the process of the present invention is that all steps of the process can be performed at ambient atmosphere, which means that no special precautions such as nitrogen atmosphere are necessary.
The advantage of the transistor of the present invention, preferably, wherein the transistor is an organic field effect transistor and wherein the layer comprising polyimide B is the dielectric layer and the semiconducting layer comprises a semiconducting material, for example a diketopyrrolopyrrole (DPP) thiophene polymer, is that the transistor shows a high mobility, a high Ion/Ioff ratio and a low gate leakage.
The following examples illustrate the invention. Wherever noted, room temperature (r.t.) depicts a temperature from the range 22-25° C.; over night means a period of 12 to 15 hours; percentages are given by weight, if not indicated otherwise. Molecular weight is as determined by gel permeation chromatography, if not indicated otherwise.
BTDA 3,3′,4,4′ Benzophenone-tetracarboxylic acid dianhydride
ODPA oxydiphthalic dianhydride
Tg glass transition temperature
b.p. boiling point (at 1 atmosphere pressure)
A 50 ml three-neck flask, equipped with a nitrogen inlet and a mechanical glass stirrer, is flushed with nitrogen and then charged with 4.395 g (10.0 mmol) 4,4′-methylene-bis(2,6-diisopropylaniline) dihydrochloride and 25 ml of anhydrous NMP. After the addition of 2.02 eq. triethylamine to the reaction mixture the colour turns to orange-brown and the reaction mass gets jelly (ammonium salts). After the addition of 3.222 g BTDA (10.0 mmol, 1.0 eq.) the reaction mass is heated to 80° C., stirred for 16 hours at this temperature, then 0.15 g butylamine (0.1 eq., endcapping) are added, stirring is continued for another 6 hours, and then the reaction mixture is cooled to room temperature. After the addition of 3.1 ml of triethylamine and 8.5 ml acetic anhydride, the reaction mixture is stirred for an additional 3 hours and then precipitated in 500 ml water. The polymer is collected by suction filtration, washed with methanol and dried in a vacuum oven at 80° C. for 12 hours. The title polymer is obtained as a creamy coloured powder (6.55 g, 95% yield; Tg=260° C.)).
Further purification can be achieved by ion exchange resins treatment or biphasic extraction processes. Water-free samples can be obtained azeotropic water removal in suited solvents.
When using the free amine of 4,4′-methylene-bis(2,6-diisopropylaniline) in the same synthesis, the resulting polymer remains pink to purple coloured even after several washing and re-precipitation. The resulting photosensitivity of the polymer is lower.
A 8% (weight/weight) solution of polyimide 62 in ethyl lactate/butyl acetate 60/40 (weight/weight) is filtered through a 0.45 μm filter and applied on a clean glass substrate with indium tin oxide (ITO) electrodes by spin coating (2500 rpm, 30 seconds). The wet film is pre-baked at 100° C. for 2 minutes on a hot plate and then photo-cured with a mercury lamp mounted with a filter (wavelength below 320 nm cut, ca. 800 mJ/cm2) to obtain a 500 nm thick layer. Gold electrodes (area=3 mm2) are then vacuum-deposited through a shadow mask on the polyimide 62 layer at <1×10−6 Torr.
The capacitor thus obtained is characterized in the following way:
The relative permittivity ∈r and tg(δ)=∈r″ are deduced from the complex capacity measured with a LCR meter Agilent 4284A (signal amplitude 1 V). Current/Voltage (I/V) curves are obtained with a semiconductor parameter analyser Agilent 4155C. The breakdown voltage is the voltage Ed where the current reaches a value of 1 μA. The volume resistivity p is calculated from the resistance, sample thickness and electrode surface. Results are compiled in table 1.
Gold is sputtered onto poly(ethylene terephthalate) (PET) foil to form an approximately 40 nm thick film and then source/drain electrodes (channel length: 10 μm; channel width: 10 mm) are structured by photolithography process. A 0.75% (weight/weight) solution of the diketopyrrolopyrrole (DPP)-thiophene-polymer 21-1 (structure identified above) in toluene is filtered through a 0.45 μm polytetrafluoroethylene (PTFE) filter and then applied by spin coating (1300 rpm, 10.000 rpm/s, 15 seconds). The wet organic semi-conducting polymer layer is dried at 100° C. on a hot plate for 30 seconds. A 8% (weight/weight) solution of polyimide 62 in ethyl lactate/butyl acetate 60/40 (weight/weight) is filtered through a 0.45 μm filter and then applied by spin coating (2500 rpm, 30 seconds). The wet polyimide film is pre-baked at 100° C. for 2 minutes on a hot plate and then photo-cured with a mercury lamp mounted with a filter (wavelength below 320 nm cut, about 800 mJ/cm2) to obtain a 500 nm thick layer. Gate electrodes of gold (thickness approximately 120 nm) are evaporated through a shadow mask on the polyimide 62 layer. The whole process is performed without a protective atmosphere.
Measurement of the characteristics of the top gate, bottom contact (TGBC) field effect transistors are measured with a Keithley 2612A semiconductor parameter analyser. The drain current Ids in relation to the gate voltage Vgs (transfer curve) for the top-gate, bottom-contact (TGBC) field effect transistor comprising a polyimide 62 gate dielectric at a source voltage Vsd of −1V (squares), respectively, −20V (triangles) is shown in
The top-gate, bottom-contact (TGBC) field effect transistor comprising polyimide 62 shows a mobility of 0.22 cm2/Vs (calculated for the saturation regime) and an Ion/Ioff ratio of 9600.
The drain current Ids in relation to the drain voltage Vds (output curve) for the top-gate, bottom-contact (TGBC) field effect transistor comprising polyimide 62 at a gate voltage Vgs of 0V (stars), −5V (squares), −10V (lozenges), −15V (triangles) and −20V (circles) is shown in
A 100 ml three-neck flask, equipped with a nitrogen inlet and a mechanical glass stirrer, is flushed with nitrogen and then charged with 4.395 g (10.0 mmol) 4,4′-methylene-bis(2,6-diisopropylaniline) dihydrochloride and 50 ml anhydrous NMP. After the addition of 2.02 eq. triethylamine the reaction mixture the colour turns to orange-brown and the reaction mass gets jelly (ammonium salts). After the addition of 6.445 g BTDA (20.0 mmol, 2.0 eq.) the reaction mass is heated to 80° C. and stirred until all BTDA is dissolved. After the addition 3,105 g (10.00 mmol) 4,4′-methylene-bis(2,6-diethylaniline) the reaction mixture is stirred for 16 hours at 80° C., then 0.15 g butylamine (0.1 eq., endcapping) are added, stirring is continued for another 6 hours and then the reaction mixture is cooled to room temperature. After the addition of 6.2 ml triethylamine and 17.0 ml acetic anhydride the reaction mixture is stirred for an additional 3 hours and then precipitated in 100 ml water. The polymer is collected by suction filtration, washed with methanol and tert.butylmethyl ether and dried in a vacuum oven at 80° C. for 12 hours. The title polymer is obtained as a creamy coloured powder (11.80 g, 95% yield; Tg=245° C.).
Further purification can be achieved by ion exchange resins treatment or biphasic extraction processes. Water-free samples can be obtained azeotropic water removal in suited solvents.
If the same synthesis is made with the free amine of 4,4′-methylene-bis(2,6-diisopropylaniline) the resulting polymer is pink to purple coloured and even several washing and re-precipitation steps did not produce a “colourless” sample. The resulting photosensitivity of such polymers is lower.
A 15% (weight/weight) solution of polyimide 32 in ethyl lactate/butyl acetate 60/40 (weight/weight) is filtered through a 0.45 μm filter and applied on a clean glass substrate with indium tin oxide (ITO) electrodes by spin coating (2700 rpm, 30 seconds). The wet film is pre-baked at 100° C. for 2 minutes on a hot plate and then photo-cured with a mercury lamp mounted with a filter (wavelength below 320 nm cut, ca.800 mJ/cm2) to obtain a 485 nm thick layer. Gold electrodes (area=3 mm2) are then vacuum-deposited through a shadow mask on the polyimide 32 layer at <1×10−6 Torr.
The capacitor thus obtained is characterized in the way described in example 1 b. Results are compiled in table 2.
Gold is sputtered onto poly(ethylene terephthalate) (PET) foil to form an approximately 40 nm thick film and then source/drain electrodes (channel length: 10 μm; channel width: 10 mm) are structured by photolithography process. A 0.75% (weight/weight) solution of the diketopyrrolopyrrole (DPP)-thiophene-polymer 21-1 (see above) in toluene is filtered through a 0.45 μm polytetrafluoroethylene (PTFE) filter and then applied by spin coating (1300 rpm, 10.000 rpm/s, 15 seconds). The wet organic semiconducting polymer layer is dried at 100° C. on a hot plate for 30 seconds. A 15% (weight/weight) solution of polyimide 32 in ethyl lactate/butyl acetate 60/40 (weight/weight) is filtered through a 0.45 μm filter and then applied by spin coating (2700 rpm, 30 seconds). The wet polyimide film is pre-baked at 100° C. for 2 minutes on a hot plate and then photo-cured with a mercury lamp mounted with a filter (wavelength below 320 nm cut, about 800 mJ/cm2) to obtain a 470 nm thick layer. Gate electrodes of gold (thickness approximately 120 nm) are evaporated through a shadow mask on the polyimide 32 layer. The whole process is performed without a protective atmosphere.
Measurement of the characteristics of the top gate, bottom contact (TGBC) field effect transistors are measured with a Keithley 2612A semiconductor parameter analyser. The drain current Ids in relation to the gate voltage Vgs (transfer curve) for the top-gate, bottom-contact (TGBC) field effect transistor comprising a polyimide 32 gate dielectric at a source voltage Vsd of −1V (squares), respectively, −20V (triangles) is shown in
The top-gate, bottom-contact (TGBC) field effect transistor comprising polyimide 32 shows a mobility of 0.23 cm2/Vs (calculated for the saturation regime) and an Ion/Ioff ration of 1.6 E+5.
The drain current Ids in relation to the drain voltage Vds (output curve) for the top-gate, bottom-contact (TGBC) field effect transistor comprising polyimide 32 at a gate voltage Vgs of 0V (stars), −5V (squares), −10V (lozenges), −15V (triangles) and −20V (circles) is shown in
A 100 ml three-neck flask, equipped with a nitrogen inlet and a mechanical glass stirrer, is flushed with nitrogen and then charged with 4.395 g (10.0 mmol) 4,4′-methylene-bis(2,6-diisopropylaniline) dihydrochloride and 50 ml anhydrous NMP. After the addition of 2.02 eq. triethylamine the reaction mixture the colour turns to orange-brown and the reaction mass gets jelly (ammonium salts). After the addition of 6,204 g ODPA (20.00 mmol, 2 eq,) the reaction mass is heated to 80° C. and stirred until all ODPA is dissolved. After the addition 3,105 g (10.00 mmol) 4,4′-methylene-bis(2,6-diethylaniline) the reaction mixture is stirred for 16 hours at 80° C., then 0.15 g butylamine (0.1 eq., endcapping) are added, stirring is continued for another 6 hours and then the reaction mixture is cooled to room temperature. After the addition of 6.2 ml triethylamine and 17.0 ml acetic anhydride the reaction mixture is stirred for an additional 3 hours and then precipitated in 1000 ml water. The polymer is collected by suction filtration, washed with methanol and tert.butylmethyl ether and dried in a vacuum oven at 80° C. for 12 hours. The title polymer is obtained as a creamy coloured powder (11.80 g, 95% yield).
Further purification can be achieved by ion exchange resins treatment or biphasic extraction processes. Water-free samples can be obtained azeotropic water removal in suited solvents.
If the same synthesis is made with the free amine of 4,4′-methylene-bis(2,6-diisopropylaniline) the resulting polymer is pink to purple coloured and even several washing and re-precipitation steps did not produce a “colourless” sample.
A 10% (weight/weight) solution of polyimide 08 in butyl acetate is filtered through a 0.45 μm filter and applied on a clean glass substrate with indium tin oxide (ITO) electrodes by spin coating (1100 rpm, 30 seconds). The wet film is pre-baked at 100° C. for 2 minutes on a hot plate to obtain a 550 nm thick layer. Gold electrodes (area=3 mm2) are then vacuum-deposited through a shadow mask on the polyimide 08 layer at <1×10−6 Torr.
The capacitor thus obtained is characterized in the way described in example 1 b above. Results are compiled in table 3.
Gold is sputtered onto poly(ethylene terephthalate) (PET) foil to form an approximately 40 nm thick film and then source/drain electrodes (channel length: 10 μm; channel width: 10 mm) are structured by photolithography process. A 0.75% (weight/weight) solution of the diketopyrrolopyrrole (DPP)-thiophene-polymer 21-1 (see above) in toluene is filtered through a 0.45 μm polytetrafluoroethylene (PTFE) filter and then applied by spin coating (1300 rpm, 10.000 rpm/s, 15 seconds). The wet organic semiconducting polymer layer is dried at 100° C. on a hot plate for 30 seconds. A 15% (weight/weight) solution of polyimide 08 in 2-Methoxy propylacetate is filtered through a 0.45 μm filter and then applied by spin coating (6000 rpm, 60 seconds). The wet polyimide film is pre-baked at 100° C. for 2 minutes on a hot plate for 2 minutes to obtain a 580 nm thick layer. Gate electrodes of gold (thickness approximately 120 nm) are evaporated through a shadow mask on the polyimide 08 layer. The whole process is performed without a protective atmosphere.
Measurement of the characteristics of the top gate, bottom contact (TGBC) field effect transistors are measured with a Keithley 2612A semiconductor parameter analyser. Drain current Ids in relation to the gate voltage Vgs (transfer curve) for the top-gate, bottom-contact (TGBC) field effect transistor comprising a polyimide 08 gate dielectric at a source voltage Vsd of −1V (squares), respectively, −20V (triangles) is shown in
The top-gate, bottom-contact (TGBC) field effect transistor comprising a polyimide 08 shows a mobility of 0.25 cm2/Vs (calculated for the saturation regime) and an Ion/Ioff ration of 8.9 E+4.
The drain current Ids in relation to the drain voltage Vds (output curve) for the top-gate, bottom-contact (TGBC) field effect transistor comprising polyimide 08 at a gate voltage Vgs of 0V (stars), −5V (squares), −10V (lozenges), −15V (triangles) and −20V (circles) is shown in
Polyimide 33 is obtained in analogy to example 2 but using 16.0 mmol of 4,4′-methylene-bis(2,6-diisopropylaniline) dihydrochloride (instead of 10.0 mmol) and 4.0 mmol of 4,4′-methylene-bis(2,6-diethylaniline) instead of 10.00 mmol of 4,4′-methylene-bis(2,6-diethylaniline). The polymer, based on the diamine moieties
in the molar ratio 20:80
is obtained in analogy to example 1 but replacing 4,4′-methylene-bis(2,6-diisopropylaniline) dihydrochloride by 4,4′-methylene-bis(2,6-diethylaniline). Tg=280° C.
is obtained in analogy to example 1 but replacing 4,4′-methylene-bis(2,6-diisopropylaniline) dihydrochloride by 4,4′-methylene-bis(2,6-dimethylaniline).
Solubility in the mixture of ethyl lactate and butyl acetate, which is chosen due to its good compatibility with the device production steps, is summarized in the following table:
| Number | Date | Country | Kind |
|---|---|---|---|
| 12161694.0 | Mar 2012 | EP | regional |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/IB13/52426 | 3/27/2013 | WO | 00 |
| Number | Date | Country | |
|---|---|---|---|
| 61616432 | Mar 2012 | US |
