Claims
- 1. A process for producing a semiconductor device comprising sealing a semiconductor chip with a resin tablet having a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm which is obtained by cooling and solidifying a molten resin composition, by transfer molding.
- 2. A process as claimed in claim 1, wherein the resin tablet comprises a resin composition comprising a resin, a filler and a curing agent.
- 3. A process as claimed in claim 1, wherein the resin composition is an epoxy resin composition.
- 4. A process as claimed in claim 1, wherein the resin tablet comprises less than 0.05% by weight, based on the entire weight of the tablet of fine powders adhered to said resin tablet, and wherein said fine powders have a mesh size of 250 or smaller.
- 5. A process as claimed in claim 1, wherein said tablet has a water content of less than 0.1% by weight.
- 6. A process as claimed in claim 1, wherein said tablet has an outer diameter of not more than 20 mm and a length to outer ratio of not less than 1.
- 7. A process as claimed in claim 1, wherein said tablet has an outer diameter of not less than 20 mm and a length to outer diameter ratio of not more than 1.
- 8. A process as claimed in claim 1, wherein said tablet is composed of a plurality of tablets, laminated by adhesion or fusion, each having an outer diameter of not less than 20 mm and a length to outer diameter ratio of not more than 1.
- 9. A process as claimed in claim 1, wherein said tablet is a hollow tablet having an outer diameter of not less than 20 mm and an inner diameter of not more than 20 mm, said outer diameter and said inner diameter not simultaneously being 20 mm.
Priority Claims (2)
Number |
Date |
Country |
Kind |
3-81696 |
Mar 1991 |
JPX |
|
3-349648 |
Dec 1991 |
JPX |
|
CROSS REFERENCE TO THE RELATED APPLICATION
This is a divisional of application Ser. No. 08/328,953 filed Oct. 24, 1994, which is a continuation of application Ser. No. 07/978,439, filed Nov. 18, 1992, now abandoned, which is a continuation-in-part-application of International Application No. PCT/JP92/00345, filed Mar. 19, 1992, entitled "RESIN TABLET FOR SEMICONDUCTOR SEALING, AND PROCESS FOR PRODUCING THE SAME".
US Referenced Citations (2)
Foreign Referenced Citations (15)
Number |
Date |
Country |
5631004 |
Mar 1981 |
JPX |
58-53145 |
Apr 1983 |
JPX |
59-7009 |
Jan 1984 |
JPX |
60-040214 |
Mar 1985 |
JPX |
60-251633 |
Dec 1985 |
JPX |
61-035908 |
Feb 1986 |
JPX |
61-40353 |
Feb 1986 |
JPX |
61-177210 |
Aug 1986 |
JPX |
61-270121 |
Nov 1986 |
JPX |
63-51108 |
Mar 1988 |
JPX |
63-54468 |
Mar 1988 |
JPX |
1129424 |
May 1989 |
JPX |
02171217 |
Jul 1990 |
JPX |
2171220 |
Jul 1990 |
JPX |
35103 |
Jan 1991 |
JPX |
Non-Patent Literature Citations (2)
Entry |
JP 61-035908, Abstract #86-035808, Japan Patent Information Organization (JAPIO), Tokyo, Japan (1988). |
JP 61-035908, Abstract #86-090636, Derwent, Inc., McClean, VA. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
328953 |
Oct 1994 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
978439 |
Nov 1992 |
|