BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A and 1B are views showing a junction structure of a printed circuit board according to an embodiment of the present invention, in which FIG. 1A is a top view of the junction structure, and FIG. 1B is a cross-sectional view of the same;
FIGS. 2A and 2B are views of the printed circuit board in FIGS. 1A and 1B in an unjoined state, in which FIG. 2A is a top view of the printed circuit board, and FIG. 2B is a cross-sectional view of the same;
FIGS. 3A to 3D constitute a process diagram showing a method of forming a solder resist;
FIGS. 4A and 4B are views showing an example of a first junction structure of a conventional printed circuit board, in which FIG. 4A is a top view of the junction structure, and FIG. 4B is a cross-sectional view of the same;
FIGS. 5A and 5B are views of a junction structure of a printed circuit board in which the flexible printed circuit board 4 in FIGS. 4A and 4B is in the soldered state, in which FIG. 5A is a top view of the flexible printed circuit board 4, and FIG. 5B is a bottom view of the same;
FIGS. GA and 6B are views showing the shapes of copper foil traces on a flexible printed circuit board in a second junction structure of a conventional printed circuit board, in which FIG. 6A is a top view of the second juncture structure, and FIG. 6B is a bottom view of the same;
FIGS. 7A and 7B are top views of a third junction structure of a conventional printed circuit board in an unsoldered state, in which FIG. 7A shows a rigid printed circuit board, and FIG. 7B shows a double-sided flexible printed circuit board.
Patent Application
20070184675
