Claims
- 1. A process for producing a heat sink fin that is a monolithic combination of a base portion for receiving heat from a heat conducting plate and a plurality of heat dissipating pins of a predetermined height extending in parallel from the base portion comprising simultaneously running a plurality of wires along a plurality of rows, the wires being stretched in the X- and Y-directions each on a pitch which is the same as a gap between two neighboring heat dissipating pins with a level difference being provided between the wires stretched in the X-direction and the wires stretched in the Y-direction, urging said plurality of wires against a surface of a workpiece until said plurality of wires reaching said predetermined height while supplying an abrasive slurry containing an abrasive powder between said plurality of wires and said workpiece, thereby simultaneously forming a plurality of pins in the X- and Y-directions, in which the pins form said heat dissipating pins, and a portion of said workpiece remaining unworked forms said base portion of said heat sink fin.
- 2. A process according to claim 1, wherein the wires run one way each in the X- and Y-directions.
- 3. A process according to claim 1, wherein the pitch is no more than 1 mm.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3-286769 |
Oct 1991 |
JPX |
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Parent Case Info
This application is a divisional of application Ser. No. 07/968,359, filed Oct. 29, 1992, now abandoned.
US Referenced Citations (19)
Foreign Referenced Citations (9)
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EPX |
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EPX |
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EPX |
542478 |
May 1993 |
EPX |
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JPX |
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JPX |
100361 |
May 1986 |
JPX |
A-2204181 |
Nov 1988 |
GBX |
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WOX |
Non-Patent Literature Citations (2)
Entry |
Chao et al., Eight Annual IEEE Semiconductor Thermal Measurement And Management Symposium, Feb. 1992, pp. 97-100. |
Electronics International, "Grooved Substrate Boosts IC Cooling," S. W. Fields, vol. 55, No. 17, Aug. 1982, pp. 46-48. |
Divisions (1)
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Number |
Date |
Country |
Parent |
968359 |
Oct 1992 |
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