Claims
- 1. A printed circuit board which comprises a laminate of:
- (A) a thin-wall body having a thickness of from 0.2 .mu.m to less than 5 mm and containing a cross-linked product of a mixture of (a) 1 to 99 wt% of an ethylenic copolymer (A) comprised of 30 to 99.5 wt% of ethylene, and an oxirane ring-containing compound having at least one double bond and having 6 to 30 carbon atoms, and wherein the content of said oxirane ring-containing compound in the ethylenic copolymer (A) is from 0.1 to 70 wt% and (b) 99 to 1 wt % of an ethylenic copolymer (B) comprised of 30 to 99.5 wt % of an ethylene, and a comonomer selected from the group consisting of unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated dicarboxylic acid anhydrides, and half esters of unsaturated dicarboxylic acids and wherein the total content of said comonomer in the ethylenic copolymer (B) is from 0.1 to 70 wt %; and
- (B) an electrically conductive metal layer having a thickness of from 100 .ANG. to 400 .mu.m.
- 2. A printed circuit board as in claim 1, which further comprises
- (C) a thermosetting resin layer having a thickness of from 0.6 to 4 mm, and the electrically conductive metal layer and the themosetting layer are laminated via the thin-wall body between the electrically conductive metal layer (B) and the thermosetting layer (C).
- 3. A printed circuit board as in claim 1, which further comprises
- (D) a heat-resistant thermoplastic polymer layer having a glass transition temperature of 100.degree. to 400.degree. C. and a thickness of from 20 .mu.m to 2 mm; and the electrically conductive metal layer and the heat resistant polymer layer are laminated via the thin-wall body between the electrically conductive metal layer (B) and the heat resistant polymer layer (D).
- 4. A printed circuit board as in claim 1, which further comprises
- (E) an electrically conductive metal layer having a thickness of from 5 .mu.m to 3 mm; and said electrically conductive metal layers (B) and (E) are laminated via the thin-wall body between said electrically conductive metal layers (B) and (E).
- 5. A printed circuit board as in claim 1, which further comprises at least one layer of a glass cloth or mat (F), an aramid fiber sheet (G) and a ceramic sheet (H) and wherein the thin-wall body is between said electrically conductive metal layer (B) and said at least one layer (F), (G) or (H).
- 6. A printed circuit board as in claim 1, wherein the ethylenic copolymer (A) is a copolymer of ethylene and an oxirane ring-containing compound represented by formulae (I) to (III) ##STR20## wherein R.sup.1, R.sup.5 and R.sup.8 which may be the same or different, each represents a hydrogen atom or a methyl group, R.sup.2, R.sup.6 and R.sup.7 which may also be the same or different, each represents a straight chain or branched chain alkylene group having 1 to 12 carbon atoms, R.sup.3 and R.sup.4 each represents a straight chain or branched chain alkyl group having up to 12 carbon atoms and a straight chain or branched chain alkyl group having 2 to 12 carbon atoms and having an oxirane group at the terminal, provided that at least one of R.sup.3 and R.sup.4 has the alkyl group having an oxirane group, and n is 0 or 1; or a copolymer of ethylene, the oxirane ring-containing compound and a comonomer (3) selected from the group consisting of unsaturated carboxylic acid esters containing up to 30 carbon atoms and vinyl esters containing up to 30 carbon atoms.
- 7. A printed circuit board as in claim 1, wherein the ethylenic copolymer (B) is (i) a copolymer of ethylene and at least one comonomer (2) selected from the group consisting of unsaturated monocarboxylic acids containing up to 25 carbon atoms, unsaturated dicarboxylic acids containing 4 to 50 carbon atoms and anhydrides of the unsaturated dicarboxylic acids; (ii) a copolymer of ethylene, the comonomer (2) and a comonomer (3) selected from the group consisting of unsaturated carboxylic acid ester containing up to 30 carbon atoms and vinyl esters containing up to 30 carbon atoms; or (iii) products obtained by hydrolysis or alcohol modification of the copolymer (i) or (ii) having the acid anhydride group.
- 8. A printed circuit board as in claim 1, wherein the mixing ratio of the ethylenic copolymer (A) to the ethylenic copolymer (B) is from 10/90 to 90/10 by weight.
- 9. A printed circuit board as in claim 1, wherein the content of said oxirane ring-containing compound in the ethylenic copolymer (A) is from 0.5 to 40 wt %, and the total content of said comonomer in the ethylenic copolymer (B) is from 0.5 to 40 wt%.
Priority Claims (3)
Number |
Date |
Country |
Kind |
60-149193 |
Jul 1985 |
JPX |
|
61-20267 |
Feb 1986 |
JPX |
|
61-24089 |
Feb 1986 |
JPX |
|
CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation-in-part application of an earlier-filed application serial No. 875.034 filed June 16, 1986, entitled "MOLDED PRODUCT HAVING PRINTED CIRCUIT BOARD."
US Referenced Citations (7)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
875034 |
Jun 1986 |
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