| IBM Technical Disclosure Bulletin, AC Interconnect Test With Series Boundary Scan by P.K. Graham; vol. 34 No. 6, Nov. 1991, pp. 325-330. |
| IBM Technical Disclosure Bulletin, Method and Design for Applying Stuck Faults in an LSSD Boundary Scan Environment by S.M. Douskey; vol. 34 No. 10B, Mar. 1992, pp. 444-446. |
| IBM Technical Disclosure Bulletin, Method to Verify Chip-To-Chip Interconnect Within a Hardware System by L.B. Arimilli, J.I. Barreh & R.T. Golla; vol. 36 No. 06A, Jun. 1993, p. 437. |
| IBM Technical Disclosure Bulletin, Open-Short Circuit Self Test by A.L. Chin & L.D. Nguyen; vol. 36 No. 06B, Jun. 1993, pp. 145-146. |
| IBM Technical Disclosure Bulletin, Boundary Walking Sequences for Circuit Board Interconnect Test by J.C. Chan, W.T. Chen & S. Pan; vol. 36 No. 11, Nov. 1993, pp. 19-22. |
| IBM Technical Disclosure Bulletin, New Algorithm for Identification of Interconnect Wiring Defects by J.C. Chan, W.T. Chen & S. Pan; vol. 36 No. 11, Nov. 1993, pp. 621-622. |