Structural electrical arrangements for semiconductor devices not otherwise provided for

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for

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Patents Grantslast 30 patents

Information Patent Grant
Chip to chip interconnect beyond sealring boundary
- Patent number 12,308,330
- Issue date May 20, 2025
- Ceremorphic, Inc.
- Robert Wiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having functional patterns in redundant region...
- Patent number 12,300,635
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure and method of fabricating the same
- Patent number 12,300,636
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrating batteries to maintain volatile...
- Patent number 12,287,687
- Issue date Apr 29, 2025
- Arbor Company, LLLP
- Darrel James Guzy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with low loss waveguide interface and method t...
- Patent number 12,288,927
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure
- Patent number 12,288,735
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,283,477
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cumulative sealing structures
- Patent number 12,283,589
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Liang-Chen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrostatic discharge protection cell and antenn...
- Patent number 12,272,658
- Issue date Apr 8, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,272,686
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,266,673
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including image sensor chip, transparent subs...
- Patent number 12,261,181
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Woonbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,261,131
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Tsuneyuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 12,261,132
- Issue date Mar 25, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with riveting structure between two rings and...
- Patent number 12,255,156
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme design for wafer singulation
- Patent number 12,249,580
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,589
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with polymer layer delamination prevention desi...
- Patent number 12,230,593
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with crack-preventing structure
- Patent number 12,230,587
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with edge integrity detection structure
- Patent number 12,216,153
- Issue date Feb 4, 2025
- Avago Technologies International Sales Pte. Limited
- Xiaoming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench MOS rectifier with termination structure
- Patent number 12,218,256
- Issue date Feb 4, 2025
- Diodes Incorporated
- Tao Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench structure for reduced wafer cracking
- Patent number 12,211,805
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna-in-package structure
- Patent number 12,211,773
- Issue date Jan 28, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures
- Patent number 12,205,907
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Bey Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced seal ring structure and method of making the same
- Patent number 12,199,049
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250167140
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE
- Publication number 20250157948
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- MINJUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20250157915
- Publication date May 15, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157917
- Publication date May 15, 2025
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20250157955
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20250157940
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING FOR SINGULATION
- Publication number 20250157858
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SIGNAL INTEGRATION AND THE METHODS OF M...
- Publication number 20250157989
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE SEMICONDUCTOR DEVICE WITH INTEGRATED WAVEGUIDE A...
- Publication number 20250149514
- Publication date May 8, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTING CIRCUIT
- Publication number 20250146967
- Publication date May 8, 2025
- SK HYNIX INC.
- Sun Joo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A TRENCH MOS RECTIFIER WITH A TERMINATION S...
- Publication number 20250151298
- Publication date May 8, 2025
- DIODES INCORPORATED
- Tao Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION DETECTION STRUCTURE
- Publication number 20250140684
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140714
- Publication date May 1, 2025
- SK HYNIX INC.
- Yun Cheol HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132269
- Publication date Apr 24, 2025
- Murata Manufacturing Co., Ltd.
- Shinya MASUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20250125233
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH STRUCTURE FOR REDUCED WAFER CRACKING
- Publication number 20250118684
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118685
- Publication date Apr 10, 2025
- RENESAS ELECTRONICS CORPORATION
- Takashi MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250118665
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Shih CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMIT...
- Publication number 20250111987
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY F...
- Publication number 20250112167
- Publication date Apr 3, 2025
- Intel Corporation
- Kimberly Pierce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105169
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Leu-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250105174
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...
- Publication number 20250105175
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND CHARGED PARTICLE BEAM IRRADIATION APPARATUS
- Publication number 20250095951
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Kazuyuki HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tsv structure and fabricating method of the same
- Publication number 20250087559
- Publication date Mar 13, 2025
- UNITED MICROELECTRONICS CORP.
- Hui-Lin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087601
- Publication date Mar 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A CRACK-STOP RING STRUCTURE
- Publication number 20250087602
- Publication date Mar 13, 2025
- HangZhou HFC semiconductor Corporation
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS

Structural electrical arrangements for semiconductor devices not otherwise provided for

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip to chip interconnect beyond sealring boundary

Semiconductor device having functional patterns in redundant region...

Seal ring structure and method of fabricating the same

Systems and methods for integrating batteries to maintain volatile...

Semiconductor device with low loss waveguide interface and method t...

Through via structure

Method of manufacturing a semiconductor device

Semiconductor device including cumulative sealing structures

Extended seal ring structure on wafer-stacking

Semiconductor die including through substrate via barrier structure...

Method of making electrostatic discharge protection cell and antenn...

Semiconductor structure and manufacturing method of the same

Semiconductor package and method of forming the same

Semiconductor package including image sensor chip, transparent subs...

Semiconductor device and method of manufacturing semiconductor device

Structure and method for sealing a silicon IC

Semiconductor package with riveting structure between two rings and...

Passivation scheme design for wafer singulation

Package structure and methods of manufacturing the same

Semiconductor package

Wafer level package with polymer layer delamination prevention desi...

Semiconductor device with crack-preventing structure

Semiconductor product with edge integrity detection structure

Trench MOS rectifier with termination structure

Trench structure for reduced wafer cracking

Integrated antenna-in-package structure

Semiconductor package and manufacturing method thereof

Seal ring structures

Electronic package and manufacturing method thereof

Advanced seal ring structure and method of making the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE

STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

LASER DICING FOR SINGULATION

SEMICONDUCTOR PACKAGES WITH SIGNAL INTEGRATION AND THE METHODS OF M...

PACKAGE ON PACKAGE SEMICONDUCTOR DEVICE WITH INTEGRATED WAVEGUIDE A...

SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTING CIRCUIT

METHOD OF MANUFACTURING A TRENCH MOS RECTIFIER WITH A TERMINATION S...

DELAMINATION DETECTION STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Integrated Antenna-In-Package Structure

TRENCH STRUCTURE FOR REDUCED WAFER CRACKING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMIT...

SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY F...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...

ELECTRONIC COMPONENT AND CHARGED PARTICLE BEAM IRRADIATION APPARATUS

Tsv structure and fabricating method of the same

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP HAVING A CRACK-STOP RING STRUCTURE